Evaluation Boards - Expansion Boards, Daughter Cards

Part Number	Description / PDF	Quantity
MIKROE-1135 MikroElektronika	RF TXRX MODULE WIFI TRACE ANT	0
MIKROE-2064 MikroElektronika	STRETCH CLICK	0
MIKROE-2586 MikroElektronika	IQRF CLICK	0
MIKROE-2748 MikroElektronika	STEPPER 4 CLICK	0
MIKROE-1589 MikroElektronika	DEV BOARD MOTION	10
MIKROE-4106 MikroElektronika	TMR MIX-SENS CLICK	12
MIKROE-1628 MikroElektronika	BOARD CH4 METHANE CLICK	0
MIKROE-1647 MikroElektronika	BOARD UNIPOLAR HALL SENSOR CLICK	0
MIKROE-4136 MikroElektronika	MIC 3 CLICK	8
MIKROE-4222 MikroElektronika	VCP MONITOR 3 CLICK	9
MIKROE-2000 MikroElektronika	HEART RATE CLICK	52
MIKROE-3001 MikroElektronika	UPS CLICK	5
MIKROE-2272 MikroElektronika	PWM DRIVER CLICK	1
MIKROE-4270 MikroElektronika	ANGLE 5 CLICK	7
MIKROE-4090 MikroElektronika	RNG CLICK	3
MIKROE-2219 MikroElektronika	6LOWPAN C CLICK	2
MIKROE-2269 MikroElektronika	BIG 7-SEG R CLICK	0
MIKROE-4226 MikroElektronika	MCU CARD 10 FOR PIC PIC18F67K40	5
MIKROE-3877 MikroElektronika	ONE SHOT CLICK	13
MIKROE-3062 MikroElektronika	COLOR 7 CLICK	10

Evaluation Boards - Expansion Boards, Daughter Cards

1. Overview

Evaluation Boards (EVBs), Expansion Boards, and Daughter Cards are essential hardware tools for embedded system development, prototyping, and testing. These platforms enable engineers to assess processor capabilities, interface peripherals, and validate designs before mass production. Their modular architecture supports rapid innovation in IoT, automotive, industrial automation, and consumer electronics sectors.

2. Main Types and Functional Classification

Type	Functional Features	Application Examples
Microcontroller EVBs	ARM/FPGA SoC integration, onboard sensors, debug interfaces	IoT edge devices, smart sensors
Expansion Boards	Standard interfaces (PCIe, USB-C), protocol converters	Industrial gateways, communication modules
Daughter Cards	Specialized functionality modules (ADC/DAC, RF transceivers)	Medical imaging equipment, test instruments
Programmer Kits	Flash programming, JTAG/SWD debugging, voltage monitoring	Automotive ECUs, aerospace controllers

3. Structure and Components

Typical architecture includes:

Multi-layer PCB with high-speed traces
Processor sockets or soldered-down SoCs
Standardized connectors (2.54mm headers, M.2)
Onboard memory (RAM, Flash storage)
Power management ICs and voltage regulators
Debug interfaces (SWD, JTAG, UART)

4. Key Technical Specifications

Parameter	Description
Clock Speed	Determines processing capability (1MHz-2GHz range)
Bus Width	Memory bandwidth (8/16/32-bit configurations)
Interface Support	USB 3.0, Ethernet, CAN, SPI/I2C compatibility
Power Consumption	Typical range: 0.5W-25W (varies with workload)
Operating Temperature	Industrial (-40 C to +85 C) or commercial grade

5. Application Areas

Major industries include:

Telecommunications (5G base stations, optical transceivers)
Medical equipment (MRI scanners, patient monitors)
Industrial automation (PLC controllers, robotics)
Consumer electronics (smart home devices, wearables)
Automotive (ADAS systems, V2X communication)

6. Leading Manufacturers and Products

Vendor	Product Series
Xilinx	Zynq UltraScale+ MPSoC Evaluation Kit
Intel	Stratix 10 GX FPGA Development Board
STMicroelectronics	STM32 Nucleo Expansion Boards
Texas Instruments	Processor DKx Daughter Cards

7. Selection Guidelines

Key considerations:

Match SoC architecture to target application requirements
Verify interface compatibility with existing systems
Evaluate available ecosystem (IDE support, middleware)
Consider power budget and thermal management needs
Assess long-term availability and RoHS compliance

8. Industry Trends

Future developments include:

Integration of AI accelerators (NPU modules)
Adoption of 5nm/3nm process technologies
Expansion of RISC-V based evaluation platforms
Increased focus on functional safety (ISO 26262 compliance)
Growing adoption of modular "Lego-style" prototyping systems