Evaluation Boards - Expansion Boards, Daughter Cards

Image Part Number Description / PDF Quantity Rfq
EVAL-ADXL372-ARDZ

EVAL-ADXL372-ARDZ

Analog Devices, Inc.

EVAL BOARD FOR ADXL372

14

EVAL-CN0363-PMDZ

EVAL-CN0363-PMDZ

Analog Devices, Inc.

CN0363 EVALUATION BOARD

5

EVAL-CN0415-ARDZ

EVAL-CN0415-ARDZ

Analog Devices, Inc.

ROBUST CLOSED LOOP SOLENOID CONT

1

EVAL-AD5770R-PMDZ

EVAL-AD5770R-PMDZ

Analog Devices, Inc.

AD5770R PMOD BOARD

7

EVAL-AD5290DBZ

EVAL-AD5290DBZ

Analog Devices, Inc.

DAUGHTER BOARD

0

AMC-ADA4841-2ARMZ

AMC-ADA4841-2ARMZ

Analog Devices, Inc.

AMPLIFIER MEZZANINE CARD 8-MSOP

2

EVAL-AD5600PMDZ

EVAL-AD5600PMDZ

Analog Devices, Inc.

EVALUATION BOARD

1

DC2294A

DC2294A

Analog Devices, Inc.

DEMO BOARD FOR PSM LINDUINO ONE

0

EVAL-ADM3055E-ARDZ

EVAL-ADM3055E-ARDZ

Analog Devices, Inc.

SPI-CAN TRANSCEIVER WITH SWITCHA

65

EVAL-AD5593R-PMDZ

EVAL-AD5593R-PMDZ

Analog Devices, Inc.

AD5593R PMOD BOARD

8

DC2870A-KIT

DC2870A-KIT

Analog Devices, Inc.

EVAL-LTC5596ARDZ BOARD ARDUINO S

4

EVAL-ADM2795E-ARDZ

EVAL-ADM2795E-ARDZ

Analog Devices, Inc.

ADM2795E ARDUINO SHIELD EVAL BOA

1

EVAL-AD7124-8-PMDZ

EVAL-AD7124-8-PMDZ

Analog Devices, Inc.

AD7124-8 PMOD BOARD

11

AMC-ADA4805-2ARMZ

AMC-ADA4805-2ARMZ

Analog Devices, Inc.

AMPLIFIER MEZZANINE CARD 8-MSOP

7

EVAL-CN0414-ARDZ

EVAL-CN0414-ARDZ

Analog Devices, Inc.

4-CHANNEL PLC INPUT MODULE

2

EVAL-CN0410-ARDZ

EVAL-CN0410-ARDZ

Analog Devices, Inc.

EVAL-CN0410-ARDZ

1

EVAL-ADL5902-ARDZ

EVAL-ADL5902-ARDZ

Analog Devices, Inc.

ARDUINO SHIELD FOR ADL5902 0.05

0

EVAL-AD5592R-PMDZ

EVAL-AD5592R-PMDZ

Analog Devices, Inc.

AD5592R PMOD BOARD

15

DC2430A

DC2430A

Analog Devices, Inc.

LINDUINO SPI 1:8 EXPANDER SHIELD

1

AMC-ADA4896-2ARMZ

AMC-ADA4896-2ARMZ

Analog Devices, Inc.

AMPLIFIER MEZZANINE CARD 8-SOIC

34

Evaluation Boards - Expansion Boards, Daughter Cards

1. Overview

Evaluation Boards (EVBs), Expansion Boards, and Daughter Cards are essential hardware tools for embedded system development, prototyping, and testing. These platforms enable engineers to assess processor capabilities, interface peripherals, and validate designs before mass production. Their modular architecture supports rapid innovation in IoT, automotive, industrial automation, and consumer electronics sectors.

2. Main Types and Functional Classification

TypeFunctional FeaturesApplication Examples
Microcontroller EVBsARM/FPGA SoC integration, onboard sensors, debug interfacesIoT edge devices, smart sensors
Expansion BoardsStandard interfaces (PCIe, USB-C), protocol convertersIndustrial gateways, communication modules
Daughter CardsSpecialized functionality modules (ADC/DAC, RF transceivers)Medical imaging equipment, test instruments
Programmer KitsFlash programming, JTAG/SWD debugging, voltage monitoringAutomotive ECUs, aerospace controllers

3. Structure and Components

Typical architecture includes:

  • Multi-layer PCB with high-speed traces
  • Processor sockets or soldered-down SoCs
  • Standardized connectors (2.54mm headers, M.2)
  • Onboard memory (RAM, Flash storage)
  • Power management ICs and voltage regulators
  • Debug interfaces (SWD, JTAG, UART)

4. Key Technical Specifications

ParameterDescription
Clock SpeedDetermines processing capability (1MHz-2GHz range)
Bus WidthMemory bandwidth (8/16/32-bit configurations)
Interface SupportUSB 3.0, Ethernet, CAN, SPI/I2C compatibility
Power ConsumptionTypical range: 0.5W-25W (varies with workload)
Operating TemperatureIndustrial (-40 C to +85 C) or commercial grade

5. Application Areas

Major industries include:

  • Telecommunications (5G base stations, optical transceivers)
  • Medical equipment (MRI scanners, patient monitors)
  • Industrial automation (PLC controllers, robotics)
  • Consumer electronics (smart home devices, wearables)
  • Automotive (ADAS systems, V2X communication)

6. Leading Manufacturers and Products

VendorProduct Series
XilinxZynq UltraScale+ MPSoC Evaluation Kit
IntelStratix 10 GX FPGA Development Board
STMicroelectronicsSTM32 Nucleo Expansion Boards
Texas InstrumentsProcessor DKx Daughter Cards

7. Selection Guidelines

Key considerations:

  • Match SoC architecture to target application requirements
  • Verify interface compatibility with existing systems
  • Evaluate available ecosystem (IDE support, middleware)
  • Consider power budget and thermal management needs
  • Assess long-term availability and RoHS compliance

8. Industry Trends

Future developments include:

  • Integration of AI accelerators (NPU modules)
  • Adoption of 5nm/3nm process technologies
  • Expansion of RISC-V based evaluation platforms
  • Increased focus on functional safety (ISO 26262 compliance)
  • Growing adoption of modular "Lego-style" prototyping systems
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