Transistors - FETs, MOSFETs - Single

Image Part Number Description / PDF Quantity Rfq
TPH6R003NL,LQ

TPH6R003NL,LQ

Toshiba Electronic Devices and Storage Corporation

MOSFET N CH 30V 38A 8SOP

0

TK7P60W,RVQ

TK7P60W,RVQ

Toshiba Electronic Devices and Storage Corporation

MOSFET N CH 600V 7A DPAK

0

TJ50S06M3L,LXHQ

TJ50S06M3L,LXHQ

Toshiba Electronic Devices and Storage Corporation

MOSFET P-CH 60V 50A DPAK

6164

TK10E60W,S1VX

TK10E60W,S1VX

Toshiba Electronic Devices and Storage Corporation

MOSFET N-CH 600V 9.7A TO220

20

TK72A12N1,S4X

TK72A12N1,S4X

Toshiba Electronic Devices and Storage Corporation

MOSFET N-CH 120V 72A TO220SIS

0

TK17A80W,S4X

TK17A80W,S4X

Toshiba Electronic Devices and Storage Corporation

MOSFET N-CH 800V 17A TO220SIS

389

SSM3J35CT,L3F

SSM3J35CT,L3F

Toshiba Electronic Devices and Storage Corporation

MOSFET P-CHANNEL 20V 100MA CST3

9700

TKR74F04PB,LXGQ

TKR74F04PB,LXGQ

Toshiba Electronic Devices and Storage Corporation

MOSFET N-CH 40V 250A TO220SM

3952

SSM3J356R,LXHF

SSM3J356R,LXHF

Toshiba Electronic Devices and Storage Corporation

AECQ MOSFET PCH -60V -2A SOT23F

5650

TK31V60W5,LVQ

TK31V60W5,LVQ

Toshiba Electronic Devices and Storage Corporation

MOSFET N-CH 600V 30.8A 4DFN

0

TJ8S06M3L,LXHQ

TJ8S06M3L,LXHQ

Toshiba Electronic Devices and Storage Corporation

MOSFET P-CH 60V 8A DPAK

42

TK3A60DA(STA4,Q,M)

TK3A60DA(STA4,Q,M)

Toshiba Electronic Devices and Storage Corporation

MOSFET N-CH 600V 2.5A TO220SIS

0

SSM3J304T(TE85L,F)

SSM3J304T(TE85L,F)

Toshiba Electronic Devices and Storage Corporation

MOSFET P-CH 20V 2.3A TSM

37

TPCA8064-H,LQ(CM

TPCA8064-H,LQ(CM

Toshiba Electronic Devices and Storage Corporation

MOSFET N-CH 30V 20A 8SOP

0

TK31A60W,S4VX

TK31A60W,S4VX

Toshiba Electronic Devices and Storage Corporation

MOSFET N-CH 600V 30.8A TO220SIS

0

TK39A60W,S4VX

TK39A60W,S4VX

Toshiba Electronic Devices and Storage Corporation

MOSFET N-CH 600V 38.8A TO220SIS

44

TK5P53D(T6RSS-Q)

TK5P53D(T6RSS-Q)

Toshiba Electronic Devices and Storage Corporation

MOSFET N-CH 525V 5A DPAK

0

TPH2R306NH,L1Q

TPH2R306NH,L1Q

Toshiba Electronic Devices and Storage Corporation

MOSFET N-CH 60V 60A 8SOP

0

TK5P50D(T6RSS-Q)

TK5P50D(T6RSS-Q)

Toshiba Electronic Devices and Storage Corporation

MOSFET N-CH 500V 5A DPAK

0

TK72A08N1,S4X

TK72A08N1,S4X

Toshiba Electronic Devices and Storage Corporation

MOSFET N-CH 75V 80A TO220SIS

301

Transistors - FETs, MOSFETs - Single

1. Overview

Field-Effect Transistors (FETs) and Metal-Oxide-Semiconductor FETs (MOSFETs) are voltage-controlled semiconductor devices that regulate current flow through an electric field. As fundamental components in modern electronics, they offer advantages such as high input impedance, low power consumption, and fast switching capabilities. Single discrete FETs/MOSFETs are widely used in power management, signal amplification, and switching applications across industries.

2. Main Types and Functional Classification

TypeFunctional CharacteristicsApplication Examples
Junction FET (JFET)Voltage-controlled depletion mode operation, low noiseLow-noise amplifiers, analog switches
Enhancement Mode MOSFETNormally-off device, requires positive VGS to conductPower supplies, motor drives
Depletion Mode MOSFETNormally-on device, requires negative VGS to blockRadio frequency amplifiers, load switches
Insulated Gate Bipolar Transistor (IGBT)Combines MOSFET input with bipolar output, high current capacityHigh-power industrial equipment, electric vehicles

3. Structure and Composition

A typical MOSFET structure includes three terminals: Source, Gate, and Drain. The gate is insulated by a thin layer of silicon dioxide (SiO2), forming a capacitive control interface. The channel between source and drain is formed in a silicon substrate. Advanced devices use materials like silicon carbide (SiC) or gallium nitride (GaN) for higher performance. Packaging options include TO-220, DPAK, and SOT-23 for different thermal and space requirements.

4. Key Technical Specifications

ParameterDescription and Importance
VDS (Drain-Source Voltage)Maximum voltage rating between drain and source; determines breakdown tolerance
ID (Drain Current)Maximum continuous current capacity; critical for power handling
RDS(on)On-state resistance; impacts conduction losses and efficiency
VGS(th) (Threshold Voltage)Voltage required to form channel; determines control signal compatibility
QG (Gate Charge)Charge required for switching; affects switching speed and driver requirements
PD (Power Dissipation)Maximum power handling capability; dictates thermal management needs

5. Application Fields

  • Consumer Electronics: Mobile phone chargers, notebook power adapters
  • Industrial: Motor drives, uninterruptible power supplies (UPS)
  • Automotive: Electric vehicle (EV) battery management systems, HEV inverters
  • Telecommunications: Base station power amplifiers, optical network transceivers
  • Renewable Energy: Solar micro-inverters, wind turbine converters

6. Leading Manufacturers and Products

ManufacturerRepresentative ProductKey Features
Texas InstrumentsCSD18534Q5A60V, 4.2m RDS(on), automotive-grade
STMicroelectronicsSTP55NF0655A, 60V, high-speed switching
Infineon TechnologiesIPB041N06N30.41 , 600V, TO-220 package
ON SemiconductorNDS355ANDepletion mode, 300mA, RF applications

7. Selection Guidelines

Key considerations include:

  • Voltage and current requirements under operating conditions
  • Thermal performance (RDS(on), package thermal resistance)
  • Switching speed vs. conduction loss trade-off
  • Gate drive compatibility with control circuitry
  • Environmental factors (temperature, vibration, humidity)
  • Cost-performance balance for volume production

8. Industry Trends

Current trends include:

  • Adoption of wide bandgap materials (SiC, GaN) for higher efficiency
  • Advanced packaging technologies (double-sided cooling, copper clip)
  • Integration with gate drivers and protection circuits
  • Miniaturization through trench and shielded gate structures
  • Development of automotive-qualified devices for EVs and ADAS

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