Transistors - Bipolar (BJT) - Single

Image Part Number Description / PDF Quantity Rfq
2N5005

2N5005

Roving Networks / Microchip Technology

NPN SILICON TRANSISTOR

0

JAN2N2218AL

JAN2N2218AL

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TRANS NPN 50V 0.8A TO5

0

2N3418S

2N3418S

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NPN POWER SILICON TRANSISTORS

0

JAN2N5151L

JAN2N5151L

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TRANS PNP 80V 2A TO5

0

JANTX2N4399

JANTX2N4399

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TRANS PNP 60V 30A TO-3

0

JAN2N5416UA

JAN2N5416UA

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TRANS PNP 300V 1A

0

JANTX2N3700UB/TR

JANTX2N3700UB/TR

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SMALL-SIGNAL BJT

0

JAN2N3767

JAN2N3767

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TRANS NPN 80V 4A

0

JANTX2N3507AL

JANTX2N3507AL

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TRANS NPN 50V 3A TO5

0

2N3057A

2N3057A

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TRANS NPN 80V 1A TO-46

0

2N5238

2N5238

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NPN TRANSISTOR

0

2N333T2

2N333T2

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NPN POWER SILICON TRANSISTORS

0

2N4911

2N4911

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NPN SILICON TRANSISTOR

0

JAN2N4238

JAN2N4238

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TRANS NPN 60V 1A TO39

0

2N2222AL

2N2222AL

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TRANS NPN 50V 0.8A TO-18

0

JANTX2N2907AUA/TR

JANTX2N2907AUA/TR

Roving Networks / Microchip Technology

SMALL-SIGNAL BJT

0

2N5151

2N5151

Roving Networks / Microchip Technology

NPN SILICON TRANSISTOR

0

2N5051

2N5051

Roving Networks / Microchip Technology

NPN SILICON TRANSISTOR

0

2N3250A

2N3250A

Roving Networks / Microchip Technology

TRANS PNP 60V 0.2A TO18

0

JAN2N6300

JAN2N6300

Roving Networks / Microchip Technology

TRANS NPN DARL 60V 8A TO66

0

Transistors - Bipolar (BJT) - Single

1. Overview

Bipolar Junction Transistors (BJTs) are three-terminal semiconductor devices that use both electron and hole charge carriers. They form the foundation of analog electronics through their ability to amplify signals and control current flow. BJTs remain critical in modern electronics for applications ranging from audio amplifiers to power management circuits, offering superior linearity and robustness in switching operations.

2. Main Types & Functional Classification

TypeFunctional CharacteristicsApplication Examples
NPN TransistorMajority carriers: electrons. Requires positive base current for conduction.Low-noise amplifiers, digital logic circuits
PNP TransistorMajority carriers: holes. Conducts with negative base current.Power supply circuits, motor controllers
High-Frequency BJTOptimized for RF/microwave signal amplification (fT > 100 MHz)Wireless communication systems, radar
Power BJTHigh current/voltage ratings (IC > 1A, VCE > 50V)Switch-mode power supplies, motor drives

3. Structure & Composition

BJTs consist of three doped semiconductor regions forming two p-n junctions:

  • Emitter: Heavily doped region emitting charge carriers
  • Base: Thin, lightly doped middle region controlling carrier flow
  • Collector: Moderately doped region collecting carriers

Manufactured using silicon (common) or germanium (historic) with planar processing technology. The structure forms either NPN (n-type emitter/base/collector) or PNP configuration, with metal contacts for external connections.

4. Key Technical Specifications

ParameterDescriptionImportance
Current Gain (hFE)Ratio of collector to base current (10-1000)Determines amplification capability
Transition Frequency (fT)Frequency at which current gain drops to 1Limits high-frequency performance
Max Collector Current (ICmax)Maximum allowable continuous collector currentDefines power handling capability
Breakdown Voltage (VCEO)Max voltage between collector and emitterPrevents device failure under stress
Saturation Voltage (VCEsat)Voltage drop in fully conducting stateAffects power efficiency in switching

5. Application Areas

  • Consumer Electronics: Audio amplifiers, LED drivers
  • Automotive: Engine control units, electric vehicle inverters
  • Industrial: PLCs, motor controllers
  • Telecommunications: RF power amplifiers, fiber optic transceivers
  • Aerospace: Avionics systems, satellite transponders

6. Leading Manufacturers & Products

ManufacturerProduct SeriesKey SpecificationsTypical Use
ON Semiconductor2N3904hFE: 100-300, fT: 300 MHzGeneral-purpose switching
InfineonBC547VCEO: 50V, ICmax: 100mAAnalog signal amplification
STMicroelectronics2SD2656ICmax: 15A, VCEO: 80VPower inverter applications
Diodes Inc.BFR93AfT: 10 GHz, Noise Figure: 2dBHigh-frequency front-end amplifiers

7. Selection Guidelines

  • Determine operating frequency: Select fT > 3 target frequency
  • Power requirements: Ensure Icmax and VCEO exceed circuit requirements by 20%
  • Thermal considerations: Calculate power dissipation (P=VCE IC)
  • Package type: TO-92 for low power, TO-220 for high-power applications
  • Environmental factors: Consider temperature ratings for industrial/military use

8. Industry Trends

Future developments include:

  • High-frequency BJTs operating beyond 100 GHz for 6G communication
  • Integrated BJT-MOSFET hybrid devices (BiCMOS) for mixed-signal applications
  • Wide-bandgap materials (SiC/GaN) for higher power density
  • Miniaturization through chip-scale packaging
  • Improved thermal management solutions for automotive applications
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