Evaluation Boards - Expansion Boards, Daughter Cards

Part Number	Description / PDF	Quantity
MIKROE-3145 MikroElektronika	ANYNET 3G-AA CLICK UNITED STATES	5
MIKROE-2536 MikroElektronika	EEPROM 4 CLICK	4
MIKROE-3633 MikroElektronika	MIKROMEDIA 7 CAPACITIVE SHIELD	8
MIKROE-2975 MikroElektronika	ANYNET 3G-EA CLICK (FOR EU AND A	0
MIKROE-1850 MikroElektronika	DEV BOARD GNSS CLICK	1
MIKROE-4067 MikroElektronika	FLASH 6 CLICK	16
MIKROE-1886 MikroElektronika	MAGNETO CLICK	0
MIKROE-4444 MikroElektronika	ARDUINO MKR CLICK SHIELD	5
MIKROE-3711 MikroElektronika	JOYSTICK 2 CLICK	15
MIKROE-2554 MikroElektronika	FEVER CLICK	52
MIKROE-4206 MikroElektronika	DAC 6 CLICK	4
MIKROE-4166 MikroElektronika	ISO ADC 2 CLICK	4
MIKROE-4047 MikroElektronika	LOAD CELL 2 CLICK	20
MIKROE-2553 MikroElektronika	LEM CLICK	7
MIKROE-1597 MikroElektronika	BOARD BLE P CLICK BLUETOOTH	0
MIKROE-2337 MikroElektronika	6DOF IMU 2 CLICK	3
MIKROE-2817 MikroElektronika	PIXI CLICK	3
MIKROE-2935 MikroElektronika	SENSORS	2
MIKROE-3395 MikroElektronika	RS485 4 CLICK	6
MIKROE-2529 MikroElektronika	AIR QUALITY 2 CLICK	3

Evaluation Boards - Expansion Boards, Daughter Cards

1. Overview

Evaluation Boards (EVBs), Expansion Boards, and Daughter Cards are essential hardware tools for embedded system development, prototyping, and testing. These platforms enable engineers to assess processor capabilities, interface peripherals, and validate designs before mass production. Their modular architecture supports rapid innovation in IoT, automotive, industrial automation, and consumer electronics sectors.

2. Main Types and Functional Classification

Type	Functional Features	Application Examples
Microcontroller EVBs	ARM/FPGA SoC integration, onboard sensors, debug interfaces	IoT edge devices, smart sensors
Expansion Boards	Standard interfaces (PCIe, USB-C), protocol converters	Industrial gateways, communication modules
Daughter Cards	Specialized functionality modules (ADC/DAC, RF transceivers)	Medical imaging equipment, test instruments
Programmer Kits	Flash programming, JTAG/SWD debugging, voltage monitoring	Automotive ECUs, aerospace controllers

3. Structure and Components

Typical architecture includes:

Multi-layer PCB with high-speed traces
Processor sockets or soldered-down SoCs
Standardized connectors (2.54mm headers, M.2)
Onboard memory (RAM, Flash storage)
Power management ICs and voltage regulators
Debug interfaces (SWD, JTAG, UART)

4. Key Technical Specifications

Parameter	Description
Clock Speed	Determines processing capability (1MHz-2GHz range)
Bus Width	Memory bandwidth (8/16/32-bit configurations)
Interface Support	USB 3.0, Ethernet, CAN, SPI/I2C compatibility
Power Consumption	Typical range: 0.5W-25W (varies with workload)
Operating Temperature	Industrial (-40 C to +85 C) or commercial grade

5. Application Areas

Major industries include:

Telecommunications (5G base stations, optical transceivers)
Medical equipment (MRI scanners, patient monitors)
Industrial automation (PLC controllers, robotics)
Consumer electronics (smart home devices, wearables)
Automotive (ADAS systems, V2X communication)

6. Leading Manufacturers and Products

Vendor	Product Series
Xilinx	Zynq UltraScale+ MPSoC Evaluation Kit
Intel	Stratix 10 GX FPGA Development Board
STMicroelectronics	STM32 Nucleo Expansion Boards
Texas Instruments	Processor DKx Daughter Cards

7. Selection Guidelines

Key considerations:

Match SoC architecture to target application requirements
Verify interface compatibility with existing systems
Evaluate available ecosystem (IDE support, middleware)
Consider power budget and thermal management needs
Assess long-term availability and RoHS compliance

8. Industry Trends

Future developments include:

Integration of AI accelerators (NPU modules)
Adoption of 5nm/3nm process technologies
Expansion of RISC-V based evaluation platforms
Increased focus on functional safety (ISO 26262 compliance)
Growing adoption of modular "Lego-style" prototyping systems