| Image | Part Number | Description / PDF | Quantity | Rfq |
|---|---|---|---|---|
 |
Sanyo Semiconductor/ON Semiconductor |
MOSFET 2N-CH 30V 7.5A 8SOIC |
5143 |
|
 |
Sanyo Semiconductor/ON Semiconductor |
T6 40V LL S08FL DS |
3000 |
|
 |
Zetex Semiconductors (Diodes Inc.) |
MOSFET BVDSS: 8V 24V U-DFN2020-6 |
0 |
|
 |
IR (Infineon Technologies) |
MOSFET 2N-CH 30V 8.1A 8SOIC |
0 |
|
 |
STMicroelectronics |
MOSFET 2N-CH 30V 3A 8SOIC |
5335 |
|
 |
IR (Infineon Technologies) |
AUTOMOTIVE HEXFET P-CHANNEL |
0 |
|
 |
IR (Infineon Technologies) |
COOLMOS N-CHANNEL POWER MOSFET |
252040 |
|
 |
Zetex Semiconductors (Diodes Inc.) |
MOSFET 2N-CH 60V 4.3A 8-SOIC |
2974 |
|
 |
Zetex Semiconductors (Diodes Inc.) |
MOSFET 2P-CH 50V 0.16A SOT-563 |
2147483647 |
|
 |
Zetex Semiconductors (Diodes Inc.) |
MOSFET 2N-CH 20V 11A U-DFN2535-6 |
28949000 |
|
 |
ROHM Semiconductor |
4V DRIVE NCH+PCH MOSFET. SH8M51 |
2500 |
|
 |
Vishay / Siliconix |
MOSFET 2N-CH 20V 5.4A 10-MFP |
0 |
|
 |
Vishay / Siliconix |
MOSFET 2N-CH 60V 5.3A 8-SOIC |
52 |
|
 |
Micro Commercial Components (MCC) |
N/P-CHANNELMOSFETSOT-563 |
65789 |
|
 |
IR (Infineon Technologies) |
MOSFET 55V 4.7A/3.4A 8SO |
0 |
|
 |
Vishay / Siliconix |
MOSFET 2N-CH 60V 6.5A 8-SOIC |
444 |
|
 |
Sanyo Semiconductor/ON Semiconductor |
MOSFET 2P-CH 60V 2.5A VEC8 |
177 |
|
 |
Alpha and Omega Semiconductor, Inc. |
MOSFET 2N-CH 30V 14A/18A 8DFN |
0 |
|
 |
Sanyo Semiconductor/ON Semiconductor |
NCH 12V 15A WLCSP DUAL |
483795000 |
|
 |
Nexperia |
MOSFET 2N-CH 40V 30A 56LFPAK |
1153 |
|
Field-Effect Transistors (FETs) and Metal-Oxide-Semiconductor FETs (MOSFETs) arrays are multi-transistor packages integrating multiple discrete FET/MOSFET devices in a single housing. These arrays provide compact solutions for high-density electronic systems while maintaining individual transistor functionality. They play a critical role in modern electronics by enabling efficient power management, signal processing, and switching applications across industries.
| Type | Functional Features | Application Examples |
|---|---|---|
| JFET Array | Low noise, high input impedance | Analog switches, RF amplifiers |
| MOSFET Array (Enhancement) | High switching speed, low on-resistance | Power supplies, motor drivers |
| MOSFET Array (Depletion) | Normally-on behavior, high durability | Level shifters, analog circuits |
| HEMT Array | High electron mobility, microwave performance | Satellite communication, radar systems |
Typical FET/MOSFET arrays consist of: - Silicon/compound semiconductor die with gate-source-drain terminals - Common packaging formats: DIP, SIP, QFN, or custom lead frames - Monolithic integration with shared substrate or isolation trenches - Gate oxide layers (1-10nm) and metal interconnects - Advanced variants use trench/gate-all-around structures for improved performance
| Parameter | Description | Importance |
|---|---|---|
| RDS(on) | On-state resistance | Impacts conduction loss and efficiency |
| VDS(max) | Max drain-source voltage | Determines voltage rating |
| ID(max) | Max continuous drain current | Defines current handling capability |
| Qg | Gate charge | Affects switching speed and driver requirements |
| Thermal Resistance | Junction-to-ambient resistance | Crucial for thermal management |
| Manufacturer | Representative Products | Key Features |
|---|---|---|
| Infineon Technologies | BTS724GX | Smart power MOSFET array with diagnostic functions |
| STMicroelectronics | IPD90N03S4-01 | High-side switch with 90A rating |
| ON Semiconductor | NVN4080 | Automotive-qualified 80V intelligent power array |
| Nexperia | PMBT2369 | High-speed JFET array for RF applications |
Key considerations: - Electrical requirements (voltage, current, frequency) - Thermal management capability (package thermal performance) - Integration level (number of transistors per package) - Cost vs. performance trade-offs - Automotive/industrial grade requirements (temperature range, reliability) - Example: For EV onboard chargers, select SiC MOSFET arrays with >650V rating and low RDS(on)
Current development trends include: - Transition to wide bandgap materials (SiC, GaN) for higher efficiency - 3D packaging integration for reduced parasitic inductance - Intelligent power arrays with embedded sensors - Market growth driven by EVs, 5G infrastructure, and renewable energy systems - Miniaturization through chip-scale packaging technologies