Evaluation Boards - Expansion Boards, Daughter Cards

Part Number	Description / PDF	Quantity
DFR0412 DFRobot	GRAVITY IO EXPANSION SHIELD FOR	0
EVAL-CN0337-PMDZ Analog Devices, Inc.	PMOD BRD RTD SENSOR CONDITIONER	0
ASD2511-R-P TinyCircuits	BAROMETRICPRESSURE TINYSHIELD	22
MIKROE-4048 MikroElektronika	I2C MUX CLICK	34
SEN0263 DFRobot	GRAVITY: I2C NON-CONTACT IR TEMP	22
SEN0121 DFRobot	STEAM SENSOR	0
MIKROE-2756 MikroElektronika	PI 3 CLICK SHIELD	92
LIGHT-02 OSEPP Electronics	LIGHT SENSOR MODULE	460
103020027 Seeed	GROVE - MEGA SHIELD V1.2	87
104020169 Seeed	GROVE - RGB LED (WS2813 MINI)	120
COM-14890 SparkFun	SPARKFUN GATOR COLOR PROTOSNAP	0
101020063 Seeed	GROVE LOUDNESS SENSOR	22
105020074 Seeed	GROVE - LED MATRIX DRIVER (HT16K	155
SPOC2DBBTS722204ESATOBO1 IR (Infineon Technologies)	SPOC+2 BTS72220-4ESA DAUGHTER	4
MIKROE-2004 MikroElektronika	FAN CLICK	2
4254 Adafruit	QUAD SIDE-BY-SIDE FEATHERWING KI	96
103020293 Seeed	GROVE - 8 CHANNEL I2C MULTIPLEX	41
MIKROE-1379 MikroElektronika	BOARD ADD-ON GYRO CLICK	0
5641 Kitronik	ROBOTICS BOARD FOR BBC MICRO:BIT	0
MIKROE-2366 MikroElektronika	THUMBWHEEL CLICK	1

Evaluation Boards - Expansion Boards, Daughter Cards

1. Overview

Evaluation Boards (EVBs), Expansion Boards, and Daughter Cards are essential hardware tools for embedded system development, prototyping, and testing. These platforms enable engineers to assess processor capabilities, interface peripherals, and validate designs before mass production. Their modular architecture supports rapid innovation in IoT, automotive, industrial automation, and consumer electronics sectors.

2. Main Types and Functional Classification

Type	Functional Features	Application Examples
Microcontroller EVBs	ARM/FPGA SoC integration, onboard sensors, debug interfaces	IoT edge devices, smart sensors
Expansion Boards	Standard interfaces (PCIe, USB-C), protocol converters	Industrial gateways, communication modules
Daughter Cards	Specialized functionality modules (ADC/DAC, RF transceivers)	Medical imaging equipment, test instruments
Programmer Kits	Flash programming, JTAG/SWD debugging, voltage monitoring	Automotive ECUs, aerospace controllers

3. Structure and Components

Typical architecture includes:

Multi-layer PCB with high-speed traces
Processor sockets or soldered-down SoCs
Standardized connectors (2.54mm headers, M.2)
Onboard memory (RAM, Flash storage)
Power management ICs and voltage regulators
Debug interfaces (SWD, JTAG, UART)

4. Key Technical Specifications

Parameter	Description
Clock Speed	Determines processing capability (1MHz-2GHz range)
Bus Width	Memory bandwidth (8/16/32-bit configurations)
Interface Support	USB 3.0, Ethernet, CAN, SPI/I2C compatibility
Power Consumption	Typical range: 0.5W-25W (varies with workload)
Operating Temperature	Industrial (-40 C to +85 C) or commercial grade

5. Application Areas

Major industries include:

Telecommunications (5G base stations, optical transceivers)
Medical equipment (MRI scanners, patient monitors)
Industrial automation (PLC controllers, robotics)
Consumer electronics (smart home devices, wearables)
Automotive (ADAS systems, V2X communication)

6. Leading Manufacturers and Products

Vendor	Product Series
Xilinx	Zynq UltraScale+ MPSoC Evaluation Kit
Intel	Stratix 10 GX FPGA Development Board
STMicroelectronics	STM32 Nucleo Expansion Boards
Texas Instruments	Processor DKx Daughter Cards

7. Selection Guidelines

Key considerations:

Match SoC architecture to target application requirements
Verify interface compatibility with existing systems
Evaluate available ecosystem (IDE support, middleware)
Consider power budget and thermal management needs
Assess long-term availability and RoHS compliance

8. Industry Trends

Future developments include:

Integration of AI accelerators (NPU modules)
Adoption of 5nm/3nm process technologies
Expansion of RISC-V based evaluation platforms
Increased focus on functional safety (ISO 26262 compliance)
Growing adoption of modular "Lego-style" prototyping systems