Transistors - FETs, MOSFETs - Single

Image Part Number Description / PDF Quantity Rfq
TPCA8028-H(TE12LQM

TPCA8028-H(TE12LQM

Toshiba Electronic Devices and Storage Corporation

MOSFET N-CH 30V 50A 8SOP

4925

TK39N60X,S1F

TK39N60X,S1F

Toshiba Electronic Devices and Storage Corporation

MOSFET N-CH 600V 38.8A TO247

10

TPC8134,LQ(S

TPC8134,LQ(S

Toshiba Electronic Devices and Storage Corporation

MOSFET P-CH 40V 5A 8SOP

0

TK4A60DA(STA4,Q,M)

TK4A60DA(STA4,Q,M)

Toshiba Electronic Devices and Storage Corporation

MOSFET N-CH 600V 3.5A TO220SIS

0

TK1R4F04PB,LXGQ

TK1R4F04PB,LXGQ

Toshiba Electronic Devices and Storage Corporation

MOSFET N-CH 40V 160A TO220SM

2000

TK6R7A10PL,S4X

TK6R7A10PL,S4X

Toshiba Electronic Devices and Storage Corporation

X35 PB-F POWER MOSFET TRANSISTOR

135

TPCA8047-H(T2L1,VM

TPCA8047-H(T2L1,VM

Toshiba Electronic Devices and Storage Corporation

MOSFET N-CH 40V 32A 8SOP

7743

TK7A65W,S5X

TK7A65W,S5X

Toshiba Electronic Devices and Storage Corporation

MOSFET N-CH 650V 6.8A TO220SIS

0

TK39J60W5,S1VQ

TK39J60W5,S1VQ

Toshiba Electronic Devices and Storage Corporation

MOSFET N-CH 600V 38.8A TO3P

25

TPCA8128,LQ(CM

TPCA8128,LQ(CM

Toshiba Electronic Devices and Storage Corporation

MOSFET P-CH 30V 34A 8SOP

0

TPH6R30ANL,L1Q

TPH6R30ANL,L1Q

Toshiba Electronic Devices and Storage Corporation

MOSFET N-CH 100V 66A/45A 8SOP

0

TK10A60E,S5X

TK10A60E,S5X

Toshiba Electronic Devices and Storage Corporation

MOSFET N-CH 600V 10A TO220SIS

24

TK7A60W,S4VX

TK7A60W,S4VX

Toshiba Electronic Devices and Storage Corporation

MOSFET N-CH 600V 7A TO220SIS

0

TK100S04N1L,LQ

TK100S04N1L,LQ

Toshiba Electronic Devices and Storage Corporation

MOSFET N-CH 40V 100A DPAK

1999

TK8A65D(STA4,Q,M)

TK8A65D(STA4,Q,M)

Toshiba Electronic Devices and Storage Corporation

MOSFET N-CH 650V 8A TO220SIS

15

TK31E60W,S1VX

TK31E60W,S1VX

Toshiba Electronic Devices and Storage Corporation

MOSFET N-CH 600V 30.8A TO220

0

SSM6J771G,LF

SSM6J771G,LF

Toshiba Electronic Devices and Storage Corporation

MOSFET P-CH 20V 5A 6WCSP

11

TK65S04K3L(T6L1,NQ

TK65S04K3L(T6L1,NQ

Toshiba Electronic Devices and Storage Corporation

MOSFET N-CH 40V 65A DPAK

0

SSM3K56FS,LF

SSM3K56FS,LF

Toshiba Electronic Devices and Storage Corporation

MOSFET N-CH 20V 800MA SSM

0

TK155U65Z,RQ

TK155U65Z,RQ

Toshiba Electronic Devices and Storage Corporation

DTMOS VI TOLL PD=150W F=1MHZ

3990

Transistors - FETs, MOSFETs - Single

1. Overview

Field-Effect Transistors (FETs) and Metal-Oxide-Semiconductor FETs (MOSFETs) are voltage-controlled semiconductor devices that regulate current flow through an electric field. As fundamental components in modern electronics, they offer advantages such as high input impedance, low power consumption, and fast switching capabilities. Single discrete FETs/MOSFETs are widely used in power management, signal amplification, and switching applications across industries.

2. Main Types and Functional Classification

TypeFunctional CharacteristicsApplication Examples
Junction FET (JFET)Voltage-controlled depletion mode operation, low noiseLow-noise amplifiers, analog switches
Enhancement Mode MOSFETNormally-off device, requires positive VGS to conductPower supplies, motor drives
Depletion Mode MOSFETNormally-on device, requires negative VGS to blockRadio frequency amplifiers, load switches
Insulated Gate Bipolar Transistor (IGBT)Combines MOSFET input with bipolar output, high current capacityHigh-power industrial equipment, electric vehicles

3. Structure and Composition

A typical MOSFET structure includes three terminals: Source, Gate, and Drain. The gate is insulated by a thin layer of silicon dioxide (SiO2), forming a capacitive control interface. The channel between source and drain is formed in a silicon substrate. Advanced devices use materials like silicon carbide (SiC) or gallium nitride (GaN) for higher performance. Packaging options include TO-220, DPAK, and SOT-23 for different thermal and space requirements.

4. Key Technical Specifications

ParameterDescription and Importance
VDS (Drain-Source Voltage)Maximum voltage rating between drain and source; determines breakdown tolerance
ID (Drain Current)Maximum continuous current capacity; critical for power handling
RDS(on)On-state resistance; impacts conduction losses and efficiency
VGS(th) (Threshold Voltage)Voltage required to form channel; determines control signal compatibility
QG (Gate Charge)Charge required for switching; affects switching speed and driver requirements
PD (Power Dissipation)Maximum power handling capability; dictates thermal management needs

5. Application Fields

  • Consumer Electronics: Mobile phone chargers, notebook power adapters
  • Industrial: Motor drives, uninterruptible power supplies (UPS)
  • Automotive: Electric vehicle (EV) battery management systems, HEV inverters
  • Telecommunications: Base station power amplifiers, optical network transceivers
  • Renewable Energy: Solar micro-inverters, wind turbine converters

6. Leading Manufacturers and Products

ManufacturerRepresentative ProductKey Features
Texas InstrumentsCSD18534Q5A60V, 4.2m RDS(on), automotive-grade
STMicroelectronicsSTP55NF0655A, 60V, high-speed switching
Infineon TechnologiesIPB041N06N30.41 , 600V, TO-220 package
ON SemiconductorNDS355ANDepletion mode, 300mA, RF applications

7. Selection Guidelines

Key considerations include:

  • Voltage and current requirements under operating conditions
  • Thermal performance (RDS(on), package thermal resistance)
  • Switching speed vs. conduction loss trade-off
  • Gate drive compatibility with control circuitry
  • Environmental factors (temperature, vibration, humidity)
  • Cost-performance balance for volume production

8. Industry Trends

Current trends include:

  • Adoption of wide bandgap materials (SiC, GaN) for higher efficiency
  • Advanced packaging technologies (double-sided cooling, copper clip)
  • Integration with gate drivers and protection circuits
  • Miniaturization through trench and shielded gate structures
  • Development of automotive-qualified devices for EVs and ADAS

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