Evaluation Boards - Expansion Boards, Daughter Cards

Image Part Number Description / PDF Quantity Rfq
BOOSTXL-ULPSENSE

BOOSTXL-ULPSENSE

Texas Instruments

ULP SENSE BOOSTERPACK

0

BOOSTXL-TLC6948EVM

BOOSTXL-TLC6948EVM

Texas Instruments

LAUNCHPAD BOOSTER PACK

1

BOOSTXL-SHARP128

BOOSTXL-SHARP128

Texas Instruments

DEVELOPMENT SPECIALIZED

30148

BOOSTXL-CC3120MOD

BOOSTXL-CC3120MOD

Texas Instruments

CC3120 WIFI BOOSTERPACK BOARD

31

BOOSTXL-TLV8544PIR

BOOSTXL-TLV8544PIR

Texas Instruments

DEMO MODULE

3

IWR1843BOOST

IWR1843BOOST

Texas Instruments

IWR1843 BOOSTER PACK

12270

BP-ADS7128

BP-ADS7128

Texas Instruments

EVALUATION BOARD FOR ADS7128

719

BOOSTXL-AFE031-DF1

BOOSTXL-AFE031-DF1

Texas Instruments

LAUNCHPAD BOOSTER PACK

11

BOOSTXL-ADS1219

BOOSTXL-ADS1219

Texas Instruments

DEVELOPMENT DATA ACQUISITION

6

BOOSTXL-POSMGR

BOOSTXL-POSMGR

Texas Instruments

DEVELOPMENT SPECIALIZED

13

CAPTIVATE-METAL

CAPTIVATE-METAL

Texas Instruments

CAP TOUCH CAPTIVATE BOARD

3106

BOOSTXL-OV788ADAPT

BOOSTXL-OV788ADAPT

Texas Instruments

EVAL MODULE FOR OV788

3

BOOSTXL-CC1125

BOOSTXL-CC1125

Texas Instruments

CC1125 BOOSTERPACK 868/915 MHZ

23

BOOSTXL-AOA

BOOSTXL-AOA

Texas Instruments

DEVELOPMENT SPECIALIZED

46

IWR1642BOOST

IWR1642BOOST

Texas Instruments

IWR1642 BOOSTER PACK

17

AWR1642BOOST

AWR1642BOOST

Texas Instruments

AWR1642 BOOSTER PACK

24

BOOSTXL-DRV8320S

BOOSTXL-DRV8320S

Texas Instruments

EVALUATION MODULE

4

BOOSTXL-CANFD-LIN

BOOSTXL-CANFD-LIN

Texas Instruments

LAUNCHPAD BOOSTER PACK

1

AWR1843BOOST

AWR1843BOOST

Texas Instruments

AWR1843 BOOSTER PACK

50

BOOSTXL-SENSORS

BOOSTXL-SENSORS

Texas Instruments

SENSORS BOOSTERPACK PLUG-IN MODU

478

Evaluation Boards - Expansion Boards, Daughter Cards

1. Overview

Evaluation Boards (EVBs), Expansion Boards, and Daughter Cards are essential hardware tools for embedded system development, prototyping, and testing. These platforms enable engineers to assess processor capabilities, interface peripherals, and validate designs before mass production. Their modular architecture supports rapid innovation in IoT, automotive, industrial automation, and consumer electronics sectors.

2. Main Types and Functional Classification

TypeFunctional FeaturesApplication Examples
Microcontroller EVBsARM/FPGA SoC integration, onboard sensors, debug interfacesIoT edge devices, smart sensors
Expansion BoardsStandard interfaces (PCIe, USB-C), protocol convertersIndustrial gateways, communication modules
Daughter CardsSpecialized functionality modules (ADC/DAC, RF transceivers)Medical imaging equipment, test instruments
Programmer KitsFlash programming, JTAG/SWD debugging, voltage monitoringAutomotive ECUs, aerospace controllers

3. Structure and Components

Typical architecture includes:

  • Multi-layer PCB with high-speed traces
  • Processor sockets or soldered-down SoCs
  • Standardized connectors (2.54mm headers, M.2)
  • Onboard memory (RAM, Flash storage)
  • Power management ICs and voltage regulators
  • Debug interfaces (SWD, JTAG, UART)

4. Key Technical Specifications

ParameterDescription
Clock SpeedDetermines processing capability (1MHz-2GHz range)
Bus WidthMemory bandwidth (8/16/32-bit configurations)
Interface SupportUSB 3.0, Ethernet, CAN, SPI/I2C compatibility
Power ConsumptionTypical range: 0.5W-25W (varies with workload)
Operating TemperatureIndustrial (-40 C to +85 C) or commercial grade

5. Application Areas

Major industries include:

  • Telecommunications (5G base stations, optical transceivers)
  • Medical equipment (MRI scanners, patient monitors)
  • Industrial automation (PLC controllers, robotics)
  • Consumer electronics (smart home devices, wearables)
  • Automotive (ADAS systems, V2X communication)

6. Leading Manufacturers and Products

VendorProduct Series
XilinxZynq UltraScale+ MPSoC Evaluation Kit
IntelStratix 10 GX FPGA Development Board
STMicroelectronicsSTM32 Nucleo Expansion Boards
Texas InstrumentsProcessor DKx Daughter Cards

7. Selection Guidelines

Key considerations:

  • Match SoC architecture to target application requirements
  • Verify interface compatibility with existing systems
  • Evaluate available ecosystem (IDE support, middleware)
  • Consider power budget and thermal management needs
  • Assess long-term availability and RoHS compliance

8. Industry Trends

Future developments include:

  • Integration of AI accelerators (NPU modules)
  • Adoption of 5nm/3nm process technologies
  • Expansion of RISC-V based evaluation platforms
  • Increased focus on functional safety (ISO 26262 compliance)
  • Growing adoption of modular "Lego-style" prototyping systems
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