Evaluation Boards - Expansion Boards, Daughter Cards

Part Number	Description / PDF	Quantity
DFR0356 DFRobot	BLUNO BEETLE SHIELD	6
SEN0251 DFRobot	GRAVITY BAROMETRIC PRESSURE SENS	24
SEN0308 DFRobot	GRAVITY: ANALOG WATERPROOF CAPAC	55
DFR0483 DFRobot	FIREBEETLE EXPANSION SHIELD	1
DFR0499 DFRobot	64X64 RGB LED MATRIX PANEL (3MM	15
SEN0334 DFRobot	SHT31-F TEMP/HUMIDITY SENSOR BRD	37
DFR0491 DFRobot	GRAVITY IO EXPANSION SHIELD FOR	12
KIT0021 DFRobot	GRAVITY WATERPROOF TEMP SENSOR	113
SEN0101 DFRobot	TCS3200 RGB COLOR SENSOR BOARD	58
SEN0322 DFRobot	GRAVITY: I2C OXYGEN SENSOR	0
DFR0029-G DFRobot	GRAVITY: DIGITAL PUSH BUTTON (GR	4
DFR0440 DFRobot	VIBRATION MODULE	2
DFR0412 DFRobot	GRAVITY IO EXPANSION SHIELD FOR	0
SEN0263 DFRobot	GRAVITY: I2C NON-CONTACT IR TEMP	22
SEN0121 DFRobot	STEAM SENSOR	0
SEN0359 DFRobot	GRAVITY:CAPACITIVE FINGERPRINT S	6
DFR0165 DFRobot	MEGA SENSOR SHIELD V2.4 (COMPATI	8
DFR0515 DFRobot	FIREBEETLE OSD CHARACTER OVERLAY	11
DFR0558 DFRobot	GRAVITY DIGITAL HIGH TEMP SENSOR	13
DFR0021-B DFRobot	GRAVITY: DIGITAL BLUE LED LIGHT	0

Evaluation Boards - Expansion Boards, Daughter Cards

1. Overview

Evaluation Boards (EVBs), Expansion Boards, and Daughter Cards are essential hardware tools for embedded system development, prototyping, and testing. These platforms enable engineers to assess processor capabilities, interface peripherals, and validate designs before mass production. Their modular architecture supports rapid innovation in IoT, automotive, industrial automation, and consumer electronics sectors.

2. Main Types and Functional Classification

Type	Functional Features	Application Examples
Microcontroller EVBs	ARM/FPGA SoC integration, onboard sensors, debug interfaces	IoT edge devices, smart sensors
Expansion Boards	Standard interfaces (PCIe, USB-C), protocol converters	Industrial gateways, communication modules
Daughter Cards	Specialized functionality modules (ADC/DAC, RF transceivers)	Medical imaging equipment, test instruments
Programmer Kits	Flash programming, JTAG/SWD debugging, voltage monitoring	Automotive ECUs, aerospace controllers

3. Structure and Components

Typical architecture includes:

Multi-layer PCB with high-speed traces
Processor sockets or soldered-down SoCs
Standardized connectors (2.54mm headers, M.2)
Onboard memory (RAM, Flash storage)
Power management ICs and voltage regulators
Debug interfaces (SWD, JTAG, UART)

4. Key Technical Specifications

Parameter	Description
Clock Speed	Determines processing capability (1MHz-2GHz range)
Bus Width	Memory bandwidth (8/16/32-bit configurations)
Interface Support	USB 3.0, Ethernet, CAN, SPI/I2C compatibility
Power Consumption	Typical range: 0.5W-25W (varies with workload)
Operating Temperature	Industrial (-40 C to +85 C) or commercial grade

5. Application Areas

Major industries include:

Telecommunications (5G base stations, optical transceivers)
Medical equipment (MRI scanners, patient monitors)
Industrial automation (PLC controllers, robotics)
Consumer electronics (smart home devices, wearables)
Automotive (ADAS systems, V2X communication)

6. Leading Manufacturers and Products

Vendor	Product Series
Xilinx	Zynq UltraScale+ MPSoC Evaluation Kit
Intel	Stratix 10 GX FPGA Development Board
STMicroelectronics	STM32 Nucleo Expansion Boards
Texas Instruments	Processor DKx Daughter Cards

7. Selection Guidelines

Key considerations:

Match SoC architecture to target application requirements
Verify interface compatibility with existing systems
Evaluate available ecosystem (IDE support, middleware)
Consider power budget and thermal management needs
Assess long-term availability and RoHS compliance

8. Industry Trends

Future developments include:

Integration of AI accelerators (NPU modules)
Adoption of 5nm/3nm process technologies
Expansion of RISC-V based evaluation platforms
Increased focus on functional safety (ISO 26262 compliance)
Growing adoption of modular "Lego-style" prototyping systems