Transistors - FETs, MOSFETs - Single

Image Part Number Description / PDF Quantity Rfq
SIHB22N60EL-GE3

SIHB22N60EL-GE3

Vishay / Siliconix

MOSFET N-CH 600V 21A TO263

0

SI7106DN-T1-GE3

SI7106DN-T1-GE3

Vishay / Siliconix

MOSFET N-CH 20V 12.5A PPAK1212-8

2973

SIHG21N65EF-GE3

SIHG21N65EF-GE3

Vishay / Siliconix

MOSFET N-CH 650V 21A TO247AC

440

IRF9Z20PBF

IRF9Z20PBF

Vishay / Siliconix

MOSFET P-CH 50V 9.7A TO220AB

37

SIR871DP-T1-GE3

SIR871DP-T1-GE3

Vishay / Siliconix

MOSFET P-CH 100V 48A PPAK SO-8

13878

IRF840ASTRRPBF

IRF840ASTRRPBF

Vishay / Siliconix

MOSFET N-CH 500V 8A D2PAK

528

SIHG22N50D-E3

SIHG22N50D-E3

Vishay / Siliconix

MOSFET N-CH 500V 22A TO247AC

426

SIHF30N60E-GE3

SIHF30N60E-GE3

Vishay / Siliconix

MOSFET N-CH 600V 29A TO220

817

IRLI630GPBF

IRLI630GPBF

Vishay / Siliconix

MOSFET N-CH 200V 6.2A TO220-3

1015

SIHD14N60E-BE3

SIHD14N60E-BE3

Vishay / Siliconix

MOSFET N-CH 600V 13A TO252AA

2996

SI7328DN-T1-GE3

SI7328DN-T1-GE3

Vishay / Siliconix

MOSFET N-CH 30V 35A PPAK1212-8

0

SIHP17N80AE-GE3

SIHP17N80AE-GE3

Vishay / Siliconix

MOSFET N-CH 800V 15A TO220AB

1050

SUP40012EL-GE3

SUP40012EL-GE3

Vishay / Siliconix

MOSFET N-CH 40V 150A TO220AB

893

SIA462DJ-T1-GE3

SIA462DJ-T1-GE3

Vishay / Siliconix

MOSFET N-CH 30V 12A PPAK SC70-6

146

SI2336DS-T1-GE3

SI2336DS-T1-GE3

Vishay / Siliconix

MOSFET N-CH 30V 5.2A SOT23-3

956

SI5419DU-T1-GE3

SI5419DU-T1-GE3

Vishay / Siliconix

MOSFET P-CH 30V 12A PPAK CHIPFET

6050

SIR178DP-T1-RE3

SIR178DP-T1-RE3

Vishay / Siliconix

MOSFET N-CH 20V 100A/430A PPAK

5982

SI7469DP-T1-GE3

SI7469DP-T1-GE3

Vishay / Siliconix

MOSFET P-CH 80V 28A PPAK SO-8

5655

IRFZ24STRLPBF

IRFZ24STRLPBF

Vishay / Siliconix

MOSFET N-CH 60V 17A D2PAK

0

SQ4005EY-T1_BE3

SQ4005EY-T1_BE3

Vishay / Siliconix

MOSFET P-CHANNEL 12V 15A 8SOIC

2500

Transistors - FETs, MOSFETs - Single

1. Overview

Field-Effect Transistors (FETs) and Metal-Oxide-Semiconductor FETs (MOSFETs) are voltage-controlled semiconductor devices that regulate current flow through an electric field. As fundamental components in modern electronics, they offer advantages such as high input impedance, low power consumption, and fast switching capabilities. Single discrete FETs/MOSFETs are widely used in power management, signal amplification, and switching applications across industries.

2. Main Types and Functional Classification

TypeFunctional CharacteristicsApplication Examples
Junction FET (JFET)Voltage-controlled depletion mode operation, low noiseLow-noise amplifiers, analog switches
Enhancement Mode MOSFETNormally-off device, requires positive VGS to conductPower supplies, motor drives
Depletion Mode MOSFETNormally-on device, requires negative VGS to blockRadio frequency amplifiers, load switches
Insulated Gate Bipolar Transistor (IGBT)Combines MOSFET input with bipolar output, high current capacityHigh-power industrial equipment, electric vehicles

3. Structure and Composition

A typical MOSFET structure includes three terminals: Source, Gate, and Drain. The gate is insulated by a thin layer of silicon dioxide (SiO2), forming a capacitive control interface. The channel between source and drain is formed in a silicon substrate. Advanced devices use materials like silicon carbide (SiC) or gallium nitride (GaN) for higher performance. Packaging options include TO-220, DPAK, and SOT-23 for different thermal and space requirements.

4. Key Technical Specifications

ParameterDescription and Importance
VDS (Drain-Source Voltage)Maximum voltage rating between drain and source; determines breakdown tolerance
ID (Drain Current)Maximum continuous current capacity; critical for power handling
RDS(on)On-state resistance; impacts conduction losses and efficiency
VGS(th) (Threshold Voltage)Voltage required to form channel; determines control signal compatibility
QG (Gate Charge)Charge required for switching; affects switching speed and driver requirements
PD (Power Dissipation)Maximum power handling capability; dictates thermal management needs

5. Application Fields

  • Consumer Electronics: Mobile phone chargers, notebook power adapters
  • Industrial: Motor drives, uninterruptible power supplies (UPS)
  • Automotive: Electric vehicle (EV) battery management systems, HEV inverters
  • Telecommunications: Base station power amplifiers, optical network transceivers
  • Renewable Energy: Solar micro-inverters, wind turbine converters

6. Leading Manufacturers and Products

ManufacturerRepresentative ProductKey Features
Texas InstrumentsCSD18534Q5A60V, 4.2m RDS(on), automotive-grade
STMicroelectronicsSTP55NF0655A, 60V, high-speed switching
Infineon TechnologiesIPB041N06N30.41 , 600V, TO-220 package
ON SemiconductorNDS355ANDepletion mode, 300mA, RF applications

7. Selection Guidelines

Key considerations include:

  • Voltage and current requirements under operating conditions
  • Thermal performance (RDS(on), package thermal resistance)
  • Switching speed vs. conduction loss trade-off
  • Gate drive compatibility with control circuitry
  • Environmental factors (temperature, vibration, humidity)
  • Cost-performance balance for volume production

8. Industry Trends

Current trends include:

  • Adoption of wide bandgap materials (SiC, GaN) for higher efficiency
  • Advanced packaging technologies (double-sided cooling, copper clip)
  • Integration with gate drivers and protection circuits
  • Miniaturization through trench and shielded gate structures
  • Development of automotive-qualified devices for EVs and ADAS

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