Evaluation Boards - Expansion Boards, Daughter Cards

Part Number	Description / PDF	Quantity
410-068 Digilent, Inc.	PMODRS232 CONVERTER MODULE	61
410-163 Digilent, Inc.	PMOD8LD LOGIC LEVEL LED BOARD	40
410-397 Digilent, Inc.	ZMOD DAC 1411: SYZYGY-COMPATIBLE	3
410-366 Digilent, Inc.	PMOD HAT ADAPTER: PMOD EXPANSION	16
410-358 Digilent, Inc.	PCAM 5C: 5 MP CAMERA MODULE	32
410-347 Digilent, Inc.	PMOD HYGRO HUMIDITY/TEMP SENSOR	20
410-320 Digilent, Inc.	PMODLVLSHFT BOARD	105
410-243 Digilent, Inc.	PMODAD5 ADC 4CH 24BIT 4.8KHZ	21
410-330 Digilent, Inc.	PMOD JSTK2 TWO-AXIS JOYSTICK	0
410-392 Digilent, Inc.	PMOD TOF: TIME OF FLIGHT SENSOR	25
410-221 Digilent, Inc.	PMODTMP2 THERMOMETER/THERMOSTAT	46
410-389 Digilent, Inc.	PMOD PIR: PASSIVE INFRARED MOTIO	9
210-109WW Digilent, Inc.	FX2WW WIREWRAP BOARD	0
210-109BB Digilent, Inc.	FX2BB BREADBOARD	0
410-092 Digilent, Inc.	PMODCLS 16X2 CHARACTER LCD	0
210-109P Digilent, Inc.	BREADBOARD ADD-ON FX2WW	0
411-000 Digilent, Inc.	PMODRJ45 PAIR MALE/FEMALE PMOD	0
410-103-128 Digilent, Inc.	PMODSF-128 SERIAL FLASH 128MBIT	0
410-116 Digilent, Inc.	PMODJSTK TWO AXIS JOYSTICK	0
410-211 Digilent, Inc.	BOARD CHIPKIT NETWORK SHIELD	0

Evaluation Boards - Expansion Boards, Daughter Cards

1. Overview

Evaluation Boards (EVBs), Expansion Boards, and Daughter Cards are essential hardware tools for embedded system development, prototyping, and testing. These platforms enable engineers to assess processor capabilities, interface peripherals, and validate designs before mass production. Their modular architecture supports rapid innovation in IoT, automotive, industrial automation, and consumer electronics sectors.

2. Main Types and Functional Classification

Type	Functional Features	Application Examples
Microcontroller EVBs	ARM/FPGA SoC integration, onboard sensors, debug interfaces	IoT edge devices, smart sensors
Expansion Boards	Standard interfaces (PCIe, USB-C), protocol converters	Industrial gateways, communication modules
Daughter Cards	Specialized functionality modules (ADC/DAC, RF transceivers)	Medical imaging equipment, test instruments
Programmer Kits	Flash programming, JTAG/SWD debugging, voltage monitoring	Automotive ECUs, aerospace controllers

3. Structure and Components

Typical architecture includes:

Multi-layer PCB with high-speed traces
Processor sockets or soldered-down SoCs
Standardized connectors (2.54mm headers, M.2)
Onboard memory (RAM, Flash storage)
Power management ICs and voltage regulators
Debug interfaces (SWD, JTAG, UART)

4. Key Technical Specifications

Parameter	Description
Clock Speed	Determines processing capability (1MHz-2GHz range)
Bus Width	Memory bandwidth (8/16/32-bit configurations)
Interface Support	USB 3.0, Ethernet, CAN, SPI/I2C compatibility
Power Consumption	Typical range: 0.5W-25W (varies with workload)
Operating Temperature	Industrial (-40 C to +85 C) or commercial grade

5. Application Areas

Major industries include:

Telecommunications (5G base stations, optical transceivers)
Medical equipment (MRI scanners, patient monitors)
Industrial automation (PLC controllers, robotics)
Consumer electronics (smart home devices, wearables)
Automotive (ADAS systems, V2X communication)

6. Leading Manufacturers and Products

Vendor	Product Series
Xilinx	Zynq UltraScale+ MPSoC Evaluation Kit
Intel	Stratix 10 GX FPGA Development Board
STMicroelectronics	STM32 Nucleo Expansion Boards
Texas Instruments	Processor DKx Daughter Cards

7. Selection Guidelines

Key considerations:

Match SoC architecture to target application requirements
Verify interface compatibility with existing systems
Evaluate available ecosystem (IDE support, middleware)
Consider power budget and thermal management needs
Assess long-term availability and RoHS compliance

8. Industry Trends

Future developments include:

Integration of AI accelerators (NPU modules)
Adoption of 5nm/3nm process technologies
Expansion of RISC-V based evaluation platforms
Increased focus on functional safety (ISO 26262 compliance)
Growing adoption of modular "Lego-style" prototyping systems