Evaluation Boards - Expansion Boards, Daughter Cards

Image	Part Number	Description / PDF	Quantity	Rfq
	410-103 Digilent, Inc.	PMODSF SERIAL FLASH 16MBIT	0
	410-191 Digilent, Inc.	PMODI2S STEREO AUDIO OUTPUT DAC	0
	410-181 Digilent, Inc.	PMODSF2 SERIAL PCM 128MBIT	0
	410-285 Digilent, Inc.	PMODCMPS 3AXIS DGTL COMPASS	0
	410-122P Digilent, Inc.	PMODMIC MICROPHONE MODULE	0
	410-142 Digilent, Inc.	PMODCLP PARALLEL LCD MODULE	0
	410-067 Digilent, Inc.	PMODDIN1 DIGITAL INPUT BOARD	0
	410-225P Digilent, Inc.	PMODOLED2 4-BIT OLED DISPLAY	0
	410-096 Digilent, Inc.	PMODREG1 VOLTAGE REGULATOR	0
	410-257P-GROUP Digilent, Inc.	ANVYL PMOD PACK	0
	410-232 Digilent, Inc.	PMODGYRO2 1-AXIS GYROSCOPE	0
	240-063P Digilent, Inc.	PMOD PACK ANVYL	0
	210-161P Digilent, Inc.	FX2MIB MODULE INTERFACE BOARD	0
	410-257 Digilent, Inc.	ANVYL PMOD PACK	0
	410-115P Digilent, Inc.	PMOD RJ45 CONN PAIR M,F	0

Evaluation Boards - Expansion Boards, Daughter Cards

1. Overview

Evaluation Boards (EVBs), Expansion Boards, and Daughter Cards are essential hardware tools for embedded system development, prototyping, and testing. These platforms enable engineers to assess processor capabilities, interface peripherals, and validate designs before mass production. Their modular architecture supports rapid innovation in IoT, automotive, industrial automation, and consumer electronics sectors.

2. Main Types and Functional Classification

Type	Functional Features	Application Examples
Microcontroller EVBs	ARM/FPGA SoC integration, onboard sensors, debug interfaces	IoT edge devices, smart sensors
Expansion Boards	Standard interfaces (PCIe, USB-C), protocol converters	Industrial gateways, communication modules
Daughter Cards	Specialized functionality modules (ADC/DAC, RF transceivers)	Medical imaging equipment, test instruments
Programmer Kits	Flash programming, JTAG/SWD debugging, voltage monitoring	Automotive ECUs, aerospace controllers

3. Structure and Components

Typical architecture includes:

Multi-layer PCB with high-speed traces
Processor sockets or soldered-down SoCs
Standardized connectors (2.54mm headers, M.2)
Onboard memory (RAM, Flash storage)
Power management ICs and voltage regulators
Debug interfaces (SWD, JTAG, UART)

4. Key Technical Specifications

Parameter	Description
Clock Speed	Determines processing capability (1MHz-2GHz range)
Bus Width	Memory bandwidth (8/16/32-bit configurations)
Interface Support	USB 3.0, Ethernet, CAN, SPI/I2C compatibility
Power Consumption	Typical range: 0.5W-25W (varies with workload)
Operating Temperature	Industrial (-40 C to +85 C) or commercial grade

5. Application Areas

Major industries include:

Telecommunications (5G base stations, optical transceivers)
Medical equipment (MRI scanners, patient monitors)
Industrial automation (PLC controllers, robotics)
Consumer electronics (smart home devices, wearables)
Automotive (ADAS systems, V2X communication)

6. Leading Manufacturers and Products

Vendor	Product Series
Xilinx	Zynq UltraScale+ MPSoC Evaluation Kit
Intel	Stratix 10 GX FPGA Development Board
STMicroelectronics	STM32 Nucleo Expansion Boards
Texas Instruments	Processor DKx Daughter Cards

7. Selection Guidelines

Key considerations:

Match SoC architecture to target application requirements
Verify interface compatibility with existing systems
Evaluate available ecosystem (IDE support, middleware)
Consider power budget and thermal management needs
Assess long-term availability and RoHS compliance

8. Industry Trends

Future developments include:

Integration of AI accelerators (NPU modules)
Adoption of 5nm/3nm process technologies
Expansion of RISC-V based evaluation platforms
Increased focus on functional safety (ISO 26262 compliance)
Growing adoption of modular "Lego-style" prototyping systems