Transistors - FETs, MOSFETs - Single

Image Part Number Description / PDF Quantity Rfq
TK20G60W,RVQ

TK20G60W,RVQ

Toshiba Electronic Devices and Storage Corporation

MOSFET N CH 600V 20A D2PAK

0

SSM6J501NU,LF

SSM6J501NU,LF

Toshiba Electronic Devices and Storage Corporation

MOSFET P-CH 20V 10A 6UDFNB

19026

SSM6J801R,LF

SSM6J801R,LF

Toshiba Electronic Devices and Storage Corporation

MOSFET P-CH 20V 6A 6TSOP

1075

TK10Q60W,S1VQ

TK10Q60W,S1VQ

Toshiba Electronic Devices and Storage Corporation

MOSFET N-CH 600V 9.7A IPAK

0

TJ200F04M3L,LXHQ

TJ200F04M3L,LXHQ

Toshiba Electronic Devices and Storage Corporation

MOSFET P-CH 40V 200A TO220SM

0

TK56A12N1,S4X

TK56A12N1,S4X

Toshiba Electronic Devices and Storage Corporation

MOSFET N-CH 120V 56A TO220SIS

0

SSM3K329R,LF

SSM3K329R,LF

Toshiba Electronic Devices and Storage Corporation

MOSFET N CH 30V 3.5A 2-3Z1A

323306

TK18A50D(STA4,Q,M)

TK18A50D(STA4,Q,M)

Toshiba Electronic Devices and Storage Corporation

MOSFET N-CH 500V 18A TO220SIS

0

TK110A65Z,S4X

TK110A65Z,S4X

Toshiba Electronic Devices and Storage Corporation

MOSFET N-CH 650V 24A TO220SIS

122

SSM3K35CT,L3F

SSM3K35CT,L3F

Toshiba Electronic Devices and Storage Corporation

MOSFET N-CH 20V 180MA CST3

12016

TK8A65W,S5X

TK8A65W,S5X

Toshiba Electronic Devices and Storage Corporation

MOSFET N-CH 650V 7.8A TO220SIS

0

TK7A90E,S4X

TK7A90E,S4X

Toshiba Electronic Devices and Storage Corporation

MOSFET N-CH 900V 7A TO220SIS

12

TPN13008NH,L1Q

TPN13008NH,L1Q

Toshiba Electronic Devices and Storage Corporation

MOSFET N-CH 80V 18A 8TSON

1913

SSM3K35CTC,L3F

SSM3K35CTC,L3F

Toshiba Electronic Devices and Storage Corporation

MOSFET N-CH 20V 250MA CST3C

7845

TK22E10N1,S1X

TK22E10N1,S1X

Toshiba Electronic Devices and Storage Corporation

MOSFET N CH 100V 52A TO220

0

TPN30008NH,LQ

TPN30008NH,LQ

Toshiba Electronic Devices and Storage Corporation

MOSFET N-CH 80V 9.6A 8TSON

500

SSM6J206FE(TE85L,F

SSM6J206FE(TE85L,F

Toshiba Electronic Devices and Storage Corporation

MOSFET P-CH 20V 2A ES6

6186

SSM3K127TU,LF

SSM3K127TU,LF

Toshiba Electronic Devices and Storage Corporation

MOSFET N-CH 30V 2A UFM

5097

TK16V60W,LVQ

TK16V60W,LVQ

Toshiba Electronic Devices and Storage Corporation

MOSFET N-CH 600V 15.8A 4DFN

0

TK110U65Z,RQ

TK110U65Z,RQ

Toshiba Electronic Devices and Storage Corporation

DTMOS VI TOLL PD=190W F=1MHZ

4000

Transistors - FETs, MOSFETs - Single

1. Overview

Field-Effect Transistors (FETs) and Metal-Oxide-Semiconductor FETs (MOSFETs) are voltage-controlled semiconductor devices that regulate current flow through an electric field. As fundamental components in modern electronics, they offer advantages such as high input impedance, low power consumption, and fast switching capabilities. Single discrete FETs/MOSFETs are widely used in power management, signal amplification, and switching applications across industries.

2. Main Types and Functional Classification

TypeFunctional CharacteristicsApplication Examples
Junction FET (JFET)Voltage-controlled depletion mode operation, low noiseLow-noise amplifiers, analog switches
Enhancement Mode MOSFETNormally-off device, requires positive VGS to conductPower supplies, motor drives
Depletion Mode MOSFETNormally-on device, requires negative VGS to blockRadio frequency amplifiers, load switches
Insulated Gate Bipolar Transistor (IGBT)Combines MOSFET input with bipolar output, high current capacityHigh-power industrial equipment, electric vehicles

3. Structure and Composition

A typical MOSFET structure includes three terminals: Source, Gate, and Drain. The gate is insulated by a thin layer of silicon dioxide (SiO2), forming a capacitive control interface. The channel between source and drain is formed in a silicon substrate. Advanced devices use materials like silicon carbide (SiC) or gallium nitride (GaN) for higher performance. Packaging options include TO-220, DPAK, and SOT-23 for different thermal and space requirements.

4. Key Technical Specifications

ParameterDescription and Importance
VDS (Drain-Source Voltage)Maximum voltage rating between drain and source; determines breakdown tolerance
ID (Drain Current)Maximum continuous current capacity; critical for power handling
RDS(on)On-state resistance; impacts conduction losses and efficiency
VGS(th) (Threshold Voltage)Voltage required to form channel; determines control signal compatibility
QG (Gate Charge)Charge required for switching; affects switching speed and driver requirements
PD (Power Dissipation)Maximum power handling capability; dictates thermal management needs

5. Application Fields

  • Consumer Electronics: Mobile phone chargers, notebook power adapters
  • Industrial: Motor drives, uninterruptible power supplies (UPS)
  • Automotive: Electric vehicle (EV) battery management systems, HEV inverters
  • Telecommunications: Base station power amplifiers, optical network transceivers
  • Renewable Energy: Solar micro-inverters, wind turbine converters

6. Leading Manufacturers and Products

ManufacturerRepresentative ProductKey Features
Texas InstrumentsCSD18534Q5A60V, 4.2m RDS(on), automotive-grade
STMicroelectronicsSTP55NF0655A, 60V, high-speed switching
Infineon TechnologiesIPB041N06N30.41 , 600V, TO-220 package
ON SemiconductorNDS355ANDepletion mode, 300mA, RF applications

7. Selection Guidelines

Key considerations include:

  • Voltage and current requirements under operating conditions
  • Thermal performance (RDS(on), package thermal resistance)
  • Switching speed vs. conduction loss trade-off
  • Gate drive compatibility with control circuitry
  • Environmental factors (temperature, vibration, humidity)
  • Cost-performance balance for volume production

8. Industry Trends

Current trends include:

  • Adoption of wide bandgap materials (SiC, GaN) for higher efficiency
  • Advanced packaging technologies (double-sided cooling, copper clip)
  • Integration with gate drivers and protection circuits
  • Miniaturization through trench and shielded gate structures
  • Development of automotive-qualified devices for EVs and ADAS

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