Evaluation Boards - Expansion Boards, Daughter Cards

Image Part Number Description / PDF Quantity Rfq
EVAL-AD7984-PMDZ

EVAL-AD7984-PMDZ

Analog Devices, Inc.

EVAL BOARD 18BIT ADC AD7984

2

SEN-16466

SEN-16466

SparkFun

ENVIRONMENTAL SENSOR BREAKOUT -

112

MIKROE-1648

MIKROE-1648

MikroElektronika

BOARD LINEAR HALL SENSOR CLICK

0

SEN0101

SEN0101

DFRobot

TCS3200 RGB COLOR SENSOR BOARD

58

MIKROE-1528

MIKROE-1528

MikroElektronika

DEV BOARD STEPPER

1

MIKROE-3427

MIKROE-3427

MikroElektronika

ECG 4 CLICK

4

BOB-16842

BOB-16842

SparkFun

SPARKFUN QWIIC BUTTON - GREEN LE

71

SEN-15440

SEN-15440

SparkFun

ATMOSPHERIC SENSOR BREAKOUT - BM

112

4808

4808

Adafruit

ADAFRUIT EMC2101 I2C PC FAN CONT

0

SEN0322

SEN0322

DFRobot

GRAVITY: I2C OXYGEN SENSOR

0

114991988

114991988

Seeed

POE HAT FOR ROCK PI 4

1

DFR0029-G

DFR0029-G

DFRobot

GRAVITY: DIGITAL PUSH BUTTON (GR

4

BOOSTXL-ULPSENSE

BOOSTXL-ULPSENSE

Texas Instruments

ULP SENSE BOOSTERPACK

0

MIKROE-1583

MIKROE-1583

MikroElektronika

BOARD LDC1000 CLICK SHORTRANGE

3

107020001

107020001

Seeed

GROVE SPEAKER

27

AST1021

AST1021

TinyCircuits

TEMPERATURE SENSOR WIRELING

17

MNK00062

MNK00062

Pimoroni

SENSOR FOR MICRO:BIT

6

DFR0440

DFR0440

DFRobot

VIBRATION MODULE

2

410-379

410-379

Digilent, Inc.

PMOD I2S2: STEREO AUDIO IN / OUT

73

PIS-1348

PIS-1348

Pi Supply

RASPBERRY PI 1 WIRE I2C HAT

9

Evaluation Boards - Expansion Boards, Daughter Cards

1. Overview

Evaluation Boards (EVBs), Expansion Boards, and Daughter Cards are essential hardware tools for embedded system development, prototyping, and testing. These platforms enable engineers to assess processor capabilities, interface peripherals, and validate designs before mass production. Their modular architecture supports rapid innovation in IoT, automotive, industrial automation, and consumer electronics sectors.

2. Main Types and Functional Classification

TypeFunctional FeaturesApplication Examples
Microcontroller EVBsARM/FPGA SoC integration, onboard sensors, debug interfacesIoT edge devices, smart sensors
Expansion BoardsStandard interfaces (PCIe, USB-C), protocol convertersIndustrial gateways, communication modules
Daughter CardsSpecialized functionality modules (ADC/DAC, RF transceivers)Medical imaging equipment, test instruments
Programmer KitsFlash programming, JTAG/SWD debugging, voltage monitoringAutomotive ECUs, aerospace controllers

3. Structure and Components

Typical architecture includes:

  • Multi-layer PCB with high-speed traces
  • Processor sockets or soldered-down SoCs
  • Standardized connectors (2.54mm headers, M.2)
  • Onboard memory (RAM, Flash storage)
  • Power management ICs and voltage regulators
  • Debug interfaces (SWD, JTAG, UART)

4. Key Technical Specifications

ParameterDescription
Clock SpeedDetermines processing capability (1MHz-2GHz range)
Bus WidthMemory bandwidth (8/16/32-bit configurations)
Interface SupportUSB 3.0, Ethernet, CAN, SPI/I2C compatibility
Power ConsumptionTypical range: 0.5W-25W (varies with workload)
Operating TemperatureIndustrial (-40 C to +85 C) or commercial grade

5. Application Areas

Major industries include:

  • Telecommunications (5G base stations, optical transceivers)
  • Medical equipment (MRI scanners, patient monitors)
  • Industrial automation (PLC controllers, robotics)
  • Consumer electronics (smart home devices, wearables)
  • Automotive (ADAS systems, V2X communication)

6. Leading Manufacturers and Products

VendorProduct Series
XilinxZynq UltraScale+ MPSoC Evaluation Kit
IntelStratix 10 GX FPGA Development Board
STMicroelectronicsSTM32 Nucleo Expansion Boards
Texas InstrumentsProcessor DKx Daughter Cards

7. Selection Guidelines

Key considerations:

  • Match SoC architecture to target application requirements
  • Verify interface compatibility with existing systems
  • Evaluate available ecosystem (IDE support, middleware)
  • Consider power budget and thermal management needs
  • Assess long-term availability and RoHS compliance

8. Industry Trends

Future developments include:

  • Integration of AI accelerators (NPU modules)
  • Adoption of 5nm/3nm process technologies
  • Expansion of RISC-V based evaluation platforms
  • Increased focus on functional safety (ISO 26262 compliance)
  • Growing adoption of modular "Lego-style" prototyping systems
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