Transistors - Bipolar (BJT) - Arrays, Pre-Biased

Image Part Number Description / PDF Quantity Rfq
XP0611500L

XP0611500L

Panasonic

TRANS PREBIAS DUAL PNP SMINI6

0

XP0339000L

XP0339000L

Panasonic

TRANS PREBIAS NPN/PNP SMINI5

0

XP0111600L

XP0111600L

Panasonic

TRANS PREBIAS DUAL PNP SMINI5

0

DMC564060R

DMC564060R

Panasonic

TRANS PREBIAS DUAL NPN SMINI6

0

XP0431N00L

XP0431N00L

Panasonic

TRANS PREBIAS NPN/PNP SMINI6

0

UP0411300L

UP0411300L

Panasonic

TRANS PREBIAS DUAL PNP SSMINI6

0

XP0411100L

XP0411100L

Panasonic

TRANS PREBIAS DUAL PNP SMINI6

0

DMA264060R

DMA264060R

Panasonic

TRANS 2PNP PREBIAS 0.3W MINI6

0

XP0428600L

XP0428600L

Panasonic

TRANS PREBIAS NPN/PNP SMINI6

0

UP0411M00L

UP0411M00L

Panasonic

TRANS PREBIAS DUAL PNP SSMINI6

0

XP0411400L

XP0411400L

Panasonic

TRANS PREBIAS DUAL PNP SMINI6

0

XN0111200L

XN0111200L

Panasonic

TRANS PREBIAS DUAL PNP MINI5

0

UP04390G0L

UP04390G0L

Panasonic

TRANS PREBIAS NPN/PNP SSMINI6

0

XN0111900L

XN0111900L

Panasonic

TRANS PREBIAS DUAL PNP MINI5

0

NP063D300A

NP063D300A

Panasonic

TRANS PREBIAS NPN/PNP SSSMINI6

0

DMA561020R

DMA561020R

Panasonic

TRANS 2PNP PREBIAS 0.15W SMINI5

0

DMC5610L0R

DMC5610L0R

Panasonic

TRANS 2NPN PREBIAS 0.15W SMINI5

0

XP0111200L

XP0111200L

Panasonic

TRANS PREBIAS DUAL PNP SMINI5

0

UP0431200L

UP0431200L

Panasonic

TRANS PREBIAS NPN/PNP SSMINI6

0

XN0621100L

XN0621100L

Panasonic

TRANS PREBIAS DUAL NPN MINI6

0

Transistors - Bipolar (BJT) - Arrays, Pre-Biased

1. Overview

Pre-biased Bipolar Junction Transistor (BJT) arrays integrate multiple transistors with built-in bias resistors in a single package. These devices simplify circuit design by eliminating external resistor networks, reducing PCB footprint, and ensuring stable operation. They play a critical role in modern electronics for signal amplification, switching, and logic functions in applications ranging from consumer electronics to industrial automation.

2. Main Types and Functional Classification

TypeFunctional FeaturesApplication Examples
NPN ArraysCommon-emitter configuration with integrated base resistors for switchingDigital logic circuits, relay drivers
PNP ArraysNegative voltage switching with matched resistor ratiosMotor control, battery management
Complementary PairsMatched NPN/PNP transistors for push-pull amplifiersAudio amplifiers, power supplies
Darlington ArraysHigh current gain ( ) through cascaded transistor pairsHigh-current switching in automotive systems

3. Structure and Composition

Pre-biased BJT arrays typically use silicon epitaxial planar technology. The structure includes:

  • Dielectric Isolation: Silicon dioxide layers separate individual transistors
  • Integrated Resistors: Laser-trimmed thin-film resistors set bias points
  • Package: Standard SOT-26, SOT-89, or SOP-8 plastic packages
  • Protection Diodes: Built-in ESD protection networks

4. Key Technical Specifications

ParameterDescriptionImportance
hFE (Current Gain)Ratio of collector to base currentDetermines amplification capability
VCEO (Max Voltage)Max voltage between collector and emitterLimits operating voltage range
Ic (Max Current)Maximum collector current ratingDefines power handling capability
fT (Transition Frequency)Frequency at which gain drops to unityIndicates high-frequency performance
VCE(sat)Collector-emitter saturation voltageAffects power efficiency

5. Application Areas

Main industries and typical equipment:

  • Consumer Electronics: Mobile phones, LED displays, home appliances
  • Industrial Control: PLCs, motor drivers, sensor interfaces
  • Automotive: ECU systems, LED lighting drivers, infotainment systems
  • Telecom: Base station power amplifiers, optical transceivers

6. Leading Manufacturers and Products

ManufacturerRepresentative ProductKey Specifications
ON SemiconductorMBT3946DW1T5G100mA Ic, 40V VCEO, 100MHz fT
NexperiaPMBT2369EARDual NPN array, 300mA total current
STMicroelectronicsSMUN2232TPNP+Schottky diode array, 100mA
InfineonIPAR10L3M06Automotive-grade Darlington array

7. Selection Recommendations

Key considerations during component selection:

  • Match VCEO/Ic ratings with circuit requirements
  • Select appropriate hFE for desired gain
  • Consider thermal resistance for power applications
  • Evaluate package size vs. current density
  • Verify temperature stability (-40 C to +150 C)

8. Industry Trends

Future development directions include:

  • Higher integration levels (e.g., 8-transistor arrays in TSSOP)
  • Wide bandgap materials (SiC/GaN BJT hybrids)
  • Micron-scale packaging (0.4mm pitch QFN)
  • Smart power arrays with integrated protection circuits
  • Reduced parasitic capacitance for >5GHz RF applications
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