Transistors - Bipolar (BJT) - RF

Image Part Number Description / PDF Quantity Rfq
AT-42085G

AT-42085G

Broadcom

RF TRANS NPN 12V 8GHZ 85 PLASTIC

0

BFG 196 E6327

BFG 196 E6327

IR (Infineon Technologies)

RF TRANS NPN 12V 7.5GHZ SOT223-4

0

BF494_D27Z

BF494_D27Z

Sanyo Semiconductor/ON Semiconductor

RF TRANS NPN 20V TO92-3

0

NE85639-T1-A

NE85639-T1-A

CEL (California Eastern Laboratories)

RF TRANS NPN 12V 9GHZ SOT143

0

BLS3135-50,114

BLS3135-50,114

NXP Semiconductors

RF TRANS NPN 75V 3.5GHZ CDFM2

0

BFR 360T E6327

BFR 360T E6327

IR (Infineon Technologies)

RF TRANS NPN 9V 14GHZ SC75

0

MPSH17_D27Z

MPSH17_D27Z

Sanyo Semiconductor/ON Semiconductor

RF TRANS NPN 15V 800MHZ TO92-3

0

BFS17SH6327XTSA1

BFS17SH6327XTSA1

IR (Infineon Technologies)

RF TRANS 2NPN 15V 1.4GHZ SOT363

0

AT-32032-TR1G

AT-32032-TR1G

Broadcom

RF TRANS NPN 5.5V SC70-3

0

60159

60159

Microsemi

RF POWER TRANSISTOR

0

BFS17TA

BFS17TA

Zetex Semiconductors (Diodes Inc.)

RF TRANS NPN 15V 1.3GHZ SOT23-3

0

PN918

PN918

Sanyo Semiconductor/ON Semiconductor

RF TRANS NPN 15V 600MHZ TO92-3

0

JANTX2N2857

JANTX2N2857

Microsemi

RF TRANS NPN 15V 500MHZ TO72

0

MPSH10_D26Z

MPSH10_D26Z

Sanyo Semiconductor/ON Semiconductor

RF TRANS NPN 25V 650MHZ TO92-3

0

MRF555T

MRF555T

Microsemi

RF TRANS NPN 16V POWER MACRO

0

NE68018-A

NE68018-A

CEL (California Eastern Laboratories)

RF TRANS NPN 10V 10GHZ SOT343

0

MRF8372

MRF8372

Microsemi

RF TRANS NPN 16V 870MHZ 8SO

0

BFP182WE6327HTSA1

BFP182WE6327HTSA1

IR (Infineon Technologies)

RF TRANS NPN 12V 8GHZ SOT343-4

0

2N4957UB

2N4957UB

Microsemi

RF TRANS PNP 30V 30MA UB

0

SD1446

SD1446

STMicroelectronics

RF TRANS NPN 18V M113

0

Transistors - Bipolar (BJT) - RF

1. Overview

Radio Frequency Bipolar Junction Transistors (RF BJTs) are three-layer semiconductor devices optimized for amplification and switching in high-frequency applications (typically >100 MHz). These transistors maintain stable performance in microwave and ultra-high frequency (UHF) ranges, characterized by high current gain-bandwidth product (fT), low noise figures, and fast switching capabilities. Their importance in modern technology spans wireless communication infrastructure, radar systems, and RF test equipment, enabling efficient signal transmission and reception in 5G networks, satellite communications, and IoT devices.

2. Main Types & Functional Classification

TypeFunctional FeaturesApplication Examples
NPN RF BJTHigh electron mobility, optimized for low-noise amplification5G base station LNAs, GPS receivers
PNP RF BJTComplementary design for power amplificationRF power modules, automotive radar
RF Darlington PairHigh (current gain), cascaded amplificationAntenna drivers, industrial RF heaters
Heterojunction Bipolar Transistor (HBT)Compound semiconductor materials (SiGe/GaAs), ultra-high fTOptical communication transceivers, mmWave systems

3. Structure & Composition

Typical RF BJT structure includes:

  • Material: Silicon (Si), Silicon-Germanium (SiGe), Gallium Arsenide (GaAs)
  • Layer Architecture: Emitter (high doping), Base (thin layer), Collector (graded doping)
  • Package Types: Surface-mount (SOT-89, SOT-343), Through-hole (TO-18, TO-92)
  • Metallization: Gold/aluminum contacts for reduced parasitic resistance

Advanced designs incorporate air-bridge structures to minimize parasitic capacitance and epitaxial layers for improved frequency response.

4. Key Technical Parameters

ParameterDescriptionTypical Range
fT (Transition Frequency)Current gain cutoff frequency1 GHz - 100 GHz
GUM (Max. Available Gain)Power gain at optimal impedance10 dB - 30 dB
Pout (Output Power)RMS power capability0.1 W - 500 W
NF (Noise Figure)Signal-to-noise degradation0.3 dB - 5 dB
VCE0 (Breakdown Voltage)Collector-emitter withstand voltage5 V - 80 V
(Junction Temperature)Thermal stability limit150 C - 200 C

5. Application Fields

  • Telecommunications: 5G massive MIMO amplifiers, fiber optic transceivers
  • Defense: Phased array radar systems, electronic warfare jammers
  • Test & Measurement: RF signal generators, spectrum analyzers
  • Consumer Electronics: Bluetooth LE modules, Wi-Fi 6E front-ends
  • Industrial: Plasma generators, RFID readers

6. Leading Manufacturers & Products

ManufacturerRepresentative ProductKey Specifications
Infineon TechnologiesBFP740FfT=50 GHz, NF=0.8 dB, Pout=18 dBm
STMicroelectronicsSTAG21412.7 GHz dual-stage amplifier, 32 dB gain
Skyworks SolutionsASK240110.05-6 GHz, 50 W GaAs power transistor
ON SemiconductorMRF151G125 W, 880 MHz, 40% efficiency

7. Selection Guidelines

Key considerations:

  1. Match fT to application frequency with 20% margin
  2. Verify load-line requirements for power applications
  3. Select appropriate package for thermal dissipation (e.g., TO-220 for >50 W)
  4. Derate VCE0 by 30% in high-temperature environments
  5. Consider integrated solutions (RFICs) for complex impedance matching

8. Industry Trends

Future development directions:

  • Transition to SiGe BiCMOS technology for 100+ GHz applications
  • Integration with GaN-on-SiC substrates for hybrid power amplifiers
  • Development of 5G NR direct-conversion transmitters using HBT arrays
  • Advancements in wafer-level packaging (WLP) for mmWave 5G devices
  • Adoption of AI-driven parameter optimization in production testing
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