Evaluation Boards - Expansion Boards, Daughter Cards

Part Number	Description / PDF	Quantity
EVAL-CN0216-ARDZ Analog Devices, Inc.	SHIELD BOARD WEIGH SCALE DESIGN	2
EVAL-AD7685-PMDZ Analog Devices, Inc.	EVAL BOARD 16BIT 250K ADC AD7685	2
EVAL-AD7942-PMDZ Analog Devices, Inc.	EVAL BOARD 14BIT 250K ADC AD7942	1
EVAL-M355-ARDZ-INT Analog Devices, Inc.	ADUCM355 SENSOR INTERPOSER	38
EVAL-CN0396-ARDZ Analog Devices, Inc.	EVAL BOARD CO/H2S GAS DETECTION	1
EVAL-AD7988-1-PMDZ Analog Devices, Inc.	EVAL BOARD 16BIT ADC AD7988-1	1
EVAL-ADT7420-PMDZ Analog Devices, Inc.	EVAL-ADT7420-PMDZ	39
EVAL-CN0179-PMDZ Analog Devices, Inc.	PMOD BOARD CURRENT LOOP XMITTER	1
EVAL-AD5940BIOZ Analog Devices, Inc.	EVAL KIT - BIO-IMPEDANCE/BIO-POT	62
EVAL-CN0335-PMDZ Analog Devices, Inc.	PMOD BOARD 12BIT 300KSPS ADC	1
EVAL-AD7690-PMDZ Analog Devices, Inc.	EVAL BOARD 18BIT 400K ADC AD7690	2
EVAL-CN0370-PMDZ Analog Devices, Inc.	PMOD BOARD LED CURRENT DRIVER	1
EV-SOMCRR-BRKOUT Analog Devices, Inc.	BREAKOUT BOARD FOR AUDIO PROCESS	0
EVAL-AD7980-PMDZ Analog Devices, Inc.	EVAL BOARD 16BIT 1M ADC AD7980	8
EVAL-AD7946-PMDZ Analog Devices, Inc.	EVAL BOARD 14BIT 500K ADC AD7946	2
EVAL-AD7988-5-PMDZ Analog Devices, Inc.	EVAL BOARD 16BIT ADC AD7988-1	0
EVAL-AD7693-PMDZ Analog Devices, Inc.	EVAL BOARD 16BIT 500K ADC AD7693	1
EVAL-AD7982-PMDZ Analog Devices, Inc.	EVAL BOARD ADC 18BIT 1MSPS PULSR	3
EVAL-ADT7420ARDZ Analog Devices, Inc.	BOARD EVALUATION ADT7420	19
AMC-ADA4500-2ARMZ Analog Devices, Inc.	AMPLIFIER MEZZANINE CARD 8-MSOP	4

Evaluation Boards - Expansion Boards, Daughter Cards

1. Overview

Evaluation Boards (EVBs), Expansion Boards, and Daughter Cards are essential hardware tools for embedded system development, prototyping, and testing. These platforms enable engineers to assess processor capabilities, interface peripherals, and validate designs before mass production. Their modular architecture supports rapid innovation in IoT, automotive, industrial automation, and consumer electronics sectors.

2. Main Types and Functional Classification

Type	Functional Features	Application Examples
Microcontroller EVBs	ARM/FPGA SoC integration, onboard sensors, debug interfaces	IoT edge devices, smart sensors
Expansion Boards	Standard interfaces (PCIe, USB-C), protocol converters	Industrial gateways, communication modules
Daughter Cards	Specialized functionality modules (ADC/DAC, RF transceivers)	Medical imaging equipment, test instruments
Programmer Kits	Flash programming, JTAG/SWD debugging, voltage monitoring	Automotive ECUs, aerospace controllers

3. Structure and Components

Typical architecture includes:

Multi-layer PCB with high-speed traces
Processor sockets or soldered-down SoCs
Standardized connectors (2.54mm headers, M.2)
Onboard memory (RAM, Flash storage)
Power management ICs and voltage regulators
Debug interfaces (SWD, JTAG, UART)

4. Key Technical Specifications

Parameter	Description
Clock Speed	Determines processing capability (1MHz-2GHz range)
Bus Width	Memory bandwidth (8/16/32-bit configurations)
Interface Support	USB 3.0, Ethernet, CAN, SPI/I2C compatibility
Power Consumption	Typical range: 0.5W-25W (varies with workload)
Operating Temperature	Industrial (-40 C to +85 C) or commercial grade

5. Application Areas

Major industries include:

Telecommunications (5G base stations, optical transceivers)
Medical equipment (MRI scanners, patient monitors)
Industrial automation (PLC controllers, robotics)
Consumer electronics (smart home devices, wearables)
Automotive (ADAS systems, V2X communication)

6. Leading Manufacturers and Products

Vendor	Product Series
Xilinx	Zynq UltraScale+ MPSoC Evaluation Kit
Intel	Stratix 10 GX FPGA Development Board
STMicroelectronics	STM32 Nucleo Expansion Boards
Texas Instruments	Processor DKx Daughter Cards

7. Selection Guidelines

Key considerations:

Match SoC architecture to target application requirements
Verify interface compatibility with existing systems
Evaluate available ecosystem (IDE support, middleware)
Consider power budget and thermal management needs
Assess long-term availability and RoHS compliance

8. Industry Trends

Future developments include:

Integration of AI accelerators (NPU modules)
Adoption of 5nm/3nm process technologies
Expansion of RISC-V based evaluation platforms
Increased focus on functional safety (ISO 26262 compliance)
Growing adoption of modular "Lego-style" prototyping systems