Transistors - FETs, MOSFETs - Single

Image Part Number Description / PDF Quantity Rfq
TK6A53D(STA4,Q,M)

TK6A53D(STA4,Q,M)

Toshiba Electronic Devices and Storage Corporation

MOSFET N-CH 525V 6A TO220SIS

0

TPN4R203NC,L1Q

TPN4R203NC,L1Q

Toshiba Electronic Devices and Storage Corporation

MOSFET N CH 30V 23A 8TSON-ADV

0

TK13E25D,S1X(S

TK13E25D,S1X(S

Toshiba Electronic Devices and Storage Corporation

MOSFET N-CH 250V 13A TO220-3

0

XPN9R614MC,L1XHQ

XPN9R614MC,L1XHQ

Toshiba Electronic Devices and Storage Corporation

MOSFET P-CH 40V 40A 8TSON

9057

SSM6J50TU,LF

SSM6J50TU,LF

Toshiba Electronic Devices and Storage Corporation

MOSFET P-CH 20V 2.5A UF6

6709

TPH1R403NL,L1Q

TPH1R403NL,L1Q

Toshiba Electronic Devices and Storage Corporation

MOSFET N-CH 30V 60A 8SOP

4961

TK35N65W,S1F

TK35N65W,S1F

Toshiba Electronic Devices and Storage Corporation

MOSFET N-CH 650V 35A TO247

10

TK7R4A10PL,S4X

TK7R4A10PL,S4X

Toshiba Electronic Devices and Storage Corporation

X35 PB-F POWER MOSFET TRANSISTOR

170

TPH2R506PL,L1Q

TPH2R506PL,L1Q

Toshiba Electronic Devices and Storage Corporation

MOSFET N-CH 60V 100A 8SOP

0

TK12A45D(STA4,Q,M)

TK12A45D(STA4,Q,M)

Toshiba Electronic Devices and Storage Corporation

MOSFET N-CH 450V 12A TO220SIS

0

TK15J60U(F)

TK15J60U(F)

Toshiba Electronic Devices and Storage Corporation

MOSFET N-CH 600V 15A TO3P

142

XPN6R706NC,L1XHQ

XPN6R706NC,L1XHQ

Toshiba Electronic Devices and Storage Corporation

MOSFET N-CH 60V 40A 8TSON

9751

TK380P65Y,RQ

TK380P65Y,RQ

Toshiba Electronic Devices and Storage Corporation

MOSFET N-CHANNEL 650V 9.7A DPAK

3712

TK6P65W,RQ

TK6P65W,RQ

Toshiba Electronic Devices and Storage Corporation

MOSFET N-CH 650V 5.8A DPAK

1857

SSM3K341R,LXHF

SSM3K341R,LXHF

Toshiba Electronic Devices and Storage Corporation

AECQ MOSFET NCH 60V 6A SOT23F

2054

SSM6K514NU,LF

SSM6K514NU,LF

Toshiba Electronic Devices and Storage Corporation

MOSFET N-CH 40V 12A 6UDFNB

3115

TJ10S04M3L(T6L1,NQ

TJ10S04M3L(T6L1,NQ

Toshiba Electronic Devices and Storage Corporation

MOSFET P-CH 40V 10A DPAK

0

SSM3K15ACTC,L3F

SSM3K15ACTC,L3F

Toshiba Electronic Devices and Storage Corporation

MOSFET N-CH 30V 100MA CST3C

6219

TPHR8504PL,L1Q

TPHR8504PL,L1Q

Toshiba Electronic Devices and Storage Corporation

MOSFET N-CH 40V 150A 8SOP

0

TPCA8056-H,LQ(M

TPCA8056-H,LQ(M

Toshiba Electronic Devices and Storage Corporation

MOSFET N-CH 30V 48A 8SOP

0

Transistors - FETs, MOSFETs - Single

1. Overview

Field-Effect Transistors (FETs) and Metal-Oxide-Semiconductor FETs (MOSFETs) are voltage-controlled semiconductor devices that regulate current flow through an electric field. As fundamental components in modern electronics, they offer advantages such as high input impedance, low power consumption, and fast switching capabilities. Single discrete FETs/MOSFETs are widely used in power management, signal amplification, and switching applications across industries.

2. Main Types and Functional Classification

TypeFunctional CharacteristicsApplication Examples
Junction FET (JFET)Voltage-controlled depletion mode operation, low noiseLow-noise amplifiers, analog switches
Enhancement Mode MOSFETNormally-off device, requires positive VGS to conductPower supplies, motor drives
Depletion Mode MOSFETNormally-on device, requires negative VGS to blockRadio frequency amplifiers, load switches
Insulated Gate Bipolar Transistor (IGBT)Combines MOSFET input with bipolar output, high current capacityHigh-power industrial equipment, electric vehicles

3. Structure and Composition

A typical MOSFET structure includes three terminals: Source, Gate, and Drain. The gate is insulated by a thin layer of silicon dioxide (SiO2), forming a capacitive control interface. The channel between source and drain is formed in a silicon substrate. Advanced devices use materials like silicon carbide (SiC) or gallium nitride (GaN) for higher performance. Packaging options include TO-220, DPAK, and SOT-23 for different thermal and space requirements.

4. Key Technical Specifications

ParameterDescription and Importance
VDS (Drain-Source Voltage)Maximum voltage rating between drain and source; determines breakdown tolerance
ID (Drain Current)Maximum continuous current capacity; critical for power handling
RDS(on)On-state resistance; impacts conduction losses and efficiency
VGS(th) (Threshold Voltage)Voltage required to form channel; determines control signal compatibility
QG (Gate Charge)Charge required for switching; affects switching speed and driver requirements
PD (Power Dissipation)Maximum power handling capability; dictates thermal management needs

5. Application Fields

  • Consumer Electronics: Mobile phone chargers, notebook power adapters
  • Industrial: Motor drives, uninterruptible power supplies (UPS)
  • Automotive: Electric vehicle (EV) battery management systems, HEV inverters
  • Telecommunications: Base station power amplifiers, optical network transceivers
  • Renewable Energy: Solar micro-inverters, wind turbine converters

6. Leading Manufacturers and Products

ManufacturerRepresentative ProductKey Features
Texas InstrumentsCSD18534Q5A60V, 4.2m RDS(on), automotive-grade
STMicroelectronicsSTP55NF0655A, 60V, high-speed switching
Infineon TechnologiesIPB041N06N30.41 , 600V, TO-220 package
ON SemiconductorNDS355ANDepletion mode, 300mA, RF applications

7. Selection Guidelines

Key considerations include:

  • Voltage and current requirements under operating conditions
  • Thermal performance (RDS(on), package thermal resistance)
  • Switching speed vs. conduction loss trade-off
  • Gate drive compatibility with control circuitry
  • Environmental factors (temperature, vibration, humidity)
  • Cost-performance balance for volume production

8. Industry Trends

Current trends include:

  • Adoption of wide bandgap materials (SiC, GaN) for higher efficiency
  • Advanced packaging technologies (double-sided cooling, copper clip)
  • Integration with gate drivers and protection circuits
  • Miniaturization through trench and shielded gate structures
  • Development of automotive-qualified devices for EVs and ADAS

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