Transistors - FETs, MOSFETs - Single

Image Part Number Description / PDF Quantity Rfq
IRFR220TRPBF

IRFR220TRPBF

Vishay / Siliconix

MOSFET N-CH 200V 4.8A DPAK

584

SQJ423EP-T1_GE3

SQJ423EP-T1_GE3

Vishay / Siliconix

MOSFET P-CH 40V 55A PPAK SO-8

21753

SIHG17N80AEF-GE3

SIHG17N80AEF-GE3

Vishay / Siliconix

E SERIES POWER MOSFET WITH FAST

0

SI3129DV-T1-GE3

SI3129DV-T1-GE3

Vishay / Siliconix

P-CHANNEL 80 V (D-S) MOSFET TSOP

50

SIS698DN-T1-GE3

SIS698DN-T1-GE3

Vishay / Siliconix

MOSFET N-CH 100V 6.9A PPAK1212-8

0

IRFIBC40GPBF

IRFIBC40GPBF

Vishay / Siliconix

MOSFET N-CH 600V 3.5A TO220-3

530

SI4463CDY-T1-GE3

SI4463CDY-T1-GE3

Vishay / Siliconix

MOSFET P-CH 20V 13.6A/49A 8SO

0

SQJ142ELP-T1_GE3

SQJ142ELP-T1_GE3

Vishay / Siliconix

MOSFET N-CH 40V 175A PPAK SO-8

3050

SQ3461EV-T1_GE3

SQ3461EV-T1_GE3

Vishay / Siliconix

MOSFET P-CHANNEL 12V 8A 6TSOP

2291

SQM110N05-06L_GE3

SQM110N05-06L_GE3

Vishay / Siliconix

MOSFET N-CH 55V 110A TO263

3175

SIHF23N60E-GE3

SIHF23N60E-GE3

Vishay / Siliconix

MOSFET N-CH 600V 23A TO220

0

SQA401EJ-T1_GE3

SQA401EJ-T1_GE3

Vishay / Siliconix

MOSFET P-CH 20V 3.75A PPAK SC70

0

IRFR010PBF-BE3

IRFR010PBF-BE3

Vishay / Siliconix

MOSFET N-CH 50V 8.2A DPAK

2990

SQ4153EY-T1_BE3

SQ4153EY-T1_BE3

Vishay / Siliconix

MOSFET P-CHANNEL 12V 25A 8SOIC

2470

SIHH11N65EF-T1-GE3

SIHH11N65EF-T1-GE3

Vishay / Siliconix

MOSFET N-CH 650V 11A PPAK 8 X 8

3035

SIHB068N60EF-GE3

SIHB068N60EF-GE3

Vishay / Siliconix

MOSFET N-CH 600V 41A D2PAK

3000

SIS890DN-T1-GE3

SIS890DN-T1-GE3

Vishay / Siliconix

MOSFET N-CH 100V 30A PPAK1212-8

0

IRFP140PBF

IRFP140PBF

Vishay / Siliconix

MOSFET N-CH 100V 31A TO247-3

469

SIE810DF-T1-GE3

SIE810DF-T1-GE3

Vishay / Siliconix

MOSFET N-CH 20V 60A 10POLARPAK

2000

SI2301CDS-T1-GE3

SI2301CDS-T1-GE3

Vishay / Siliconix

MOSFET P-CH 20V 3.1A SOT23-3

0

Transistors - FETs, MOSFETs - Single

1. Overview

Field-Effect Transistors (FETs) and Metal-Oxide-Semiconductor FETs (MOSFETs) are voltage-controlled semiconductor devices that regulate current flow through an electric field. As fundamental components in modern electronics, they offer advantages such as high input impedance, low power consumption, and fast switching capabilities. Single discrete FETs/MOSFETs are widely used in power management, signal amplification, and switching applications across industries.

2. Main Types and Functional Classification

TypeFunctional CharacteristicsApplication Examples
Junction FET (JFET)Voltage-controlled depletion mode operation, low noiseLow-noise amplifiers, analog switches
Enhancement Mode MOSFETNormally-off device, requires positive VGS to conductPower supplies, motor drives
Depletion Mode MOSFETNormally-on device, requires negative VGS to blockRadio frequency amplifiers, load switches
Insulated Gate Bipolar Transistor (IGBT)Combines MOSFET input with bipolar output, high current capacityHigh-power industrial equipment, electric vehicles

3. Structure and Composition

A typical MOSFET structure includes three terminals: Source, Gate, and Drain. The gate is insulated by a thin layer of silicon dioxide (SiO2), forming a capacitive control interface. The channel between source and drain is formed in a silicon substrate. Advanced devices use materials like silicon carbide (SiC) or gallium nitride (GaN) for higher performance. Packaging options include TO-220, DPAK, and SOT-23 for different thermal and space requirements.

4. Key Technical Specifications

ParameterDescription and Importance
VDS (Drain-Source Voltage)Maximum voltage rating between drain and source; determines breakdown tolerance
ID (Drain Current)Maximum continuous current capacity; critical for power handling
RDS(on)On-state resistance; impacts conduction losses and efficiency
VGS(th) (Threshold Voltage)Voltage required to form channel; determines control signal compatibility
QG (Gate Charge)Charge required for switching; affects switching speed and driver requirements
PD (Power Dissipation)Maximum power handling capability; dictates thermal management needs

5. Application Fields

  • Consumer Electronics: Mobile phone chargers, notebook power adapters
  • Industrial: Motor drives, uninterruptible power supplies (UPS)
  • Automotive: Electric vehicle (EV) battery management systems, HEV inverters
  • Telecommunications: Base station power amplifiers, optical network transceivers
  • Renewable Energy: Solar micro-inverters, wind turbine converters

6. Leading Manufacturers and Products

ManufacturerRepresentative ProductKey Features
Texas InstrumentsCSD18534Q5A60V, 4.2m RDS(on), automotive-grade
STMicroelectronicsSTP55NF0655A, 60V, high-speed switching
Infineon TechnologiesIPB041N06N30.41 , 600V, TO-220 package
ON SemiconductorNDS355ANDepletion mode, 300mA, RF applications

7. Selection Guidelines

Key considerations include:

  • Voltage and current requirements under operating conditions
  • Thermal performance (RDS(on), package thermal resistance)
  • Switching speed vs. conduction loss trade-off
  • Gate drive compatibility with control circuitry
  • Environmental factors (temperature, vibration, humidity)
  • Cost-performance balance for volume production

8. Industry Trends

Current trends include:

  • Adoption of wide bandgap materials (SiC, GaN) for higher efficiency
  • Advanced packaging technologies (double-sided cooling, copper clip)
  • Integration with gate drivers and protection circuits
  • Miniaturization through trench and shielded gate structures
  • Development of automotive-qualified devices for EVs and ADAS

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