Evaluation Boards - Expansion Boards, Daughter Cards

Part Number	Description / PDF	Quantity
MIKROE-3863 MikroElektronika	RS485 ISOLATOR 2 CLICK	32
MIKROE-4331 MikroElektronika	ISO 9141 CLICK	4
MIKROE-3471 MikroElektronika	KEYLOCK 2 CLICK	5
MIKROE-4073 MikroElektronika	6DOF IMU 12 CLICK	15
MIKROE-3662 MikroElektronika	THERMO 16 CLICK	5
MIKROE-4046 MikroElektronika	FORCE 2 CLICK	3
MIKROE-4456 MikroElektronika	GNSS RTK CLICK	0
MIKROE-2887 MikroElektronika	MIC33153 CLICK	0
MIKROE-2546 MikroElektronika	INTEL JOULE CLICK SHIELD	0
MIKROE-1640 MikroElektronika	BEYOND KEYS CLICK PACK	0
MIKROE-2086 MikroElektronika	IR GESTURE CLICK	4
MIKROE-3328 MikroElektronika	ALTITUDE 3 CLICK	14
MIKROE-3045 MikroElektronika	IBUTTON CLICK	0
MIKROE-4199 MikroElektronika	UWB CLICK	19
MIKROE-2405 MikroElektronika	SKYWIRE CLICK	4
MIKROE-4107 MikroElektronika	CAN FD 4 CLICK	12
MIKROE-2453 MikroElektronika	LCD MINI CLICK	64
MIKROE-990 MikroElektronika	BOARD ACCY LIGHTHZ CLICK	0
MIKROE-1529 MikroElektronika	MIKROMEDIA 5 FOR TIVA SHIELD	0
MIKROE-4207 MikroElektronika	I2C EXTEND CLICK	3

Evaluation Boards - Expansion Boards, Daughter Cards

1. Overview

Evaluation Boards (EVBs), Expansion Boards, and Daughter Cards are essential hardware tools for embedded system development, prototyping, and testing. These platforms enable engineers to assess processor capabilities, interface peripherals, and validate designs before mass production. Their modular architecture supports rapid innovation in IoT, automotive, industrial automation, and consumer electronics sectors.

2. Main Types and Functional Classification

Type	Functional Features	Application Examples
Microcontroller EVBs	ARM/FPGA SoC integration, onboard sensors, debug interfaces	IoT edge devices, smart sensors
Expansion Boards	Standard interfaces (PCIe, USB-C), protocol converters	Industrial gateways, communication modules
Daughter Cards	Specialized functionality modules (ADC/DAC, RF transceivers)	Medical imaging equipment, test instruments
Programmer Kits	Flash programming, JTAG/SWD debugging, voltage monitoring	Automotive ECUs, aerospace controllers

3. Structure and Components

Typical architecture includes:

Multi-layer PCB with high-speed traces
Processor sockets or soldered-down SoCs
Standardized connectors (2.54mm headers, M.2)
Onboard memory (RAM, Flash storage)
Power management ICs and voltage regulators
Debug interfaces (SWD, JTAG, UART)

4. Key Technical Specifications

Parameter	Description
Clock Speed	Determines processing capability (1MHz-2GHz range)
Bus Width	Memory bandwidth (8/16/32-bit configurations)
Interface Support	USB 3.0, Ethernet, CAN, SPI/I2C compatibility
Power Consumption	Typical range: 0.5W-25W (varies with workload)
Operating Temperature	Industrial (-40 C to +85 C) or commercial grade

5. Application Areas

Major industries include:

Telecommunications (5G base stations, optical transceivers)
Medical equipment (MRI scanners, patient monitors)
Industrial automation (PLC controllers, robotics)
Consumer electronics (smart home devices, wearables)
Automotive (ADAS systems, V2X communication)

6. Leading Manufacturers and Products

Vendor	Product Series
Xilinx	Zynq UltraScale+ MPSoC Evaluation Kit
Intel	Stratix 10 GX FPGA Development Board
STMicroelectronics	STM32 Nucleo Expansion Boards
Texas Instruments	Processor DKx Daughter Cards

7. Selection Guidelines

Key considerations:

Match SoC architecture to target application requirements
Verify interface compatibility with existing systems
Evaluate available ecosystem (IDE support, middleware)
Consider power budget and thermal management needs
Assess long-term availability and RoHS compliance

8. Industry Trends

Future developments include:

Integration of AI accelerators (NPU modules)
Adoption of 5nm/3nm process technologies
Expansion of RISC-V based evaluation platforms
Increased focus on functional safety (ISO 26262 compliance)
Growing adoption of modular "Lego-style" prototyping systems