Evaluation Boards - Expansion Boards, Daughter Cards

Image Part Number Description / PDF Quantity Rfq
BOOSTXL-AUDIO

BOOSTXL-AUDIO

Texas Instruments

EVAL BOARD BOOSTERPACK FOR AUDIO

63

BOOSTXL-3PHGANINV

BOOSTXL-3PHGANINV

Texas Instruments

48V 10A GAN INVERTER BOOSTERPACK

63

CC3120BOOST

CC3120BOOST

Texas Instruments

CC3120 WIFI BOOSTERPACK BOARD

11

CAPTIVATE-BSWP

CAPTIVATE-BSWP

Texas Instruments

CAPTIVATE BUTTN/SLIDR/WHEEL/PROX

12

AWR1443BOOST

AWR1443BOOST

Texas Instruments

AWR1443 BOOSTER PACK

9

BOOSTXL-DRV8323RS

BOOSTXL-DRV8323RS

Texas Instruments

DRV8323RS LAUNCHPAD BOOSTERPACK

18

BP-DAC11001EVM

BP-DAC11001EVM

Texas Instruments

BP-DAC11001EVM

2

BOOSTXL-DRV8323RH

BOOSTXL-DRV8323RH

Texas Instruments

DRV8323RH LAUNCHPAD BOOSTERPACK

14

IMETER-BOOST

IMETER-BOOST

Texas Instruments

IMETER LAUNCHPAD BOOSTERPACK

7

BOOST-ADS7042

BOOST-ADS7042

Texas Instruments

ADS7042 BOOSTERPACK BOARD

4

BOOST-CC2564MODA

BOOST-CC2564MODA

Texas Instruments

BOOSTERPACK PLUG-IN MOD W/ANT

7

BOOSTXL-ADS1119

BOOSTXL-ADS1119

Texas Instruments

DEVELOPMENT DATA ACQUISITION

1

10G-EXPANSION-EVM

10G-EXPANSION-EVM

Texas Instruments

DEVELOPMENT INTERFACE

3

BOOSTXL-DRV8301

BOOSTXL-DRV8301

Texas Instruments

BOOSTER PACK MOTOR DRIVE

13

AUDK2G

AUDK2G

Texas Instruments

66AK2GX (K2G) AUDIO DAUGHTER CAR

3

BOOSTXL-ADS7142-Q1

BOOSTXL-ADS7142-Q1

Texas Instruments

BOOSTXL-ADS7142-Q1

39

MMWAVEPOEEVM

MMWAVEPOEEVM

Texas Instruments

MMWAVE SENSOR

1

BOOSTXL-TECDRV

BOOSTXL-TECDRV

Texas Instruments

TPS63810 BOOSTERPACK TEC

6

BOOSTXL-TLC2543-Q1

BOOSTXL-TLC2543-Q1

Texas Instruments

DEVELOPMENT POWER MANAGEMENT

3

BOOSTXL-DAC-PORT

BOOSTXL-DAC-PORT

Texas Instruments

DEVELOPMENT DATA ACQUISITION

16

Evaluation Boards - Expansion Boards, Daughter Cards

1. Overview

Evaluation Boards (EVBs), Expansion Boards, and Daughter Cards are essential hardware tools for embedded system development, prototyping, and testing. These platforms enable engineers to assess processor capabilities, interface peripherals, and validate designs before mass production. Their modular architecture supports rapid innovation in IoT, automotive, industrial automation, and consumer electronics sectors.

2. Main Types and Functional Classification

TypeFunctional FeaturesApplication Examples
Microcontroller EVBsARM/FPGA SoC integration, onboard sensors, debug interfacesIoT edge devices, smart sensors
Expansion BoardsStandard interfaces (PCIe, USB-C), protocol convertersIndustrial gateways, communication modules
Daughter CardsSpecialized functionality modules (ADC/DAC, RF transceivers)Medical imaging equipment, test instruments
Programmer KitsFlash programming, JTAG/SWD debugging, voltage monitoringAutomotive ECUs, aerospace controllers

3. Structure and Components

Typical architecture includes:

  • Multi-layer PCB with high-speed traces
  • Processor sockets or soldered-down SoCs
  • Standardized connectors (2.54mm headers, M.2)
  • Onboard memory (RAM, Flash storage)
  • Power management ICs and voltage regulators
  • Debug interfaces (SWD, JTAG, UART)

4. Key Technical Specifications

ParameterDescription
Clock SpeedDetermines processing capability (1MHz-2GHz range)
Bus WidthMemory bandwidth (8/16/32-bit configurations)
Interface SupportUSB 3.0, Ethernet, CAN, SPI/I2C compatibility
Power ConsumptionTypical range: 0.5W-25W (varies with workload)
Operating TemperatureIndustrial (-40 C to +85 C) or commercial grade

5. Application Areas

Major industries include:

  • Telecommunications (5G base stations, optical transceivers)
  • Medical equipment (MRI scanners, patient monitors)
  • Industrial automation (PLC controllers, robotics)
  • Consumer electronics (smart home devices, wearables)
  • Automotive (ADAS systems, V2X communication)

6. Leading Manufacturers and Products

VendorProduct Series
XilinxZynq UltraScale+ MPSoC Evaluation Kit
IntelStratix 10 GX FPGA Development Board
STMicroelectronicsSTM32 Nucleo Expansion Boards
Texas InstrumentsProcessor DKx Daughter Cards

7. Selection Guidelines

Key considerations:

  • Match SoC architecture to target application requirements
  • Verify interface compatibility with existing systems
  • Evaluate available ecosystem (IDE support, middleware)
  • Consider power budget and thermal management needs
  • Assess long-term availability and RoHS compliance

8. Industry Trends

Future developments include:

  • Integration of AI accelerators (NPU modules)
  • Adoption of 5nm/3nm process technologies
  • Expansion of RISC-V based evaluation platforms
  • Increased focus on functional safety (ISO 26262 compliance)
  • Growing adoption of modular "Lego-style" prototyping systems
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