Evaluation Boards - Expansion Boards, Daughter Cards

Part Number	Description / PDF	Quantity
MIKROE-4193 MikroElektronika	FORCE 4 CLICK	5
MIKROE-2226 MikroElektronika	3G-EA CLICK (FOR EU/AUSTRALIA)	0
MIKROE-1578 MikroElektronika	BOARD HALL CURRENT SENSOR CLICK	1
MIKROE-950 MikroElektronika	BOARD ACCY DAC CLICK MIKROBUS	7
MIKROE-1998 MikroElektronika	REED CLICK	4
MIKROE-2903 MikroElektronika	OOK TX CLICK	8
MIKROE-3309 MikroElektronika	WAVEFORM CLICK	19
MIKROE-2443 MikroElektronika	VREG CLICK	0
MIKROE-4034 MikroElektronika	5G NB IOT CLICK	4
MIKROE-1857 MikroElektronika	EXTENSION BOARD FOR BEAGLEBONE	10
MIKROE-1641 MikroElektronika	POLLUTION PREVENTER CLICK PACK	0
MIKROE-1893 MikroElektronika	BOARD ADC 2 CLICK	5
MIKROE-4113 MikroElektronika	CLOCK GEN CLICK	8
MIKROE-2731 MikroElektronika	LSM6DSL CLICK	0
MIKROE-1195 MikroElektronika	BOARD IRDA2 CLICK	18
MIKROE-4420 MikroElektronika	HALL CURRENT 7 CLICK	4
MIKROE-3436 MikroElektronika	TEMP&HUM 12 CLICK	28
MIKROE-3929 MikroElektronika	FT CLICK	4
MIKROE-3700 MikroElektronika	NO2 2 CLICK	7
MIKROE-2801 MikroElektronika	PROXIMITY 3 CLICK	0

Evaluation Boards - Expansion Boards, Daughter Cards

1. Overview

Evaluation Boards (EVBs), Expansion Boards, and Daughter Cards are essential hardware tools for embedded system development, prototyping, and testing. These platforms enable engineers to assess processor capabilities, interface peripherals, and validate designs before mass production. Their modular architecture supports rapid innovation in IoT, automotive, industrial automation, and consumer electronics sectors.

2. Main Types and Functional Classification

Type	Functional Features	Application Examples
Microcontroller EVBs	ARM/FPGA SoC integration, onboard sensors, debug interfaces	IoT edge devices, smart sensors
Expansion Boards	Standard interfaces (PCIe, USB-C), protocol converters	Industrial gateways, communication modules
Daughter Cards	Specialized functionality modules (ADC/DAC, RF transceivers)	Medical imaging equipment, test instruments
Programmer Kits	Flash programming, JTAG/SWD debugging, voltage monitoring	Automotive ECUs, aerospace controllers

3. Structure and Components

Typical architecture includes:

Multi-layer PCB with high-speed traces
Processor sockets or soldered-down SoCs
Standardized connectors (2.54mm headers, M.2)
Onboard memory (RAM, Flash storage)
Power management ICs and voltage regulators
Debug interfaces (SWD, JTAG, UART)

4. Key Technical Specifications

Parameter	Description
Clock Speed	Determines processing capability (1MHz-2GHz range)
Bus Width	Memory bandwidth (8/16/32-bit configurations)
Interface Support	USB 3.0, Ethernet, CAN, SPI/I2C compatibility
Power Consumption	Typical range: 0.5W-25W (varies with workload)
Operating Temperature	Industrial (-40 C to +85 C) or commercial grade

5. Application Areas

Major industries include:

Telecommunications (5G base stations, optical transceivers)
Medical equipment (MRI scanners, patient monitors)
Industrial automation (PLC controllers, robotics)
Consumer electronics (smart home devices, wearables)
Automotive (ADAS systems, V2X communication)

6. Leading Manufacturers and Products

Vendor	Product Series
Xilinx	Zynq UltraScale+ MPSoC Evaluation Kit
Intel	Stratix 10 GX FPGA Development Board
STMicroelectronics	STM32 Nucleo Expansion Boards
Texas Instruments	Processor DKx Daughter Cards

7. Selection Guidelines

Key considerations:

Match SoC architecture to target application requirements
Verify interface compatibility with existing systems
Evaluate available ecosystem (IDE support, middleware)
Consider power budget and thermal management needs
Assess long-term availability and RoHS compliance

8. Industry Trends

Future developments include:

Integration of AI accelerators (NPU modules)
Adoption of 5nm/3nm process technologies
Expansion of RISC-V based evaluation platforms
Increased focus on functional safety (ISO 26262 compliance)
Growing adoption of modular "Lego-style" prototyping systems