Transistors - FETs, MOSFETs - Single

Image Part Number Description / PDF Quantity Rfq
SIS176LDN-T1-GE3

SIS176LDN-T1-GE3

Vishay / Siliconix

N-CHANNEL 70 V (D-S) MOSFET POWE

50

SI4483ADY-T1-GE3

SI4483ADY-T1-GE3

Vishay / Siliconix

MOSFET P-CH 30V 19.2A 8SO

12367

SIHU6N62E-GE3

SIHU6N62E-GE3

Vishay / Siliconix

MOSFET N-CH 620V 6A IPAK

2874

IRFP26N60LPBF

IRFP26N60LPBF

Vishay / Siliconix

MOSFET N-CH 600V 26A TO247-3

87

SI7655ADN-T1-GE3

SI7655ADN-T1-GE3

Vishay / Siliconix

MOSFET P-CH 20V 40A PPAK1212-8S

8976

SI7119DN-T1-E3

SI7119DN-T1-E3

Vishay / Siliconix

MOSFET P-CH 200V 3.8A PPAK1212-8

74

SIHD6N62E-GE3

SIHD6N62E-GE3

Vishay / Siliconix

MOSFET N-CH 620V 6A DPAK

2987

SI4630DY-T1-E3

SI4630DY-T1-E3

Vishay / Siliconix

MOSFET N-CH 25V 40A 8SO

840

SIHG22N60EF-GE3

SIHG22N60EF-GE3

Vishay / Siliconix

MOSFET N-CH 600V 19A TO247AC

533

SI7117DN-T1-GE3

SI7117DN-T1-GE3

Vishay / Siliconix

MOSFET P-CH 150V 2.17A PPAK

2700

IRFI640GPBF

IRFI640GPBF

Vishay / Siliconix

MOSFET N-CH 200V 9.8A TO220-3

47

IRFPS40N50LPBF

IRFPS40N50LPBF

Vishay / Siliconix

MOSFET N-CH 500V 46A SUPER247

938

SI3456DDV-T1-E3

SI3456DDV-T1-E3

Vishay / Siliconix

MOSFET N-CH 30V 6.3A 6TSOP

2957

IRFR210TRPBF-BE3

IRFR210TRPBF-BE3

Vishay / Siliconix

MOSFET N-CH 200V 2.6A DPAK

2000

SIHJ10N60E-T1-GE3

SIHJ10N60E-T1-GE3

Vishay / Siliconix

MOSFET N-CH 600V 10A PPAK SO-8

1535

SIS402DN-T1-GE3

SIS402DN-T1-GE3

Vishay / Siliconix

MOSFET N-CH 30V 35A PPAK1212-8

24

SIS888DN-T1-GE3

SIS888DN-T1-GE3

Vishay / Siliconix

MOSFET N-CH 150V 20.2A PPAK

3097

SIHU3N50D-E3

SIHU3N50D-E3

Vishay / Siliconix

MOSFET N-CH 500V 3A TO251AA

0

SI3483CDV-T1-GE3

SI3483CDV-T1-GE3

Vishay / Siliconix

MOSFET P-CH 30V 8A 6TSOP

331105

SIDR668ADP-T1-RE3

SIDR668ADP-T1-RE3

Vishay / Siliconix

MOSFET N-CH 100V 23.3A/104A PPAK

5626

Transistors - FETs, MOSFETs - Single

1. Overview

Field-Effect Transistors (FETs) and Metal-Oxide-Semiconductor FETs (MOSFETs) are voltage-controlled semiconductor devices that regulate current flow through an electric field. As fundamental components in modern electronics, they offer advantages such as high input impedance, low power consumption, and fast switching capabilities. Single discrete FETs/MOSFETs are widely used in power management, signal amplification, and switching applications across industries.

2. Main Types and Functional Classification

TypeFunctional CharacteristicsApplication Examples
Junction FET (JFET)Voltage-controlled depletion mode operation, low noiseLow-noise amplifiers, analog switches
Enhancement Mode MOSFETNormally-off device, requires positive VGS to conductPower supplies, motor drives
Depletion Mode MOSFETNormally-on device, requires negative VGS to blockRadio frequency amplifiers, load switches
Insulated Gate Bipolar Transistor (IGBT)Combines MOSFET input with bipolar output, high current capacityHigh-power industrial equipment, electric vehicles

3. Structure and Composition

A typical MOSFET structure includes three terminals: Source, Gate, and Drain. The gate is insulated by a thin layer of silicon dioxide (SiO2), forming a capacitive control interface. The channel between source and drain is formed in a silicon substrate. Advanced devices use materials like silicon carbide (SiC) or gallium nitride (GaN) for higher performance. Packaging options include TO-220, DPAK, and SOT-23 for different thermal and space requirements.

4. Key Technical Specifications

ParameterDescription and Importance
VDS (Drain-Source Voltage)Maximum voltage rating between drain and source; determines breakdown tolerance
ID (Drain Current)Maximum continuous current capacity; critical for power handling
RDS(on)On-state resistance; impacts conduction losses and efficiency
VGS(th) (Threshold Voltage)Voltage required to form channel; determines control signal compatibility
QG (Gate Charge)Charge required for switching; affects switching speed and driver requirements
PD (Power Dissipation)Maximum power handling capability; dictates thermal management needs

5. Application Fields

  • Consumer Electronics: Mobile phone chargers, notebook power adapters
  • Industrial: Motor drives, uninterruptible power supplies (UPS)
  • Automotive: Electric vehicle (EV) battery management systems, HEV inverters
  • Telecommunications: Base station power amplifiers, optical network transceivers
  • Renewable Energy: Solar micro-inverters, wind turbine converters

6. Leading Manufacturers and Products

ManufacturerRepresentative ProductKey Features
Texas InstrumentsCSD18534Q5A60V, 4.2m RDS(on), automotive-grade
STMicroelectronicsSTP55NF0655A, 60V, high-speed switching
Infineon TechnologiesIPB041N06N30.41 , 600V, TO-220 package
ON SemiconductorNDS355ANDepletion mode, 300mA, RF applications

7. Selection Guidelines

Key considerations include:

  • Voltage and current requirements under operating conditions
  • Thermal performance (RDS(on), package thermal resistance)
  • Switching speed vs. conduction loss trade-off
  • Gate drive compatibility with control circuitry
  • Environmental factors (temperature, vibration, humidity)
  • Cost-performance balance for volume production

8. Industry Trends

Current trends include:

  • Adoption of wide bandgap materials (SiC, GaN) for higher efficiency
  • Advanced packaging technologies (double-sided cooling, copper clip)
  • Integration with gate drivers and protection circuits
  • Miniaturization through trench and shielded gate structures
  • Development of automotive-qualified devices for EVs and ADAS

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