Evaluation Boards - Expansion Boards, Daughter Cards

Part Number	Description / PDF	Quantity
EVAL-ADXL355-PMDZ Analog Devices, Inc.	EVAL-ADXL355-PMDZ	323
EVAL-CN0326-PMDZ Analog Devices, Inc.	PMOD BOARD PH MONITOR	36
EVAL-CN0349-PMDZ Analog Devices, Inc.	PMOD BOARD CONDUCTIVITY DAS	1
EVAL-CN0397-ARDZ Analog Devices, Inc.	EVAL BOARD LIGHT RECOGNITION	1
DC2591A Analog Devices, Inc.	EVAL BOARD FOR LTC4316	0
EV-ADE9153ASHIELDZ Analog Devices, Inc.	ADE9153A ARDUINO SHIELD EVALUATI	39
EV-ADE9000SHIELDZ Analog Devices, Inc.	ADE9000 ARDUINO EVALUATION BOARD	6
EVAL-CN0391-ARDZ Analog Devices, Inc.	EVAL BOARD THERMOCOUPLE SYSTEM	13
EVAL-AD5940ELCZ Analog Devices, Inc.	EVAL KIT - ELECTROCHEMICAL	31
EVAL-CN0372-PMDZ Analog Devices, Inc.	PMOD BOARD ENERGY HARVESTING DAS	1
EVAL-CN0398-ARDZ Analog Devices, Inc.	EVAL BOARD SOIL MOISTURE AND PH	0
EVAL-CN0336-PMDZ Analog Devices, Inc.	PMOD BOARD 12BIT 300KSPS ADC	2
EVAL-CN0409-ARDZ Analog Devices, Inc.	TURBIDITY MEASUREMENT ARDUINO SH	4
EVAL-CN0418-ARDZ Analog Devices, Inc.	4-CHANNEL PLC OUTPUT MODULE	1
EVAL-AD7691-PMDZ Analog Devices, Inc.	EVAL BOARD 18BIT 250K ADC AD7691	0
DC2617A Analog Devices, Inc.	ISOSPI ISO COMMUNICATIONS INT	41
EV-GEAR-EXPANDER1Z Analog Devices, Inc.	EXPANDER (ARDUINO / PMOD INTERFA	15
EVAL-ADISIMU1-RPIZ Analog Devices, Inc.	IMU TO RPI INTERPOSER BOARD	2
AMC-ADA4807-2ARMZ Analog Devices, Inc.	AMPLIFIER MEZZANINE CARD	24
EVAL-CN0411-ARDZ Analog Devices, Inc.	WATER TDS EVAL BOARD	8

Evaluation Boards - Expansion Boards, Daughter Cards

1. Overview

Evaluation Boards (EVBs), Expansion Boards, and Daughter Cards are essential hardware tools for embedded system development, prototyping, and testing. These platforms enable engineers to assess processor capabilities, interface peripherals, and validate designs before mass production. Their modular architecture supports rapid innovation in IoT, automotive, industrial automation, and consumer electronics sectors.

2. Main Types and Functional Classification

Type	Functional Features	Application Examples
Microcontroller EVBs	ARM/FPGA SoC integration, onboard sensors, debug interfaces	IoT edge devices, smart sensors
Expansion Boards	Standard interfaces (PCIe, USB-C), protocol converters	Industrial gateways, communication modules
Daughter Cards	Specialized functionality modules (ADC/DAC, RF transceivers)	Medical imaging equipment, test instruments
Programmer Kits	Flash programming, JTAG/SWD debugging, voltage monitoring	Automotive ECUs, aerospace controllers

3. Structure and Components

Typical architecture includes:

Multi-layer PCB with high-speed traces
Processor sockets or soldered-down SoCs
Standardized connectors (2.54mm headers, M.2)
Onboard memory (RAM, Flash storage)
Power management ICs and voltage regulators
Debug interfaces (SWD, JTAG, UART)

4. Key Technical Specifications

Parameter	Description
Clock Speed	Determines processing capability (1MHz-2GHz range)
Bus Width	Memory bandwidth (8/16/32-bit configurations)
Interface Support	USB 3.0, Ethernet, CAN, SPI/I2C compatibility
Power Consumption	Typical range: 0.5W-25W (varies with workload)
Operating Temperature	Industrial (-40 C to +85 C) or commercial grade

5. Application Areas

Major industries include:

Telecommunications (5G base stations, optical transceivers)
Medical equipment (MRI scanners, patient monitors)
Industrial automation (PLC controllers, robotics)
Consumer electronics (smart home devices, wearables)
Automotive (ADAS systems, V2X communication)

6. Leading Manufacturers and Products

Vendor	Product Series
Xilinx	Zynq UltraScale+ MPSoC Evaluation Kit
Intel	Stratix 10 GX FPGA Development Board
STMicroelectronics	STM32 Nucleo Expansion Boards
Texas Instruments	Processor DKx Daughter Cards

7. Selection Guidelines

Key considerations:

Match SoC architecture to target application requirements
Verify interface compatibility with existing systems
Evaluate available ecosystem (IDE support, middleware)
Consider power budget and thermal management needs
Assess long-term availability and RoHS compliance

8. Industry Trends

Future developments include:

Integration of AI accelerators (NPU modules)
Adoption of 5nm/3nm process technologies
Expansion of RISC-V based evaluation platforms
Increased focus on functional safety (ISO 26262 compliance)
Growing adoption of modular "Lego-style" prototyping systems