Evaluation Boards - Expansion Boards, Daughter Cards

Part Number	Description / PDF	Quantity
MIKROE-2746 MikroElektronika	UT-M 7-SEG R CLICK	0
MIKROE-4496 MikroElektronika	TEMP&HUM 15 CLICK	5
MIKROE-3880 MikroElektronika	M-BUS MASTER CLICK	19
MIKROE-4467 MikroElektronika	I2C ISOLATOR 3 CLICK	4
MIKROE-4089 MikroElektronika	6DOF IMU 5 CLICK	14
MIKROE-4105 MikroElektronika	ADC 9 CLICK	17
MIKROE-4487 MikroElektronika	BLE 9 CLICK	5
MIKROE-3350 MikroElektronika	4G LTE-AT&T CLICK (FOR NORTH AME	11
MIKROE-3787 MikroElektronika	H-BRIDGE 4 CLICK	1
MIKROE-3077 MikroElektronika	AUDIOAMP 2 CLICK	4
MIKROE-1716 MikroElektronika	CCRF2 CLICK	2
MIKROE-2768 MikroElektronika	FRAM 2 CLICK	1
MIKROE-2525 MikroElektronika	AC CURRENT CLICK - BUNDLE	7
MIKROE-946 MikroElektronika	BOARD ACCY MP3 CLICK MIKROBUS	5
MIKROE-3340 MikroElektronika	UART 1-WIRE CLICK	9
MIKROE-3600 MikroElektronika	THERMO 11 CLICK	65
MIKROE-1431 MikroElektronika	BOARD FM CLICK TUNER ADD-ON	2
MIKROE-2218 MikroElektronika	6LOWPAN T CLICK	0
MIKROE-574 MikroElektronika	EASYWIFI BOARD	0
MIKROE-1154 MikroElektronika	BOARD MIKROBUS SHIELD MIKROMEDIA	1

Evaluation Boards - Expansion Boards, Daughter Cards

1. Overview

Evaluation Boards (EVBs), Expansion Boards, and Daughter Cards are essential hardware tools for embedded system development, prototyping, and testing. These platforms enable engineers to assess processor capabilities, interface peripherals, and validate designs before mass production. Their modular architecture supports rapid innovation in IoT, automotive, industrial automation, and consumer electronics sectors.

2. Main Types and Functional Classification

Type	Functional Features	Application Examples
Microcontroller EVBs	ARM/FPGA SoC integration, onboard sensors, debug interfaces	IoT edge devices, smart sensors
Expansion Boards	Standard interfaces (PCIe, USB-C), protocol converters	Industrial gateways, communication modules
Daughter Cards	Specialized functionality modules (ADC/DAC, RF transceivers)	Medical imaging equipment, test instruments
Programmer Kits	Flash programming, JTAG/SWD debugging, voltage monitoring	Automotive ECUs, aerospace controllers

3. Structure and Components

Typical architecture includes:

Multi-layer PCB with high-speed traces
Processor sockets or soldered-down SoCs
Standardized connectors (2.54mm headers, M.2)
Onboard memory (RAM, Flash storage)
Power management ICs and voltage regulators
Debug interfaces (SWD, JTAG, UART)

4. Key Technical Specifications

Parameter	Description
Clock Speed	Determines processing capability (1MHz-2GHz range)
Bus Width	Memory bandwidth (8/16/32-bit configurations)
Interface Support	USB 3.0, Ethernet, CAN, SPI/I2C compatibility
Power Consumption	Typical range: 0.5W-25W (varies with workload)
Operating Temperature	Industrial (-40 C to +85 C) or commercial grade

5. Application Areas

Major industries include:

Telecommunications (5G base stations, optical transceivers)
Medical equipment (MRI scanners, patient monitors)
Industrial automation (PLC controllers, robotics)
Consumer electronics (smart home devices, wearables)
Automotive (ADAS systems, V2X communication)

6. Leading Manufacturers and Products

Vendor	Product Series
Xilinx	Zynq UltraScale+ MPSoC Evaluation Kit
Intel	Stratix 10 GX FPGA Development Board
STMicroelectronics	STM32 Nucleo Expansion Boards
Texas Instruments	Processor DKx Daughter Cards

7. Selection Guidelines

Key considerations:

Match SoC architecture to target application requirements
Verify interface compatibility with existing systems
Evaluate available ecosystem (IDE support, middleware)
Consider power budget and thermal management needs
Assess long-term availability and RoHS compliance

8. Industry Trends

Future developments include:

Integration of AI accelerators (NPU modules)
Adoption of 5nm/3nm process technologies
Expansion of RISC-V based evaluation platforms
Increased focus on functional safety (ISO 26262 compliance)
Growing adoption of modular "Lego-style" prototyping systems