Evaluation Boards - Expansion Boards, Daughter Cards

Part Number	Description / PDF	Quantity
410-377 Digilent, Inc.	PMOD ESP32 WIFI AND BLE	0
410-212 Digilent, Inc.	PMODUSBUART USB TO UART MODULE	238
410-097 Digilent, Inc.	BOARD PMODACL FOR ADXL345	8
410-310 Digilent, Inc.	DGTL ISO 2.5KV RS422/RS485 MOD	206
410-062 Digilent, Inc.	PMODOC1 OPEN COLLECTOR MODULE	0
410-076 Digilent, Inc.	PMODLED HIGH BRIGHT LED BOARD	7
410-106 Digilent, Inc.	BOARD PMODHB5 2A H-BRIDGE MODULE	15
410-333 Digilent, Inc.	PMOD DPG1 DIFFERENTIAL PRESSURE	19
410-396 Digilent, Inc.	ZMOD ADC 1410: SYZYGY-COMPATIBLE	4
410-126 Digilent, Inc.	PMODSSD SEVEN SEGMENT DISPLAY	0
410-405 Digilent, Inc.	AUDIO ADAPTER FOR ANALOG DISCOVE	19
410-323 Digilent, Inc.	PMODOLEDRGB DISPLAY BOARD	51
410-229 Digilent, Inc.	CHIPKIT PMOD SHIELD-UNO	56
410-135 Digilent, Inc.	PMODTPH2 12PIN TEST POINT HEADER	26
410-315 Digilent, Inc.	PMODTC1 MAX31855 DEV	22
410-246 Digilent, Inc.	PMODIA IMPEDANCE ANALYZER	9
410-083 Digilent, Inc.	PMODSWT SLIDE SWITCH MODULE	8
6002-410-013 Digilent, Inc.	PMOD ADAPTER FOR MYRIO	3
410-165 Digilent, Inc.	PMODR2R RESISTOR LADDER DAC	22
410-326 Digilent, Inc.	PMOD NAV 9-AXIS IMU/BAROMETER	0

Evaluation Boards - Expansion Boards, Daughter Cards

1. Overview

Evaluation Boards (EVBs), Expansion Boards, and Daughter Cards are essential hardware tools for embedded system development, prototyping, and testing. These platforms enable engineers to assess processor capabilities, interface peripherals, and validate designs before mass production. Their modular architecture supports rapid innovation in IoT, automotive, industrial automation, and consumer electronics sectors.

2. Main Types and Functional Classification

Type	Functional Features	Application Examples
Microcontroller EVBs	ARM/FPGA SoC integration, onboard sensors, debug interfaces	IoT edge devices, smart sensors
Expansion Boards	Standard interfaces (PCIe, USB-C), protocol converters	Industrial gateways, communication modules
Daughter Cards	Specialized functionality modules (ADC/DAC, RF transceivers)	Medical imaging equipment, test instruments
Programmer Kits	Flash programming, JTAG/SWD debugging, voltage monitoring	Automotive ECUs, aerospace controllers

3. Structure and Components

Typical architecture includes:

Multi-layer PCB with high-speed traces
Processor sockets or soldered-down SoCs
Standardized connectors (2.54mm headers, M.2)
Onboard memory (RAM, Flash storage)
Power management ICs and voltage regulators
Debug interfaces (SWD, JTAG, UART)

4. Key Technical Specifications

Parameter	Description
Clock Speed	Determines processing capability (1MHz-2GHz range)
Bus Width	Memory bandwidth (8/16/32-bit configurations)
Interface Support	USB 3.0, Ethernet, CAN, SPI/I2C compatibility
Power Consumption	Typical range: 0.5W-25W (varies with workload)
Operating Temperature	Industrial (-40 C to +85 C) or commercial grade

5. Application Areas

Major industries include:

Telecommunications (5G base stations, optical transceivers)
Medical equipment (MRI scanners, patient monitors)
Industrial automation (PLC controllers, robotics)
Consumer electronics (smart home devices, wearables)
Automotive (ADAS systems, V2X communication)

6. Leading Manufacturers and Products

Vendor	Product Series
Xilinx	Zynq UltraScale+ MPSoC Evaluation Kit
Intel	Stratix 10 GX FPGA Development Board
STMicroelectronics	STM32 Nucleo Expansion Boards
Texas Instruments	Processor DKx Daughter Cards

7. Selection Guidelines

Key considerations:

Match SoC architecture to target application requirements
Verify interface compatibility with existing systems
Evaluate available ecosystem (IDE support, middleware)
Consider power budget and thermal management needs
Assess long-term availability and RoHS compliance

8. Industry Trends

Future developments include:

Integration of AI accelerators (NPU modules)
Adoption of 5nm/3nm process technologies
Expansion of RISC-V based evaluation platforms
Increased focus on functional safety (ISO 26262 compliance)
Growing adoption of modular "Lego-style" prototyping systems