Evaluation Boards - Expansion Boards, Daughter Cards

Part Number	Description / PDF	Quantity
MIKROE-4128 MikroElektronika	9DOF 2 CLICK	2
MIKROE-3438 MikroElektronika	BUCK 11 CLICK	6
MIKROE-3319 MikroElektronika	OPTO 3 CLICK	16
MIKROE-4330 MikroElektronika	6DOF IMU 15 CLICK	13
MIKROE-3869 MikroElektronika	6DOF IMU 11 CLICK	5
MIKROE-3745 MikroElektronika	TERMINAL CLICK	8
MIKROE-2550 MikroElektronika	MANOMETER 2 CLICK	2
MIKROE-1430 MikroElektronika	BOARD EVE CLICK DISPLAY CTLR	0
MIKROE-3447 MikroElektronika	6DOF IMU 8 CLICK	2
MIKROE-2389 MikroElektronika	CCRF3 CLICK	2
MIKROE-2377 MikroElektronika	AMMETER CLICK	0
MIKROE-3036 MikroElektronika	NANO POWER 2 CLICK	3
MIKROE-2789 MikroElektronika	7X10 B CLICK	0
MIKROE-4416 MikroElektronika	WATCHDOG CLICK	5
MIKROE-2575 MikroElektronika	MCP73213 CLICK	2
MIKROE-1890 MikroElektronika	DEV BOARD AMBIENT CLICK	0
MIKROE-1437 MikroElektronika	BOARD MIKROMEDIA+ PIC32MX7 SHLD	0
MIKROE-4501 MikroElektronika	ACCEL 15 CLICK	5
MIKROE-3776 MikroElektronika	6DOF IMU 7 CLICK	7
MIKROE-3934 MikroElektronika	6DOF IMU 10 CLICK	4

Evaluation Boards - Expansion Boards, Daughter Cards

1. Overview

Evaluation Boards (EVBs), Expansion Boards, and Daughter Cards are essential hardware tools for embedded system development, prototyping, and testing. These platforms enable engineers to assess processor capabilities, interface peripherals, and validate designs before mass production. Their modular architecture supports rapid innovation in IoT, automotive, industrial automation, and consumer electronics sectors.

2. Main Types and Functional Classification

Type	Functional Features	Application Examples
Microcontroller EVBs	ARM/FPGA SoC integration, onboard sensors, debug interfaces	IoT edge devices, smart sensors
Expansion Boards	Standard interfaces (PCIe, USB-C), protocol converters	Industrial gateways, communication modules
Daughter Cards	Specialized functionality modules (ADC/DAC, RF transceivers)	Medical imaging equipment, test instruments
Programmer Kits	Flash programming, JTAG/SWD debugging, voltage monitoring	Automotive ECUs, aerospace controllers

3. Structure and Components

Typical architecture includes:

Multi-layer PCB with high-speed traces
Processor sockets or soldered-down SoCs
Standardized connectors (2.54mm headers, M.2)
Onboard memory (RAM, Flash storage)
Power management ICs and voltage regulators
Debug interfaces (SWD, JTAG, UART)

4. Key Technical Specifications

Parameter	Description
Clock Speed	Determines processing capability (1MHz-2GHz range)
Bus Width	Memory bandwidth (8/16/32-bit configurations)
Interface Support	USB 3.0, Ethernet, CAN, SPI/I2C compatibility
Power Consumption	Typical range: 0.5W-25W (varies with workload)
Operating Temperature	Industrial (-40 C to +85 C) or commercial grade

5. Application Areas

Major industries include:

Telecommunications (5G base stations, optical transceivers)
Medical equipment (MRI scanners, patient monitors)
Industrial automation (PLC controllers, robotics)
Consumer electronics (smart home devices, wearables)
Automotive (ADAS systems, V2X communication)

6. Leading Manufacturers and Products

Vendor	Product Series
Xilinx	Zynq UltraScale+ MPSoC Evaluation Kit
Intel	Stratix 10 GX FPGA Development Board
STMicroelectronics	STM32 Nucleo Expansion Boards
Texas Instruments	Processor DKx Daughter Cards

7. Selection Guidelines

Key considerations:

Match SoC architecture to target application requirements
Verify interface compatibility with existing systems
Evaluate available ecosystem (IDE support, middleware)
Consider power budget and thermal management needs
Assess long-term availability and RoHS compliance

8. Industry Trends

Future developments include:

Integration of AI accelerators (NPU modules)
Adoption of 5nm/3nm process technologies
Expansion of RISC-V based evaluation platforms
Increased focus on functional safety (ISO 26262 compliance)
Growing adoption of modular "Lego-style" prototyping systems