Transistors - FETs, MOSFETs - Single

Image Part Number Description / PDF Quantity Rfq
SQ2389ES-T1_BE3

SQ2389ES-T1_BE3

Vishay / Siliconix

MOSFET P-CH 40V 4.1A SOT23-3

2987

SI4100DY-T1-E3

SI4100DY-T1-E3

Vishay / Siliconix

MOSFET N-CH 100V 6.8A 8SO

10617

SI7434DP-T1-GE3

SI7434DP-T1-GE3

Vishay / Siliconix

MOSFET N-CH 250V 2.3A PPAK SO-8

635

IRFBC30SPBF

IRFBC30SPBF

Vishay / Siliconix

MOSFET N-CH 600V 3.6A D2PAK

0

SIHP28N65EF-GE3

SIHP28N65EF-GE3

Vishay / Siliconix

MOSFET N-CH 650V 28A TO220AB

998

SQM100N10-10_GE3

SQM100N10-10_GE3

Vishay / Siliconix

MOSFET N-CH 100V 100A TO263

518

SIR680ADP-T1-RE3

SIR680ADP-T1-RE3

Vishay / Siliconix

MOSFET N-CH 80V 30.7A/125A PPAK

972

IRLIZ34GPBF

IRLIZ34GPBF

Vishay / Siliconix

MOSFET N-CH 60V 20A TO220-3

1109

IRF840ALPBF

IRF840ALPBF

Vishay / Siliconix

MOSFET N-CH 500V 8A I2PAK

846

IRL630PBF

IRL630PBF

Vishay / Siliconix

MOSFET N-CH 200V 9A TO220AB

849

SIHB15N65E-GE3

SIHB15N65E-GE3

Vishay / Siliconix

MOSFET N-CH 650V 15A TO263

0

IRF840BPBF

IRF840BPBF

Vishay / Siliconix

MOSFET N-CH 500V 8.7A TO220AB

162

SQD70140EL_GE3

SQD70140EL_GE3

Vishay / Siliconix

MOSFET N-CH 100V 30A TO252AA

13

SIB422EDK-T1-GE3

SIB422EDK-T1-GE3

Vishay / Siliconix

MOSFET N-CH 20V 9A PPAK SC75-6

415

SIUD406ED-T1-GE3

SIUD406ED-T1-GE3

Vishay / Siliconix

MOSFET N-CH 30V 500MA PPAK 0806

9783

SI4423DY-T1-GE3

SI4423DY-T1-GE3

Vishay / Siliconix

MOSFET P-CH 20V 10A 8SO

0

IRLR120

IRLR120

Vishay / Siliconix

MOSFET N-CH 100V 7.7A DPAK

0

IRF840SPBF

IRF840SPBF

Vishay / Siliconix

MOSFET N-CH 500V 8A D2PAK

458

SQD50N04-5M6_GE3

SQD50N04-5M6_GE3

Vishay / Siliconix

MOSFET N-CH 40V 50A TO252AA

1912

SI7636DP-T1-E3

SI7636DP-T1-E3

Vishay / Siliconix

MOSFET N-CH 30V 17A PPAK SO-8

2852

Transistors - FETs, MOSFETs - Single

1. Overview

Field-Effect Transistors (FETs) and Metal-Oxide-Semiconductor FETs (MOSFETs) are voltage-controlled semiconductor devices that regulate current flow through an electric field. As fundamental components in modern electronics, they offer advantages such as high input impedance, low power consumption, and fast switching capabilities. Single discrete FETs/MOSFETs are widely used in power management, signal amplification, and switching applications across industries.

2. Main Types and Functional Classification

TypeFunctional CharacteristicsApplication Examples
Junction FET (JFET)Voltage-controlled depletion mode operation, low noiseLow-noise amplifiers, analog switches
Enhancement Mode MOSFETNormally-off device, requires positive VGS to conductPower supplies, motor drives
Depletion Mode MOSFETNormally-on device, requires negative VGS to blockRadio frequency amplifiers, load switches
Insulated Gate Bipolar Transistor (IGBT)Combines MOSFET input with bipolar output, high current capacityHigh-power industrial equipment, electric vehicles

3. Structure and Composition

A typical MOSFET structure includes three terminals: Source, Gate, and Drain. The gate is insulated by a thin layer of silicon dioxide (SiO2), forming a capacitive control interface. The channel between source and drain is formed in a silicon substrate. Advanced devices use materials like silicon carbide (SiC) or gallium nitride (GaN) for higher performance. Packaging options include TO-220, DPAK, and SOT-23 for different thermal and space requirements.

4. Key Technical Specifications

ParameterDescription and Importance
VDS (Drain-Source Voltage)Maximum voltage rating between drain and source; determines breakdown tolerance
ID (Drain Current)Maximum continuous current capacity; critical for power handling
RDS(on)On-state resistance; impacts conduction losses and efficiency
VGS(th) (Threshold Voltage)Voltage required to form channel; determines control signal compatibility
QG (Gate Charge)Charge required for switching; affects switching speed and driver requirements
PD (Power Dissipation)Maximum power handling capability; dictates thermal management needs

5. Application Fields

  • Consumer Electronics: Mobile phone chargers, notebook power adapters
  • Industrial: Motor drives, uninterruptible power supplies (UPS)
  • Automotive: Electric vehicle (EV) battery management systems, HEV inverters
  • Telecommunications: Base station power amplifiers, optical network transceivers
  • Renewable Energy: Solar micro-inverters, wind turbine converters

6. Leading Manufacturers and Products

ManufacturerRepresentative ProductKey Features
Texas InstrumentsCSD18534Q5A60V, 4.2m RDS(on), automotive-grade
STMicroelectronicsSTP55NF0655A, 60V, high-speed switching
Infineon TechnologiesIPB041N06N30.41 , 600V, TO-220 package
ON SemiconductorNDS355ANDepletion mode, 300mA, RF applications

7. Selection Guidelines

Key considerations include:

  • Voltage and current requirements under operating conditions
  • Thermal performance (RDS(on), package thermal resistance)
  • Switching speed vs. conduction loss trade-off
  • Gate drive compatibility with control circuitry
  • Environmental factors (temperature, vibration, humidity)
  • Cost-performance balance for volume production

8. Industry Trends

Current trends include:

  • Adoption of wide bandgap materials (SiC, GaN) for higher efficiency
  • Advanced packaging technologies (double-sided cooling, copper clip)
  • Integration with gate drivers and protection circuits
  • Miniaturization through trench and shielded gate structures
  • Development of automotive-qualified devices for EVs and ADAS

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