Transistors - Bipolar (BJT) - Single

Image Part Number Description / PDF Quantity Rfq
2N5415S

2N5415S

Roving Networks / Microchip Technology

PNP TRANSISTORS

0

2N2946AUB

2N2946AUB

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TRANS PNP 35V 0.1A

0

JAN2N2906AUB

JAN2N2906AUB

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TRANS PNP 60V 0.6A 3UB

0

JANTXV2N2218AL

JANTXV2N2218AL

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TRANS NPN 50V 0.8A TO5

0

2N5384

2N5384

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PNP TRANSISTORS

0

2N335T2

2N335T2

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NPN POWER SILICON TRANSISTORS

0

JAN2N708

JAN2N708

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TRANS NPN 15V

0

JANTX2N3737UB

JANTX2N3737UB

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TRANS NPN 40V 1.5A

0

JAN2N4449

JAN2N4449

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TRANS NPN 20V TO46

0

2N706A

2N706A

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NPN TRANSISTOR

0

JANTX2N7370

JANTX2N7370

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TRANS NPN DARL 100V 12A TO254

0

2N6278

2N6278

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NPN TRANSISTOR

0

JAN2N3421S

JAN2N3421S

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TRANS NPN 80V 3A TO39

0

JANTX2N708

JANTX2N708

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TRANS NPN 15V

0

2N5661U3

2N5661U3

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NPN TRANSISTOR

0

2N918

2N918

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NPN TRANSISTOR

0

JANTX2N3507

JANTX2N3507

Roving Networks / Microchip Technology

NPN TRANSISTOR

0

JANSR2N5153U3

JANSR2N5153U3

Roving Networks / Microchip Technology

RH POWER BJT

0

JANTX2N3419S

JANTX2N3419S

Roving Networks / Microchip Technology

TRANS NPN 80V 3A

0

2N5152

2N5152

Roving Networks / Microchip Technology

NPN SILICON TRANSISTOR

0

Transistors - Bipolar (BJT) - Single

1. Overview

Bipolar Junction Transistors (BJTs) are three-terminal semiconductor devices that use both electron and hole charge carriers. They form the foundation of analog electronics through their ability to amplify signals and control current flow. BJTs remain critical in modern electronics for applications ranging from audio amplifiers to power management circuits, offering superior linearity and robustness in switching operations.

2. Main Types & Functional Classification

TypeFunctional CharacteristicsApplication Examples
NPN TransistorMajority carriers: electrons. Requires positive base current for conduction.Low-noise amplifiers, digital logic circuits
PNP TransistorMajority carriers: holes. Conducts with negative base current.Power supply circuits, motor controllers
High-Frequency BJTOptimized for RF/microwave signal amplification (fT > 100 MHz)Wireless communication systems, radar
Power BJTHigh current/voltage ratings (IC > 1A, VCE > 50V)Switch-mode power supplies, motor drives

3. Structure & Composition

BJTs consist of three doped semiconductor regions forming two p-n junctions:

  • Emitter: Heavily doped region emitting charge carriers
  • Base: Thin, lightly doped middle region controlling carrier flow
  • Collector: Moderately doped region collecting carriers

Manufactured using silicon (common) or germanium (historic) with planar processing technology. The structure forms either NPN (n-type emitter/base/collector) or PNP configuration, with metal contacts for external connections.

4. Key Technical Specifications

ParameterDescriptionImportance
Current Gain (hFE)Ratio of collector to base current (10-1000)Determines amplification capability
Transition Frequency (fT)Frequency at which current gain drops to 1Limits high-frequency performance
Max Collector Current (ICmax)Maximum allowable continuous collector currentDefines power handling capability
Breakdown Voltage (VCEO)Max voltage between collector and emitterPrevents device failure under stress
Saturation Voltage (VCEsat)Voltage drop in fully conducting stateAffects power efficiency in switching

5. Application Areas

  • Consumer Electronics: Audio amplifiers, LED drivers
  • Automotive: Engine control units, electric vehicle inverters
  • Industrial: PLCs, motor controllers
  • Telecommunications: RF power amplifiers, fiber optic transceivers
  • Aerospace: Avionics systems, satellite transponders

6. Leading Manufacturers & Products

ManufacturerProduct SeriesKey SpecificationsTypical Use
ON Semiconductor2N3904hFE: 100-300, fT: 300 MHzGeneral-purpose switching
InfineonBC547VCEO: 50V, ICmax: 100mAAnalog signal amplification
STMicroelectronics2SD2656ICmax: 15A, VCEO: 80VPower inverter applications
Diodes Inc.BFR93AfT: 10 GHz, Noise Figure: 2dBHigh-frequency front-end amplifiers

7. Selection Guidelines

  • Determine operating frequency: Select fT > 3 target frequency
  • Power requirements: Ensure Icmax and VCEO exceed circuit requirements by 20%
  • Thermal considerations: Calculate power dissipation (P=VCE IC)
  • Package type: TO-92 for low power, TO-220 for high-power applications
  • Environmental factors: Consider temperature ratings for industrial/military use

8. Industry Trends

Future developments include:

  • High-frequency BJTs operating beyond 100 GHz for 6G communication
  • Integrated BJT-MOSFET hybrid devices (BiCMOS) for mixed-signal applications
  • Wide-bandgap materials (SiC/GaN) for higher power density
  • Miniaturization through chip-scale packaging
  • Improved thermal management solutions for automotive applications
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