Evaluation Boards - Expansion Boards, Daughter Cards

Part Number	Description / PDF	Quantity
ASX00008 Genuino (Arduino)	ARDUINO MKR MEM SHIELD	20
ASX00003 Genuino (Arduino)	ARDUINO MKR MOTOR CARRIER	16
TSX00005 Genuino (Arduino)	MKR2UNO	7
TSX00002 Genuino (Arduino)	MKR PROTOSHIELD LARGE	59
ASX00010 Genuino (Arduino)	ARDUINO MKR RGB	24
ASX00004 Genuino (Arduino)	ARDUINO MKR 485 SHIELD	106
ASX00026 Genuino (Arduino)	ARDUINO PORTENTA VISION SHIELD L	166
T010114 Genuino (Arduino)	MODULE TINKERKIT RED LED 5MM	0
A000007 Genuino (Arduino)	KIT XBEE/SHIELD ARDUINO	0
T010111 Genuino (Arduino)	MODULE TINKERKIT BLUE LED 5MM	0
A000106 Genuino (Arduino)	ARDUINO GSM SHIELD 2 ANT CONN	0
ASX00001 Genuino (Arduino)	ARDUINO WIFI SHIELD 101	0
T000070 Genuino (Arduino)	MODULE TINKERKIT HALL SENSOR	0
T000020 Genuino (Arduino)	MOD TINKERKIT 2/3 AXIS ACCELER	0
T020010 Genuino (Arduino)	TINKERKIT SENSOR SHIELD V.2	0
T020040 Genuino (Arduino)	TINKERKIT MEGA SENSOR SHIELD	0
T010110 Genuino (Arduino)	MODULE TINKERKIT POWER LED	0
T010115 Genuino (Arduino)	MODULE TINKERKIT BLUE LED10MM	0
A000044 Genuino (Arduino)	ARDUINO GSM SHIELD ANTENNA	0
T040060 Genuino (Arduino)	TINKERKIT DMX MASTER SHIELD	0

Evaluation Boards - Expansion Boards, Daughter Cards

1. Overview

Evaluation Boards (EVBs), Expansion Boards, and Daughter Cards are essential hardware tools for embedded system development, prototyping, and testing. These platforms enable engineers to assess processor capabilities, interface peripherals, and validate designs before mass production. Their modular architecture supports rapid innovation in IoT, automotive, industrial automation, and consumer electronics sectors.

2. Main Types and Functional Classification

Type	Functional Features	Application Examples
Microcontroller EVBs	ARM/FPGA SoC integration, onboard sensors, debug interfaces	IoT edge devices, smart sensors
Expansion Boards	Standard interfaces (PCIe, USB-C), protocol converters	Industrial gateways, communication modules
Daughter Cards	Specialized functionality modules (ADC/DAC, RF transceivers)	Medical imaging equipment, test instruments
Programmer Kits	Flash programming, JTAG/SWD debugging, voltage monitoring	Automotive ECUs, aerospace controllers

3. Structure and Components

Typical architecture includes:

Multi-layer PCB with high-speed traces
Processor sockets or soldered-down SoCs
Standardized connectors (2.54mm headers, M.2)
Onboard memory (RAM, Flash storage)
Power management ICs and voltage regulators
Debug interfaces (SWD, JTAG, UART)

4. Key Technical Specifications

Parameter	Description
Clock Speed	Determines processing capability (1MHz-2GHz range)
Bus Width	Memory bandwidth (8/16/32-bit configurations)
Interface Support	USB 3.0, Ethernet, CAN, SPI/I2C compatibility
Power Consumption	Typical range: 0.5W-25W (varies with workload)
Operating Temperature	Industrial (-40 C to +85 C) or commercial grade

5. Application Areas

Major industries include:

Telecommunications (5G base stations, optical transceivers)
Medical equipment (MRI scanners, patient monitors)
Industrial automation (PLC controllers, robotics)
Consumer electronics (smart home devices, wearables)
Automotive (ADAS systems, V2X communication)

6. Leading Manufacturers and Products

Vendor	Product Series
Xilinx	Zynq UltraScale+ MPSoC Evaluation Kit
Intel	Stratix 10 GX FPGA Development Board
STMicroelectronics	STM32 Nucleo Expansion Boards
Texas Instruments	Processor DKx Daughter Cards

7. Selection Guidelines

Key considerations:

Match SoC architecture to target application requirements
Verify interface compatibility with existing systems
Evaluate available ecosystem (IDE support, middleware)
Consider power budget and thermal management needs
Assess long-term availability and RoHS compliance

8. Industry Trends

Future developments include:

Integration of AI accelerators (NPU modules)
Adoption of 5nm/3nm process technologies
Expansion of RISC-V based evaluation platforms
Increased focus on functional safety (ISO 26262 compliance)
Growing adoption of modular "Lego-style" prototyping systems