Evaluation Boards - Expansion Boards, Daughter Cards

Image	Part Number	Description / PDF	Quantity	Rfq
	T000150 Genuino (Arduino)	MODULE TINKERKIT POTENTIOMETER	0
	T020090 Genuino (Arduino)	TINKERKIT DMX RECEIVER MOS	0
	T000220 Genuino (Arduino)	MODULE TINKERKIT TOUCH SENSOR	0
	A000125 Genuino (Arduino)	ARDUINO LUCKY SHIELD	0
	A000021 Genuino (Arduino)	SHIELD XBEE FOR ARDUINO BOARD	0
	K000081 Genuino (Arduino)	SHIELD - MEGA PROTO KIT REV3	0
	T010117 Genuino (Arduino)	MODULE TINKERKIT YELLOW LED10MM	0
	T000030 Genuino (Arduino)	MODULE TINKERKIT JOYSTICK	0
	A000105 Genuino (Arduino)	ARDUINO GSM SHIELD 2 INTEGR ANT	0
	T020100 Genuino (Arduino)	TINKERKIT DMX RECEIVER RELAY	0
	T010020 Genuino (Arduino)	MODULE TINKERKIT MOSFET	0
	T010113 Genuino (Arduino)	MODULE TINKERKIT YELLOW LED 5MM	0
	T010116 Genuino (Arduino)	MODULE TINKERKIT GREEN LED10MM	0
	T010112 Genuino (Arduino)	MODULE TINKERKIT GREEN LED 5MM	0
	A000025 Genuino (Arduino)	ETHERNET SHIELD WITH POE MODULE	0
	K000083 Genuino (Arduino)	SHIELD - PROTO KIT REV3	0
	A000082 Genuino (Arduino)	ARDUINO SHIELD - PROTO PCB	0
	A000064 Genuino (Arduino)	ARDUINO SHIELD - WIRELESS	0
	T010010 Genuino (Arduino)	MODULE TINKERKIT RELAY	0
	T000090 Genuino (Arduino)	MODULE TINKERKIT LDR SENSOR	0

Evaluation Boards - Expansion Boards, Daughter Cards

1. Overview

Evaluation Boards (EVBs), Expansion Boards, and Daughter Cards are essential hardware tools for embedded system development, prototyping, and testing. These platforms enable engineers to assess processor capabilities, interface peripherals, and validate designs before mass production. Their modular architecture supports rapid innovation in IoT, automotive, industrial automation, and consumer electronics sectors.

2. Main Types and Functional Classification

Type	Functional Features	Application Examples
Microcontroller EVBs	ARM/FPGA SoC integration, onboard sensors, debug interfaces	IoT edge devices, smart sensors
Expansion Boards	Standard interfaces (PCIe, USB-C), protocol converters	Industrial gateways, communication modules
Daughter Cards	Specialized functionality modules (ADC/DAC, RF transceivers)	Medical imaging equipment, test instruments
Programmer Kits	Flash programming, JTAG/SWD debugging, voltage monitoring	Automotive ECUs, aerospace controllers

3. Structure and Components

Typical architecture includes:

Multi-layer PCB with high-speed traces
Processor sockets or soldered-down SoCs
Standardized connectors (2.54mm headers, M.2)
Onboard memory (RAM, Flash storage)
Power management ICs and voltage regulators
Debug interfaces (SWD, JTAG, UART)

4. Key Technical Specifications

Parameter	Description
Clock Speed	Determines processing capability (1MHz-2GHz range)
Bus Width	Memory bandwidth (8/16/32-bit configurations)
Interface Support	USB 3.0, Ethernet, CAN, SPI/I2C compatibility
Power Consumption	Typical range: 0.5W-25W (varies with workload)
Operating Temperature	Industrial (-40 C to +85 C) or commercial grade

5. Application Areas

Major industries include:

Telecommunications (5G base stations, optical transceivers)
Medical equipment (MRI scanners, patient monitors)
Industrial automation (PLC controllers, robotics)
Consumer electronics (smart home devices, wearables)
Automotive (ADAS systems, V2X communication)

6. Leading Manufacturers and Products

Vendor	Product Series
Xilinx	Zynq UltraScale+ MPSoC Evaluation Kit
Intel	Stratix 10 GX FPGA Development Board
STMicroelectronics	STM32 Nucleo Expansion Boards
Texas Instruments	Processor DKx Daughter Cards

7. Selection Guidelines

Key considerations:

Match SoC architecture to target application requirements
Verify interface compatibility with existing systems
Evaluate available ecosystem (IDE support, middleware)
Consider power budget and thermal management needs
Assess long-term availability and RoHS compliance

8. Industry Trends

Future developments include:

Integration of AI accelerators (NPU modules)
Adoption of 5nm/3nm process technologies
Expansion of RISC-V based evaluation platforms
Increased focus on functional safety (ISO 26262 compliance)
Growing adoption of modular "Lego-style" prototyping systems