Transistors - FETs, MOSFETs - Single

Image Part Number Description / PDF Quantity Rfq
SSM3K15AFU,LF

SSM3K15AFU,LF

Toshiba Electronic Devices and Storage Corporation

MOSFET N-CH 30V 100MA USM

0

TPH1110FNH,L1Q

TPH1110FNH,L1Q

Toshiba Electronic Devices and Storage Corporation

MOSFET N-CH 250V 10A 8SOP

4096

TK46E08N1,S1X

TK46E08N1,S1X

Toshiba Electronic Devices and Storage Corporation

MOSFET N-CH 80V 80A TO220

0

TK17E65W,S1X

TK17E65W,S1X

Toshiba Electronic Devices and Storage Corporation

MOSFET N-CH 650V 17.3A TO220

0

TK290A60Y,S4X

TK290A60Y,S4X

Toshiba Electronic Devices and Storage Corporation

MOSFET N-CH 600V 11.5A TO220SIS

196

SSM6J402TU,LF

SSM6J402TU,LF

Toshiba Electronic Devices and Storage Corporation

MOSFET P-CH 30V 2A UF6

5843

SSM3J135TU,LF

SSM3J135TU,LF

Toshiba Electronic Devices and Storage Corporation

MOSFET P-CH 20V 3A UFM

840

SSM3K16CTC,L3F

SSM3K16CTC,L3F

Toshiba Electronic Devices and Storage Corporation

MOSFET N-CH 20V 200MA CST3C

0

TPH7R506NH,L1Q

TPH7R506NH,L1Q

Toshiba Electronic Devices and Storage Corporation

MOSFET N-CH 60V 22A 8SOP

5628

TK090U65Z,RQ

TK090U65Z,RQ

Toshiba Electronic Devices and Storage Corporation

DTMOS VI TOLL PD=230W F=1MHZ

4000

SSM3J36TU,LF

SSM3J36TU,LF

Toshiba Electronic Devices and Storage Corporation

MOSFET P-CH 20V 330MA UFM

9311

TK4A50D(STA4,Q,M)

TK4A50D(STA4,Q,M)

Toshiba Electronic Devices and Storage Corporation

MOSFET N-CH 500V 4A TO220SIS

0

SSM3K361TU,LF

SSM3K361TU,LF

Toshiba Electronic Devices and Storage Corporation

MOSFET N-CH 100V 3.5A UFM

3000

SSM3J130TU,LF

SSM3J130TU,LF

Toshiba Electronic Devices and Storage Corporation

MOSFET P-CH 20V 4.4A UFM

25580

TK22A10N1,S4X

TK22A10N1,S4X

Toshiba Electronic Devices and Storage Corporation

MOSFET N-CH 100V 22A TO220SIS

24

SSM3J372R,LF

SSM3J372R,LF

Toshiba Electronic Devices and Storage Corporation

MOSFET P-CH 30V 6A SOT23F

31708

TK80S06K3L(T6L1,NQ

TK80S06K3L(T6L1,NQ

Toshiba Electronic Devices and Storage Corporation

MOSFET N-CH 60V 80A DPAK

0

TPH1400ANH,L1Q

TPH1400ANH,L1Q

Toshiba Electronic Devices and Storage Corporation

MOSFET N CH 100V 24A 8-SOP

0

TPC8067-H,LQ(S

TPC8067-H,LQ(S

Toshiba Electronic Devices and Storage Corporation

MOSFET N-CH 30V 9A 8SOP

0

SSM3K337R,LF

SSM3K337R,LF

Toshiba Electronic Devices and Storage Corporation

MOSFET N-CH 38V 2A SOT23F

5712

Transistors - FETs, MOSFETs - Single

1. Overview

Field-Effect Transistors (FETs) and Metal-Oxide-Semiconductor FETs (MOSFETs) are voltage-controlled semiconductor devices that regulate current flow through an electric field. As fundamental components in modern electronics, they offer advantages such as high input impedance, low power consumption, and fast switching capabilities. Single discrete FETs/MOSFETs are widely used in power management, signal amplification, and switching applications across industries.

2. Main Types and Functional Classification

TypeFunctional CharacteristicsApplication Examples
Junction FET (JFET)Voltage-controlled depletion mode operation, low noiseLow-noise amplifiers, analog switches
Enhancement Mode MOSFETNormally-off device, requires positive VGS to conductPower supplies, motor drives
Depletion Mode MOSFETNormally-on device, requires negative VGS to blockRadio frequency amplifiers, load switches
Insulated Gate Bipolar Transistor (IGBT)Combines MOSFET input with bipolar output, high current capacityHigh-power industrial equipment, electric vehicles

3. Structure and Composition

A typical MOSFET structure includes three terminals: Source, Gate, and Drain. The gate is insulated by a thin layer of silicon dioxide (SiO2), forming a capacitive control interface. The channel between source and drain is formed in a silicon substrate. Advanced devices use materials like silicon carbide (SiC) or gallium nitride (GaN) for higher performance. Packaging options include TO-220, DPAK, and SOT-23 for different thermal and space requirements.

4. Key Technical Specifications

ParameterDescription and Importance
VDS (Drain-Source Voltage)Maximum voltage rating between drain and source; determines breakdown tolerance
ID (Drain Current)Maximum continuous current capacity; critical for power handling
RDS(on)On-state resistance; impacts conduction losses and efficiency
VGS(th) (Threshold Voltage)Voltage required to form channel; determines control signal compatibility
QG (Gate Charge)Charge required for switching; affects switching speed and driver requirements
PD (Power Dissipation)Maximum power handling capability; dictates thermal management needs

5. Application Fields

  • Consumer Electronics: Mobile phone chargers, notebook power adapters
  • Industrial: Motor drives, uninterruptible power supplies (UPS)
  • Automotive: Electric vehicle (EV) battery management systems, HEV inverters
  • Telecommunications: Base station power amplifiers, optical network transceivers
  • Renewable Energy: Solar micro-inverters, wind turbine converters

6. Leading Manufacturers and Products

ManufacturerRepresentative ProductKey Features
Texas InstrumentsCSD18534Q5A60V, 4.2m RDS(on), automotive-grade
STMicroelectronicsSTP55NF0655A, 60V, high-speed switching
Infineon TechnologiesIPB041N06N30.41 , 600V, TO-220 package
ON SemiconductorNDS355ANDepletion mode, 300mA, RF applications

7. Selection Guidelines

Key considerations include:

  • Voltage and current requirements under operating conditions
  • Thermal performance (RDS(on), package thermal resistance)
  • Switching speed vs. conduction loss trade-off
  • Gate drive compatibility with control circuitry
  • Environmental factors (temperature, vibration, humidity)
  • Cost-performance balance for volume production

8. Industry Trends

Current trends include:

  • Adoption of wide bandgap materials (SiC, GaN) for higher efficiency
  • Advanced packaging technologies (double-sided cooling, copper clip)
  • Integration with gate drivers and protection circuits
  • Miniaturization through trench and shielded gate structures
  • Development of automotive-qualified devices for EVs and ADAS

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