Evaluation Boards - Expansion Boards, Daughter Cards

Part Number	Description / PDF	Quantity
AWR1243BOOST Texas Instruments	AWR1243 BOOSTER PACK	3
BOOSTXL-TMP107 Texas Instruments	TMP107 BOOSTERPACK	9
BOOSTXL-RS232 Texas Instruments	TRS3122E: RS-232 TRANSCEIVER BOO	2
BOOSTXL-BATPAKMKII Texas Instruments	FUEL TANK MKII BATTERY BOOSTERPA	4
MMWAVEICBOOST Texas Instruments	INDUSTRIAL CARRIER EVM	42
AWR2243BOOST Texas Instruments	AWR2243 BOOSTER PACK	15
BOOSTXL-BASSENSORS Texas Instruments	DEVELOPMENT SPECIALIZED	9
BOOSTXL-ADS7841-Q1 Texas Instruments	ADS7841-Q1 LAUNCHPAD BOOSTERPACK	6
BOOSTXL-CC3135 Texas Instruments	LAUNCHPAD BOOSTER PACK	251207
BOOSTXL-CAPKEYPAD Texas Instruments	CAP TOUCH CAPTIVATE BOOSTERPACK	7
AWR1642BOOST-ODS Texas Instruments	AWR1642 BOOSTER PACK	6
BOOSTXL-DRV8305EVM Texas Instruments	EVAL MODULE BOOSTXL-DRV8305	99
BOOSTXL-IOBKOUT Texas Instruments	BOOSTERPACK GPIO BREAKOUT	10
CAPTIVATE-PHONE Texas Instruments	CAPTIVATE CAP TOUCH WITH HAPTIC	6
BOOSTXL-ULN2003 Texas Instruments	DUAL STEPPER MOTOR DRIVER BOOSTE	0
BOOST-DAC8568 Texas Instruments	DAC8568 LOW-POWER, VOLTAGE-OUTPU	8
BOOSTXL-DRV8320H Texas Instruments	EVALUATION MODULE	6
BOOSTXL-CC2650MA Texas Instruments	CC2650 BLE BOOSTERPACK BOARD	62
BOOSTXL-DRV8320RS Texas Instruments	LAUNCHPAD BOOSTER PACK	8
BOOSTXL-CC1120-90 Texas Instruments	BOOSTERPACK FOR SIGFOX APPLICATI	2

Evaluation Boards - Expansion Boards, Daughter Cards

1. Overview

Evaluation Boards (EVBs), Expansion Boards, and Daughter Cards are essential hardware tools for embedded system development, prototyping, and testing. These platforms enable engineers to assess processor capabilities, interface peripherals, and validate designs before mass production. Their modular architecture supports rapid innovation in IoT, automotive, industrial automation, and consumer electronics sectors.

2. Main Types and Functional Classification

Type	Functional Features	Application Examples
Microcontroller EVBs	ARM/FPGA SoC integration, onboard sensors, debug interfaces	IoT edge devices, smart sensors
Expansion Boards	Standard interfaces (PCIe, USB-C), protocol converters	Industrial gateways, communication modules
Daughter Cards	Specialized functionality modules (ADC/DAC, RF transceivers)	Medical imaging equipment, test instruments
Programmer Kits	Flash programming, JTAG/SWD debugging, voltage monitoring	Automotive ECUs, aerospace controllers

3. Structure and Components

Typical architecture includes:

Multi-layer PCB with high-speed traces
Processor sockets or soldered-down SoCs
Standardized connectors (2.54mm headers, M.2)
Onboard memory (RAM, Flash storage)
Power management ICs and voltage regulators
Debug interfaces (SWD, JTAG, UART)

4. Key Technical Specifications

Parameter	Description
Clock Speed	Determines processing capability (1MHz-2GHz range)
Bus Width	Memory bandwidth (8/16/32-bit configurations)
Interface Support	USB 3.0, Ethernet, CAN, SPI/I2C compatibility
Power Consumption	Typical range: 0.5W-25W (varies with workload)
Operating Temperature	Industrial (-40 C to +85 C) or commercial grade

5. Application Areas

Major industries include:

Telecommunications (5G base stations, optical transceivers)
Medical equipment (MRI scanners, patient monitors)
Industrial automation (PLC controllers, robotics)
Consumer electronics (smart home devices, wearables)
Automotive (ADAS systems, V2X communication)

6. Leading Manufacturers and Products

Vendor	Product Series
Xilinx	Zynq UltraScale+ MPSoC Evaluation Kit
Intel	Stratix 10 GX FPGA Development Board
STMicroelectronics	STM32 Nucleo Expansion Boards
Texas Instruments	Processor DKx Daughter Cards

7. Selection Guidelines

Key considerations:

Match SoC architecture to target application requirements
Verify interface compatibility with existing systems
Evaluate available ecosystem (IDE support, middleware)
Consider power budget and thermal management needs
Assess long-term availability and RoHS compliance

8. Industry Trends

Future developments include:

Integration of AI accelerators (NPU modules)
Adoption of 5nm/3nm process technologies
Expansion of RISC-V based evaluation platforms
Increased focus on functional safety (ISO 26262 compliance)
Growing adoption of modular "Lego-style" prototyping systems