Transistors - Bipolar (BJT) - Single

Image Part Number Description / PDF Quantity Rfq
2N706

2N706

Roving Networks / Microchip Technology

NPN TRANSISTOR

0

JANTXV2N6383

JANTXV2N6383

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TRANS NPN DARL 40V 10A TO3

0

JAN2N3634

JAN2N3634

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TRANS PNP 140V 1A

0

2N2906AUB

2N2906AUB

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TRANS PNP 60V 0.6A

0

JAN2N2880

JAN2N2880

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TRANS NPN 80V 5A TO59

0

2N1717S

2N1717S

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NPN TRANSISTOR

0

JAN2N5415S

JAN2N5415S

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TRANS PNP 200V 1A TO39

0

JANTXV2N2904A

JANTXV2N2904A

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TRANS PNP 60V 0.6A TO-39

0

2N1479

2N1479

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NPN TRANSISTOR

0

2N6281

2N6281

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NPN TRANSISTOR

0

JANTX2N3635

JANTX2N3635

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TRANS PNP 140V 1A

0

2N697S

2N697S

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NPN TRANSISTOR

0

JAN2N3418S

JAN2N3418S

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TRANS NPN 60V 3A

0

2N3868

2N3868

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PNP TRANSISTOR

0

2N5665

2N5665

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NPN TRANSISTOR

0

2N5385

2N5385

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PNP TRANSISTORS

0

JAN2N3749

JAN2N3749

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TRANS NPN 80V 5A TO111

0

2N3867

2N3867

Roving Networks / Microchip Technology

PNP TRANSISTOR

0

JANTX2N5681

JANTX2N5681

Roving Networks / Microchip Technology

PNP TRANSISTOR

0

JAN2N5666

JAN2N5666

Roving Networks / Microchip Technology

TRANS NPN 200V 5A TO5

0

Transistors - Bipolar (BJT) - Single

1. Overview

Bipolar Junction Transistors (BJTs) are three-terminal semiconductor devices that use both electron and hole charge carriers. They form the foundation of analog electronics through their ability to amplify signals and control current flow. BJTs remain critical in modern electronics for applications ranging from audio amplifiers to power management circuits, offering superior linearity and robustness in switching operations.

2. Main Types & Functional Classification

TypeFunctional CharacteristicsApplication Examples
NPN TransistorMajority carriers: electrons. Requires positive base current for conduction.Low-noise amplifiers, digital logic circuits
PNP TransistorMajority carriers: holes. Conducts with negative base current.Power supply circuits, motor controllers
High-Frequency BJTOptimized for RF/microwave signal amplification (fT > 100 MHz)Wireless communication systems, radar
Power BJTHigh current/voltage ratings (IC > 1A, VCE > 50V)Switch-mode power supplies, motor drives

3. Structure & Composition

BJTs consist of three doped semiconductor regions forming two p-n junctions:

  • Emitter: Heavily doped region emitting charge carriers
  • Base: Thin, lightly doped middle region controlling carrier flow
  • Collector: Moderately doped region collecting carriers

Manufactured using silicon (common) or germanium (historic) with planar processing technology. The structure forms either NPN (n-type emitter/base/collector) or PNP configuration, with metal contacts for external connections.

4. Key Technical Specifications

ParameterDescriptionImportance
Current Gain (hFE)Ratio of collector to base current (10-1000)Determines amplification capability
Transition Frequency (fT)Frequency at which current gain drops to 1Limits high-frequency performance
Max Collector Current (ICmax)Maximum allowable continuous collector currentDefines power handling capability
Breakdown Voltage (VCEO)Max voltage between collector and emitterPrevents device failure under stress
Saturation Voltage (VCEsat)Voltage drop in fully conducting stateAffects power efficiency in switching

5. Application Areas

  • Consumer Electronics: Audio amplifiers, LED drivers
  • Automotive: Engine control units, electric vehicle inverters
  • Industrial: PLCs, motor controllers
  • Telecommunications: RF power amplifiers, fiber optic transceivers
  • Aerospace: Avionics systems, satellite transponders

6. Leading Manufacturers & Products

ManufacturerProduct SeriesKey SpecificationsTypical Use
ON Semiconductor2N3904hFE: 100-300, fT: 300 MHzGeneral-purpose switching
InfineonBC547VCEO: 50V, ICmax: 100mAAnalog signal amplification
STMicroelectronics2SD2656ICmax: 15A, VCEO: 80VPower inverter applications
Diodes Inc.BFR93AfT: 10 GHz, Noise Figure: 2dBHigh-frequency front-end amplifiers

7. Selection Guidelines

  • Determine operating frequency: Select fT > 3 target frequency
  • Power requirements: Ensure Icmax and VCEO exceed circuit requirements by 20%
  • Thermal considerations: Calculate power dissipation (P=VCE IC)
  • Package type: TO-92 for low power, TO-220 for high-power applications
  • Environmental factors: Consider temperature ratings for industrial/military use

8. Industry Trends

Future developments include:

  • High-frequency BJTs operating beyond 100 GHz for 6G communication
  • Integrated BJT-MOSFET hybrid devices (BiCMOS) for mixed-signal applications
  • Wide-bandgap materials (SiC/GaN) for higher power density
  • Miniaturization through chip-scale packaging
  • Improved thermal management solutions for automotive applications
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