Transistors - FETs, MOSFETs

Transistors - FETs, MOSFETs - Single

Part Number	Description / PDF	Quantity
STFH10N60M2 STMicroelectronics	MOSFET N-CH 600V 7.5A TO220FP	298
STP5N60M2 STMicroelectronics	MOSFET N-CH 600V 3.7A TO220	0
STU2LN60K3 STMicroelectronics	MOSFET N CH 600V 2A IPAK	100
STF28N60M2 STMicroelectronics	MOSFET N-CH 600V 24A TO220FP	741
STD9NM60N STMicroelectronics	MOSFET N-CH 600V 6.5A DPAK	1631
STP15N65M5 STMicroelectronics	MOSFET N CH 650V 11A TO220	986
STL31N65M5 STMicroelectronics	MOSFET N-CH 650V 15A PWRFLAT88	0
STL18N55M5 STMicroelectronics	MOSFET N-CH 550V 2.4A POWERFLAT	0
STD155N3LH6 STMicroelectronics	MOSFET N-CH 30V 80A DPAK	0
STF2N62K3 STMicroelectronics	MOSFET N-CH 620V 2.2A TO220FP	0
STP80NF06 STMicroelectronics	MOSFET N-CH 60V 80A TO220AB	676
STP5NK80Z STMicroelectronics	MOSFET N-CH 800V 4.3A TO220AB	2810
STF33N60M6 STMicroelectronics	MOSFET N-CH 600V 25A TO220FP	576
STF26N65DM2 STMicroelectronics	MOSFET N-CH 650V 20A TO220FP	0
STL8NH3LL STMicroelectronics	MOSFET N-CH 30V 8A POWERFLAT	0
STW68N60M6 STMicroelectronics	MOSFET N-CH 600V TO247-3	417
STD6NK50ZT4 STMicroelectronics	MOSFET N-CH 500V 5.6A DPAK	6280
STD1NK60-1 STMicroelectronics	MOSFET N-CH 600V 1A IPAK	0
STF6N80K5 STMicroelectronics	MOSFET N-CH 800V 4.5A TO220FP	1000
STFW1N105K3 STMicroelectronics	MOSFET N-CH 1050V 1.4A ISOWATT	600

Transistors - FETs, MOSFETs - Single

1. Overview

Field-Effect Transistors (FETs) and Metal-Oxide-Semiconductor FETs (MOSFETs) are voltage-controlled semiconductor devices that regulate current flow through an electric field. As fundamental components in modern electronics, they offer advantages such as high input impedance, low power consumption, and fast switching capabilities. Single discrete FETs/MOSFETs are widely used in power management, signal amplification, and switching applications across industries.

2. Main Types and Functional Classification

Type	Functional Characteristics	Application Examples
Junction FET (JFET)	Voltage-controlled depletion mode operation, low noise	Low-noise amplifiers, analog switches
Enhancement Mode MOSFET	Normally-off device, requires positive V_GS to conduct	Power supplies, motor drives
Depletion Mode MOSFET	Normally-on device, requires negative V_GS to block	Radio frequency amplifiers, load switches
Insulated Gate Bipolar Transistor (IGBT)	Combines MOSFET input with bipolar output, high current capacity	High-power industrial equipment, electric vehicles

3. Structure and Composition

A typical MOSFET structure includes three terminals: Source, Gate, and Drain. The gate is insulated by a thin layer of silicon dioxide (SiO₂), forming a capacitive control interface. The channel between source and drain is formed in a silicon substrate. Advanced devices use materials like silicon carbide (SiC) or gallium nitride (GaN) for higher performance. Packaging options include TO-220, DPAK, and SOT-23 for different thermal and space requirements.

4. Key Technical Specifications

Parameter	Description and Importance
V_DS (Drain-Source Voltage)	Maximum voltage rating between drain and source; determines breakdown tolerance
I_D (Drain Current)	Maximum continuous current capacity; critical for power handling
R_DS(on)	On-state resistance; impacts conduction losses and efficiency
V_GS(th) (Threshold Voltage)	Voltage required to form channel; determines control signal compatibility
Q_G (Gate Charge)	Charge required for switching; affects switching speed and driver requirements
P_D (Power Dissipation)	Maximum power handling capability; dictates thermal management needs

5. Application Fields

Consumer Electronics: Mobile phone chargers, notebook power adapters
Industrial: Motor drives, uninterruptible power supplies (UPS)
Automotive: Electric vehicle (EV) battery management systems, HEV inverters
Telecommunications: Base station power amplifiers, optical network transceivers
Renewable Energy: Solar micro-inverters, wind turbine converters

6. Leading Manufacturers and Products

Manufacturer	Representative Product	Key Features
Texas Instruments	CSD18534Q5A	60V, 4.2m R_DS(on), automotive-grade
STMicroelectronics	STP55NF06	55A, 60V, high-speed switching
Infineon Technologies	IPB041N06N3	0.41 , 600V, TO-220 package
ON Semiconductor	NDS355AN	Depletion mode, 300mA, RF applications

7. Selection Guidelines

Key considerations include:

Voltage and current requirements under operating conditions
Thermal performance (R_DS(on), package thermal resistance)
Switching speed vs. conduction loss trade-off
Gate drive compatibility with control circuitry
Environmental factors (temperature, vibration, humidity)
Cost-performance balance for volume production

8. Industry Trends

Current trends include:

Adoption of wide bandgap materials (SiC, GaN) for higher efficiency
Advanced packaging technologies (double-sided cooling, copper clip)
Integration with gate drivers and protection circuits
Miniaturization through trench and shielded gate structures
Development of automotive-qualified devices for EVs and ADAS