Evaluation Boards - Expansion Boards, Daughter Cards

Part Number	Description / PDF	Quantity
ASX00012 Genuino (Arduino)	ARDUINO MKR THERM SHIELD	27
TSX00083 Genuino (Arduino)	PROTO SHIELD REV3	109
ASX00006 Genuino (Arduino)	ARDUINO MKR ETH SHIELD	16
T110061 Genuino (Arduino)	TINKERKIT TEXT LCD	0
ASX00031 Genuino (Arduino)	BREAKOUTBOARD BOARD FOR PORTENTA	0
ASX00005 Genuino (Arduino)	ARDUINO MKR CAN SHIELD	16
ABX00047 Genuino (Arduino)	MKR IOT CARRIER	0
ASX00011 Genuino (Arduino)	ARDUINO MKR ENVIRONMENTAL SHIELD	57
A000110 Genuino (Arduino)	ARDUINO 4 RELAYS SHIELD	166
ASX00007 Genuino (Arduino)	ARDUINO MKR CONNECTOR CARRIER	34
TSX00001 Genuino (Arduino)	MKR PROTOSHIELD	24
A000080 Genuino (Arduino)	SHIELD - MEGA PROTO PCB REV3	32
A000070 Genuino (Arduino)	ARDUINO 9 AXIS MOTION SHIELD	40
ASX00017 Genuino (Arduino)	ARDUINO MKR GPS SHIELD	0
A000024 Genuino (Arduino)	ETHERNET SHIELD 2 W/ POE	215
TSX00003 Genuino (Arduino)	MKR RELAY SHIELD	49
A000079 Genuino (Arduino)	ARDUINO SHIELD - MOTOR SHIELD	69
A000065 Genuino (Arduino)	ARDUINO SHIELD - WIRELESS SD	0
ASX00021 Genuino (Arduino)	ARDUINO PORTENTA VISION SHIELD E	119
TSX00004 Genuino (Arduino)	MKR SD SHIELD	21

Evaluation Boards - Expansion Boards, Daughter Cards

1. Overview

Evaluation Boards (EVBs), Expansion Boards, and Daughter Cards are essential hardware tools for embedded system development, prototyping, and testing. These platforms enable engineers to assess processor capabilities, interface peripherals, and validate designs before mass production. Their modular architecture supports rapid innovation in IoT, automotive, industrial automation, and consumer electronics sectors.

2. Main Types and Functional Classification

Type	Functional Features	Application Examples
Microcontroller EVBs	ARM/FPGA SoC integration, onboard sensors, debug interfaces	IoT edge devices, smart sensors
Expansion Boards	Standard interfaces (PCIe, USB-C), protocol converters	Industrial gateways, communication modules
Daughter Cards	Specialized functionality modules (ADC/DAC, RF transceivers)	Medical imaging equipment, test instruments
Programmer Kits	Flash programming, JTAG/SWD debugging, voltage monitoring	Automotive ECUs, aerospace controllers

3. Structure and Components

Typical architecture includes:

Multi-layer PCB with high-speed traces
Processor sockets or soldered-down SoCs
Standardized connectors (2.54mm headers, M.2)
Onboard memory (RAM, Flash storage)
Power management ICs and voltage regulators
Debug interfaces (SWD, JTAG, UART)

4. Key Technical Specifications

Parameter	Description
Clock Speed	Determines processing capability (1MHz-2GHz range)
Bus Width	Memory bandwidth (8/16/32-bit configurations)
Interface Support	USB 3.0, Ethernet, CAN, SPI/I2C compatibility
Power Consumption	Typical range: 0.5W-25W (varies with workload)
Operating Temperature	Industrial (-40 C to +85 C) or commercial grade

5. Application Areas

Major industries include:

Telecommunications (5G base stations, optical transceivers)
Medical equipment (MRI scanners, patient monitors)
Industrial automation (PLC controllers, robotics)
Consumer electronics (smart home devices, wearables)
Automotive (ADAS systems, V2X communication)

6. Leading Manufacturers and Products

Vendor	Product Series
Xilinx	Zynq UltraScale+ MPSoC Evaluation Kit
Intel	Stratix 10 GX FPGA Development Board
STMicroelectronics	STM32 Nucleo Expansion Boards
Texas Instruments	Processor DKx Daughter Cards

7. Selection Guidelines

Key considerations:

Match SoC architecture to target application requirements
Verify interface compatibility with existing systems
Evaluate available ecosystem (IDE support, middleware)
Consider power budget and thermal management needs
Assess long-term availability and RoHS compliance

8. Industry Trends

Future developments include:

Integration of AI accelerators (NPU modules)
Adoption of 5nm/3nm process technologies
Expansion of RISC-V based evaluation platforms
Increased focus on functional safety (ISO 26262 compliance)
Growing adoption of modular "Lego-style" prototyping systems