Evaluation Boards - Expansion Boards, Daughter Cards

Image Part Number Description / PDF Quantity Rfq
PIM333

PIM333

Pimoroni

SCROLL PHAT HD - YELLOW

0

PIM181

PIM181

Pimoroni

ENVIRO PHAT (INDIVIDUAL)

0

PIM267

PIM267

Pimoroni

PHAT BEAT

0

KIT 5001

KIT 5001

Pimoroni

LAIKA EXPLORER BOARD - ROBOTICS

0

PIM254

PIM254

Pimoroni

SPEAKER PHAT

0

PPMB00112

PPMB00112

Pimoroni

BREAD:BIT BREAKOUT BOARD FOR MIC

0

DIYMAT001

DIYMAT001

Pimoroni

UNIVERSAL ZERO

0

PPMB00102

PPMB00102

Pimoroni

EXHI:BIT DIY DAUGHTER BOARD

0

PIM145

PIM145

Pimoroni

ESP8266 PHAT

0

GPIO-BOB-40

GPIO-BOB-40

Pimoroni

RASPBERRY PI GPIO BREAKOUT BOARD

0

PIM351

PIM351

Pimoroni

PICADE X HAT

0

RASPIO-005

RASPIO-005

Pimoroni

RASPIO PRO HAT - PROTECTED POR

0

EML NAV2

EML NAV2

Pimoroni

NAVIO2 - NEW LINUX AUTOPILOT ON

0

Evaluation Boards - Expansion Boards, Daughter Cards

1. Overview

Evaluation Boards (EVBs), Expansion Boards, and Daughter Cards are essential hardware tools for embedded system development, prototyping, and testing. These platforms enable engineers to assess processor capabilities, interface peripherals, and validate designs before mass production. Their modular architecture supports rapid innovation in IoT, automotive, industrial automation, and consumer electronics sectors.

2. Main Types and Functional Classification

TypeFunctional FeaturesApplication Examples
Microcontroller EVBsARM/FPGA SoC integration, onboard sensors, debug interfacesIoT edge devices, smart sensors
Expansion BoardsStandard interfaces (PCIe, USB-C), protocol convertersIndustrial gateways, communication modules
Daughter CardsSpecialized functionality modules (ADC/DAC, RF transceivers)Medical imaging equipment, test instruments
Programmer KitsFlash programming, JTAG/SWD debugging, voltage monitoringAutomotive ECUs, aerospace controllers

3. Structure and Components

Typical architecture includes:

  • Multi-layer PCB with high-speed traces
  • Processor sockets or soldered-down SoCs
  • Standardized connectors (2.54mm headers, M.2)
  • Onboard memory (RAM, Flash storage)
  • Power management ICs and voltage regulators
  • Debug interfaces (SWD, JTAG, UART)

4. Key Technical Specifications

ParameterDescription
Clock SpeedDetermines processing capability (1MHz-2GHz range)
Bus WidthMemory bandwidth (8/16/32-bit configurations)
Interface SupportUSB 3.0, Ethernet, CAN, SPI/I2C compatibility
Power ConsumptionTypical range: 0.5W-25W (varies with workload)
Operating TemperatureIndustrial (-40 C to +85 C) or commercial grade

5. Application Areas

Major industries include:

  • Telecommunications (5G base stations, optical transceivers)
  • Medical equipment (MRI scanners, patient monitors)
  • Industrial automation (PLC controllers, robotics)
  • Consumer electronics (smart home devices, wearables)
  • Automotive (ADAS systems, V2X communication)

6. Leading Manufacturers and Products

VendorProduct Series
XilinxZynq UltraScale+ MPSoC Evaluation Kit
IntelStratix 10 GX FPGA Development Board
STMicroelectronicsSTM32 Nucleo Expansion Boards
Texas InstrumentsProcessor DKx Daughter Cards

7. Selection Guidelines

Key considerations:

  • Match SoC architecture to target application requirements
  • Verify interface compatibility with existing systems
  • Evaluate available ecosystem (IDE support, middleware)
  • Consider power budget and thermal management needs
  • Assess long-term availability and RoHS compliance

8. Industry Trends

Future developments include:

  • Integration of AI accelerators (NPU modules)
  • Adoption of 5nm/3nm process technologies
  • Expansion of RISC-V based evaluation platforms
  • Increased focus on functional safety (ISO 26262 compliance)
  • Growing adoption of modular "Lego-style" prototyping systems
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