Transistors - FETs, MOSFETs - Single

Image Part Number Description / PDF Quantity Rfq
SIHB100N60E-GE3

SIHB100N60E-GE3

Vishay / Siliconix

MOSFET N-CH 600V 30A D2PAK

987

SI1031X-T1-GE3

SI1031X-T1-GE3

Vishay / Siliconix

MOSFET P-CH 20V 155MA SC75A

0

SI9435BDY-T1-GE3

SI9435BDY-T1-GE3

Vishay / Siliconix

MOSFET P-CH 30V 4.1A 8SO

143

IRFU320PBF

IRFU320PBF

Vishay / Siliconix

MOSFET N-CH 400V 3.1A TO251AA

53

SQ7414AEN-T1_BE3

SQ7414AEN-T1_BE3

Vishay / Siliconix

MOSFET N-CH 60V 5.6A PPAK 1212-8

2910

SUM90N03-2M2P-E3

SUM90N03-2M2P-E3

Vishay / Siliconix

MOSFET N-CH 30V 90A TO263

708

SIHB12N60E-GE3

SIHB12N60E-GE3

Vishay / Siliconix

MOSFET N-CH 600V 12A D2PAK

112

SI7465DP-T1-E3

SI7465DP-T1-E3

Vishay / Siliconix

MOSFET P-CH 60V 3.2A PPAK SO-8

22838

SIHFPS40N50L-GE3

SIHFPS40N50L-GE3

Vishay / Siliconix

POWER MOSFET SUPER-247, 100 M @

0

IRFBC20STRLPBF

IRFBC20STRLPBF

Vishay / Siliconix

MOSFET N-CH 600V 2.2A D2PAK

798

SI7469ADP-T1-RE3

SI7469ADP-T1-RE3

Vishay / Siliconix

MOSFET P-CH 80V 7.4A/46A PPAK

50

SI7434ADP-T1-RE3

SI7434ADP-T1-RE3

Vishay / Siliconix

MOSFET N-CH 250V 3.7A/12.3A PPAK

2752

IRF9Z24PBF

IRF9Z24PBF

Vishay / Siliconix

MOSFET P-CH 60V 11A TO220AB

379

SIHP10N40D-E3

SIHP10N40D-E3

Vishay / Siliconix

MOSFET N-CH 400V 10A TO220AB

1000

SI4668DY-T1-GE3

SI4668DY-T1-GE3

Vishay / Siliconix

MOSFET N-CH 25V 16.2A 8SO

0

SI2314EDS-T1-GE3

SI2314EDS-T1-GE3

Vishay / Siliconix

MOSFET N-CH 20V 3.77A SOT23-3

0

SIHFR320-GE3

SIHFR320-GE3

Vishay / Siliconix

MOSFET N-CH 400V 3.1A DPAK

0

SIHB22N60E-E3

SIHB22N60E-E3

Vishay / Siliconix

MOSFET N-CH 600V 21A D2PAK

368

SISS63DN-T1-GE3

SISS63DN-T1-GE3

Vishay / Siliconix

MOSFET P-CH 20V 35.1/127.5A PPAK

55673

SQS401EN-T1_BE3

SQS401EN-T1_BE3

Vishay / Siliconix

MOSFET P-CH 40V 16A PPAK1212-8

8990

Transistors - FETs, MOSFETs - Single

1. Overview

Field-Effect Transistors (FETs) and Metal-Oxide-Semiconductor FETs (MOSFETs) are voltage-controlled semiconductor devices that regulate current flow through an electric field. As fundamental components in modern electronics, they offer advantages such as high input impedance, low power consumption, and fast switching capabilities. Single discrete FETs/MOSFETs are widely used in power management, signal amplification, and switching applications across industries.

2. Main Types and Functional Classification

TypeFunctional CharacteristicsApplication Examples
Junction FET (JFET)Voltage-controlled depletion mode operation, low noiseLow-noise amplifiers, analog switches
Enhancement Mode MOSFETNormally-off device, requires positive VGS to conductPower supplies, motor drives
Depletion Mode MOSFETNormally-on device, requires negative VGS to blockRadio frequency amplifiers, load switches
Insulated Gate Bipolar Transistor (IGBT)Combines MOSFET input with bipolar output, high current capacityHigh-power industrial equipment, electric vehicles

3. Structure and Composition

A typical MOSFET structure includes three terminals: Source, Gate, and Drain. The gate is insulated by a thin layer of silicon dioxide (SiO2), forming a capacitive control interface. The channel between source and drain is formed in a silicon substrate. Advanced devices use materials like silicon carbide (SiC) or gallium nitride (GaN) for higher performance. Packaging options include TO-220, DPAK, and SOT-23 for different thermal and space requirements.

4. Key Technical Specifications

ParameterDescription and Importance
VDS (Drain-Source Voltage)Maximum voltage rating between drain and source; determines breakdown tolerance
ID (Drain Current)Maximum continuous current capacity; critical for power handling
RDS(on)On-state resistance; impacts conduction losses and efficiency
VGS(th) (Threshold Voltage)Voltage required to form channel; determines control signal compatibility
QG (Gate Charge)Charge required for switching; affects switching speed and driver requirements
PD (Power Dissipation)Maximum power handling capability; dictates thermal management needs

5. Application Fields

  • Consumer Electronics: Mobile phone chargers, notebook power adapters
  • Industrial: Motor drives, uninterruptible power supplies (UPS)
  • Automotive: Electric vehicle (EV) battery management systems, HEV inverters
  • Telecommunications: Base station power amplifiers, optical network transceivers
  • Renewable Energy: Solar micro-inverters, wind turbine converters

6. Leading Manufacturers and Products

ManufacturerRepresentative ProductKey Features
Texas InstrumentsCSD18534Q5A60V, 4.2m RDS(on), automotive-grade
STMicroelectronicsSTP55NF0655A, 60V, high-speed switching
Infineon TechnologiesIPB041N06N30.41 , 600V, TO-220 package
ON SemiconductorNDS355ANDepletion mode, 300mA, RF applications

7. Selection Guidelines

Key considerations include:

  • Voltage and current requirements under operating conditions
  • Thermal performance (RDS(on), package thermal resistance)
  • Switching speed vs. conduction loss trade-off
  • Gate drive compatibility with control circuitry
  • Environmental factors (temperature, vibration, humidity)
  • Cost-performance balance for volume production

8. Industry Trends

Current trends include:

  • Adoption of wide bandgap materials (SiC, GaN) for higher efficiency
  • Advanced packaging technologies (double-sided cooling, copper clip)
  • Integration with gate drivers and protection circuits
  • Miniaturization through trench and shielded gate structures
  • Development of automotive-qualified devices for EVs and ADAS

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