Transistors - FETs, MOSFETs - Single

Image Part Number Description / PDF Quantity Rfq
RM2309E

RM2309E

Rectron USA

MOSFET P-CHANNEL 30V SOT23

0

RM180N60T2

RM180N60T2

Rectron USA

MOSFET N-CH 60V 180A TO220-3

0

RM2302

RM2302

Rectron USA

MOSFET N-CHANNEL 20V 4A SOT23

0

RM50N60TI

RM50N60TI

Rectron USA

MOSFET N-CHANNEL 60V 50A TO220F

0

RM10N100LD

RM10N100LD

Rectron USA

MOSFET N-CH 100V 10A TO252-2

0

RM70P40LD

RM70P40LD

Rectron USA

MOSFET P-CHANNEL 40V 70A TO252-2

0

RMP3N90IP

RMP3N90IP

Rectron USA

MOSFET N-CHANNEL 900V 3A TO251

0

RM4N650IP

RM4N650IP

Rectron USA

MOSFET N-CHANNEL 650V 4A TO251

0

RM11N800TI

RM11N800TI

Rectron USA

MOSFET N-CHANNEL 800V 11A TO220F

0

RM8N650LD

RM8N650LD

Rectron USA

MOSFET N-CHANNEL 650V 8A TO252-2

0

RM16P60LD

RM16P60LD

Rectron USA

MOSFET P-CHANNEL 60V 16A TO252-2

0

RM12N100S8

RM12N100S8

Rectron USA

MOSFET N-CHANNEL 100V 12A 8SOP

0

RM40N200TI

RM40N200TI

Rectron USA

MOSFET N-CHANNEL 200V 40A TO220F

0

RM3010S6

RM3010S6

Rectron USA

MOSFET N-CHANNEL 30V 10A SOT23-6

0

RM110N82T2

RM110N82T2

Rectron USA

MOSFET N-CH 82V 110A TO220-3

0

RM140N82T2

RM140N82T2

Rectron USA

MOSFET N-CH 82V 140A TO220-3

0

RM50N60DF

RM50N60DF

Rectron USA

MOSFET N-CHANNEL 60V 50A 8DFN

0

RM4N700S4

RM4N700S4

Rectron USA

MOSFET N-CH 700V 4A SOT223-2

0

RM120N85T2

RM120N85T2

Rectron USA

MOSFET N-CH 85V 120A TO220-3

0

RM8N650TI

RM8N650TI

Rectron USA

MOSFET N-CHANNEL 650V 8A TO220F

0

Transistors - FETs, MOSFETs - Single

1. Overview

Field-Effect Transistors (FETs) and Metal-Oxide-Semiconductor FETs (MOSFETs) are voltage-controlled semiconductor devices that regulate current flow through an electric field. As fundamental components in modern electronics, they offer advantages such as high input impedance, low power consumption, and fast switching capabilities. Single discrete FETs/MOSFETs are widely used in power management, signal amplification, and switching applications across industries.

2. Main Types and Functional Classification

TypeFunctional CharacteristicsApplication Examples
Junction FET (JFET)Voltage-controlled depletion mode operation, low noiseLow-noise amplifiers, analog switches
Enhancement Mode MOSFETNormally-off device, requires positive VGS to conductPower supplies, motor drives
Depletion Mode MOSFETNormally-on device, requires negative VGS to blockRadio frequency amplifiers, load switches
Insulated Gate Bipolar Transistor (IGBT)Combines MOSFET input with bipolar output, high current capacityHigh-power industrial equipment, electric vehicles

3. Structure and Composition

A typical MOSFET structure includes three terminals: Source, Gate, and Drain. The gate is insulated by a thin layer of silicon dioxide (SiO2), forming a capacitive control interface. The channel between source and drain is formed in a silicon substrate. Advanced devices use materials like silicon carbide (SiC) or gallium nitride (GaN) for higher performance. Packaging options include TO-220, DPAK, and SOT-23 for different thermal and space requirements.

4. Key Technical Specifications

ParameterDescription and Importance
VDS (Drain-Source Voltage)Maximum voltage rating between drain and source; determines breakdown tolerance
ID (Drain Current)Maximum continuous current capacity; critical for power handling
RDS(on)On-state resistance; impacts conduction losses and efficiency
VGS(th) (Threshold Voltage)Voltage required to form channel; determines control signal compatibility
QG (Gate Charge)Charge required for switching; affects switching speed and driver requirements
PD (Power Dissipation)Maximum power handling capability; dictates thermal management needs

5. Application Fields

  • Consumer Electronics: Mobile phone chargers, notebook power adapters
  • Industrial: Motor drives, uninterruptible power supplies (UPS)
  • Automotive: Electric vehicle (EV) battery management systems, HEV inverters
  • Telecommunications: Base station power amplifiers, optical network transceivers
  • Renewable Energy: Solar micro-inverters, wind turbine converters

6. Leading Manufacturers and Products

ManufacturerRepresentative ProductKey Features
Texas InstrumentsCSD18534Q5A60V, 4.2m RDS(on), automotive-grade
STMicroelectronicsSTP55NF0655A, 60V, high-speed switching
Infineon TechnologiesIPB041N06N30.41 , 600V, TO-220 package
ON SemiconductorNDS355ANDepletion mode, 300mA, RF applications

7. Selection Guidelines

Key considerations include:

  • Voltage and current requirements under operating conditions
  • Thermal performance (RDS(on), package thermal resistance)
  • Switching speed vs. conduction loss trade-off
  • Gate drive compatibility with control circuitry
  • Environmental factors (temperature, vibration, humidity)
  • Cost-performance balance for volume production

8. Industry Trends

Current trends include:

  • Adoption of wide bandgap materials (SiC, GaN) for higher efficiency
  • Advanced packaging technologies (double-sided cooling, copper clip)
  • Integration with gate drivers and protection circuits
  • Miniaturization through trench and shielded gate structures
  • Development of automotive-qualified devices for EVs and ADAS

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