Transistors - Bipolar (BJT) - Single

Image Part Number Description / PDF Quantity Rfq
JANTX2N3499L

JANTX2N3499L

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TRANS NPN 100V 0.5A TO5

0

JAN2N5238S

JAN2N5238S

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TRANS NPN 170V 10A TO39

0

2N333AT2

2N333AT2

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NPN POWER SILICON TRANSISTORS

0

JANSR2N2222AUB

JANSR2N2222AUB

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RH SMALL-SIGNAL BJT

0

JANTX2N3498L

JANTX2N3498L

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TRANS NPN 100V 0.5A TO5

0

JANSR2N2369AUB

JANSR2N2369AUB

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TRANS NPN 15V SMD

0

JAN2N6308

JAN2N6308

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TRANS NPN 350V 8A TO3

0

2N3507AL

2N3507AL

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NPN POWER SILICON TRANSISTORS

0

JAN2N3506AL

JAN2N3506AL

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TRANS NPN 40V 3A TO5

0

JANTXV2N3419S

JANTXV2N3419S

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TRANS NPN 80V 3A

0

2N6678T1

2N6678T1

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NPN TRANSISTOR

0

2N2895

2N2895

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PNP TRANSISTOR

0

JANTX2N6384

JANTX2N6384

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TRANS NPN DARL 60V 10A TO3

0

JAN2N6277

JAN2N6277

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TRANS NPN 150V 50A TO-3

0

JANTXV2N6058

JANTXV2N6058

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TRANS NPN DARL 80V 12A TO-3

0

JANTX2N1711

JANTX2N1711

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TRANS NPN 30V 0.5A TO-5

0

JANTXV2N6051

JANTXV2N6051

Roving Networks / Microchip Technology

TRANS PNP DARL 80V 12A TO-3

0

2N3421

2N3421

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NPN POWER SILICON TRANSISTORS

0

JANTXV2N3999

JANTXV2N3999

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TRANS NPN 80V 10A TO59

0

JAN2N6283

JAN2N6283

Roving Networks / Microchip Technology

TRANS NPN DARL 80V 20A TO-3

0

Transistors - Bipolar (BJT) - Single

1. Overview

Bipolar Junction Transistors (BJTs) are three-terminal semiconductor devices that use both electron and hole charge carriers. They form the foundation of analog electronics through their ability to amplify signals and control current flow. BJTs remain critical in modern electronics for applications ranging from audio amplifiers to power management circuits, offering superior linearity and robustness in switching operations.

2. Main Types & Functional Classification

TypeFunctional CharacteristicsApplication Examples
NPN TransistorMajority carriers: electrons. Requires positive base current for conduction.Low-noise amplifiers, digital logic circuits
PNP TransistorMajority carriers: holes. Conducts with negative base current.Power supply circuits, motor controllers
High-Frequency BJTOptimized for RF/microwave signal amplification (fT > 100 MHz)Wireless communication systems, radar
Power BJTHigh current/voltage ratings (IC > 1A, VCE > 50V)Switch-mode power supplies, motor drives

3. Structure & Composition

BJTs consist of three doped semiconductor regions forming two p-n junctions:

  • Emitter: Heavily doped region emitting charge carriers
  • Base: Thin, lightly doped middle region controlling carrier flow
  • Collector: Moderately doped region collecting carriers

Manufactured using silicon (common) or germanium (historic) with planar processing technology. The structure forms either NPN (n-type emitter/base/collector) or PNP configuration, with metal contacts for external connections.

4. Key Technical Specifications

ParameterDescriptionImportance
Current Gain (hFE)Ratio of collector to base current (10-1000)Determines amplification capability
Transition Frequency (fT)Frequency at which current gain drops to 1Limits high-frequency performance
Max Collector Current (ICmax)Maximum allowable continuous collector currentDefines power handling capability
Breakdown Voltage (VCEO)Max voltage between collector and emitterPrevents device failure under stress
Saturation Voltage (VCEsat)Voltage drop in fully conducting stateAffects power efficiency in switching

5. Application Areas

  • Consumer Electronics: Audio amplifiers, LED drivers
  • Automotive: Engine control units, electric vehicle inverters
  • Industrial: PLCs, motor controllers
  • Telecommunications: RF power amplifiers, fiber optic transceivers
  • Aerospace: Avionics systems, satellite transponders

6. Leading Manufacturers & Products

ManufacturerProduct SeriesKey SpecificationsTypical Use
ON Semiconductor2N3904hFE: 100-300, fT: 300 MHzGeneral-purpose switching
InfineonBC547VCEO: 50V, ICmax: 100mAAnalog signal amplification
STMicroelectronics2SD2656ICmax: 15A, VCEO: 80VPower inverter applications
Diodes Inc.BFR93AfT: 10 GHz, Noise Figure: 2dBHigh-frequency front-end amplifiers

7. Selection Guidelines

  • Determine operating frequency: Select fT > 3 target frequency
  • Power requirements: Ensure Icmax and VCEO exceed circuit requirements by 20%
  • Thermal considerations: Calculate power dissipation (P=VCE IC)
  • Package type: TO-92 for low power, TO-220 for high-power applications
  • Environmental factors: Consider temperature ratings for industrial/military use

8. Industry Trends

Future developments include:

  • High-frequency BJTs operating beyond 100 GHz for 6G communication
  • Integrated BJT-MOSFET hybrid devices (BiCMOS) for mixed-signal applications
  • Wide-bandgap materials (SiC/GaN) for higher power density
  • Miniaturization through chip-scale packaging
  • Improved thermal management solutions for automotive applications
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