Evaluation Boards - Expansion Boards, Daughter Cards

Part Number	Description / PDF	Quantity
6002-410-015 Digilent, Inc.	PMOD ADAPTER FOR NI ROBORIO	0
410-247 Digilent, Inc.	PMODCDC1 2 BUTTON CAPACITIVE IO	4
410-348 Digilent, Inc.	PMOD COLOR MODULE TCS3472	43
410-218 Digilent, Inc.	PMODRTCC REAL TIME CLOCK	19
410-136 Digilent, Inc.	PMODBB WIREWRAP BREADBOARD	21
410-064 Digilent, Inc.	BOARD PMODAD1 FOR AD7476A	24
410-379 Digilent, Inc.	PMOD I2S2: STEREO AUDIO IN / OUT	73
410-245 Digilent, Inc.	PMODDA4 8-CH 12-BIT DAC MODULE	34
410-286 Digilent, Inc.	PMODALS AMBIENT LIGHT SENSOR	29
410-084 Digilent, Inc.	PMODCON4 RCA AUDIO JACK HEADER	0
6032-410-000 Digilent, Inc.	BOARD ORBIT BOOSTER	0
410-386 Digilent, Inc.	PMOD AQS	10
410-123 Digilent, Inc.	PMODSD SD CARD SLOT MODULE	0
410-355 Digilent, Inc.	PMOD CMPS2: 3-AXIS COMPASS	3
410-261 Digilent, Inc.	PMODDIP - DIP TO PMOD ADAPTER	8
410-222 Digilent, Inc.	PMODOLED ORGANIC LED DISPLAY	43
410-201 Digilent, Inc.	BOARD PMODRF2 FOR MRF24J40	2
410-113 Digilent, Inc.	BOARD PMODDA2 FOR DAC121S101	50
410-063 Digilent, Inc.	BOARD PMODDA1 FOR AD7303	12
410-378 Digilent, Inc.	IMPEDANCE ANALYZER - ANALOG DISC	53

Evaluation Boards - Expansion Boards, Daughter Cards

1. Overview

Evaluation Boards (EVBs), Expansion Boards, and Daughter Cards are essential hardware tools for embedded system development, prototyping, and testing. These platforms enable engineers to assess processor capabilities, interface peripherals, and validate designs before mass production. Their modular architecture supports rapid innovation in IoT, automotive, industrial automation, and consumer electronics sectors.

2. Main Types and Functional Classification

Type	Functional Features	Application Examples
Microcontroller EVBs	ARM/FPGA SoC integration, onboard sensors, debug interfaces	IoT edge devices, smart sensors
Expansion Boards	Standard interfaces (PCIe, USB-C), protocol converters	Industrial gateways, communication modules
Daughter Cards	Specialized functionality modules (ADC/DAC, RF transceivers)	Medical imaging equipment, test instruments
Programmer Kits	Flash programming, JTAG/SWD debugging, voltage monitoring	Automotive ECUs, aerospace controllers

3. Structure and Components

Typical architecture includes:

Multi-layer PCB with high-speed traces
Processor sockets or soldered-down SoCs
Standardized connectors (2.54mm headers, M.2)
Onboard memory (RAM, Flash storage)
Power management ICs and voltage regulators
Debug interfaces (SWD, JTAG, UART)

4. Key Technical Specifications

Parameter	Description
Clock Speed	Determines processing capability (1MHz-2GHz range)
Bus Width	Memory bandwidth (8/16/32-bit configurations)
Interface Support	USB 3.0, Ethernet, CAN, SPI/I2C compatibility
Power Consumption	Typical range: 0.5W-25W (varies with workload)
Operating Temperature	Industrial (-40 C to +85 C) or commercial grade

5. Application Areas

Major industries include:

Telecommunications (5G base stations, optical transceivers)
Medical equipment (MRI scanners, patient monitors)
Industrial automation (PLC controllers, robotics)
Consumer electronics (smart home devices, wearables)
Automotive (ADAS systems, V2X communication)

6. Leading Manufacturers and Products

Vendor	Product Series
Xilinx	Zynq UltraScale+ MPSoC Evaluation Kit
Intel	Stratix 10 GX FPGA Development Board
STMicroelectronics	STM32 Nucleo Expansion Boards
Texas Instruments	Processor DKx Daughter Cards

7. Selection Guidelines

Key considerations:

Match SoC architecture to target application requirements
Verify interface compatibility with existing systems
Evaluate available ecosystem (IDE support, middleware)
Consider power budget and thermal management needs
Assess long-term availability and RoHS compliance

8. Industry Trends

Future developments include:

Integration of AI accelerators (NPU modules)
Adoption of 5nm/3nm process technologies
Expansion of RISC-V based evaluation platforms
Increased focus on functional safety (ISO 26262 compliance)
Growing adoption of modular "Lego-style" prototyping systems