Evaluation Boards - Expansion Boards, Daughter Cards

Part Number	Description / PDF	Quantity
MIKROE-3992 MikroElektronika	CAN FD 3 CLICK	22
TOS-100 V1.1 TRINAMIC Motion Control GmbH	BOARD SHIELD DVR STEPPER MOTOR	59
MIKROE-1938 MikroElektronika	MAGNETO 2 CLICK	0
DFR0499 DFRobot	64X64 RGB LED MATRIX PANEL (3MM	15
101020852 Seeed	GROVE - ANALOG MICROPHONE	40
SK-90DCT-AR 4D Systems	STARTER KIT FOR ULCD-90DCT-AR WI	4
ETH-MANGOH Sierra Wireless by Talon	MANGOH ETHERNET	9
MIKROE-2736 MikroElektronika	UV 3 CLICK	2
MIKROE-3566 MikroElektronika	PRESSURE 5 CLICK	5
5693 Kitronik	KITRONIK COMPACT ALL-IN-ONE ROBO	0
DPP901G000 TE Connectivity Measurement Specialties	GROVE MS8607 DEV BOARD	7
PIS-1260 Pi Supply	OCTOPUS ANALOG PHOTOCELL BRICK O	50
SEN-17770 SparkFun	LUXONIS OAK-D DEPTHAI HARDWARE	5
MIKROE-4271 MikroElektronika	CURRENT LIMIT CLICK	5
101020081 Seeed	GROVE - 6-AXIS ACCELEROMETER&COM	0
CY8CKIT-028-TFT Cypress Semiconductor	SHIELD SENSORS AUDIO AND TFT	0
CLEO-SPK1 Bridgetek	0.5W CLEO SPEAKER ACCESSORY	0
S2GOPRESSUREDPS422TOBO1 IR (Infineon Technologies)	EVAL DPS422 BAROMETRIC	0
SEN0334 DFRobot	SHT31-F TEMP/HUMIDITY SENSOR BRD	37
DFR0491 DFRobot	GRAVITY IO EXPANSION SHIELD FOR	12

Evaluation Boards - Expansion Boards, Daughter Cards

1. Overview

Evaluation Boards (EVBs), Expansion Boards, and Daughter Cards are essential hardware tools for embedded system development, prototyping, and testing. These platforms enable engineers to assess processor capabilities, interface peripherals, and validate designs before mass production. Their modular architecture supports rapid innovation in IoT, automotive, industrial automation, and consumer electronics sectors.

2. Main Types and Functional Classification

Type	Functional Features	Application Examples
Microcontroller EVBs	ARM/FPGA SoC integration, onboard sensors, debug interfaces	IoT edge devices, smart sensors
Expansion Boards	Standard interfaces (PCIe, USB-C), protocol converters	Industrial gateways, communication modules
Daughter Cards	Specialized functionality modules (ADC/DAC, RF transceivers)	Medical imaging equipment, test instruments
Programmer Kits	Flash programming, JTAG/SWD debugging, voltage monitoring	Automotive ECUs, aerospace controllers

3. Structure and Components

Typical architecture includes:

Multi-layer PCB with high-speed traces
Processor sockets or soldered-down SoCs
Standardized connectors (2.54mm headers, M.2)
Onboard memory (RAM, Flash storage)
Power management ICs and voltage regulators
Debug interfaces (SWD, JTAG, UART)

4. Key Technical Specifications

Parameter	Description
Clock Speed	Determines processing capability (1MHz-2GHz range)
Bus Width	Memory bandwidth (8/16/32-bit configurations)
Interface Support	USB 3.0, Ethernet, CAN, SPI/I2C compatibility
Power Consumption	Typical range: 0.5W-25W (varies with workload)
Operating Temperature	Industrial (-40 C to +85 C) or commercial grade

5. Application Areas

Major industries include:

Telecommunications (5G base stations, optical transceivers)
Medical equipment (MRI scanners, patient monitors)
Industrial automation (PLC controllers, robotics)
Consumer electronics (smart home devices, wearables)
Automotive (ADAS systems, V2X communication)

6. Leading Manufacturers and Products

Vendor	Product Series
Xilinx	Zynq UltraScale+ MPSoC Evaluation Kit
Intel	Stratix 10 GX FPGA Development Board
STMicroelectronics	STM32 Nucleo Expansion Boards
Texas Instruments	Processor DKx Daughter Cards

7. Selection Guidelines

Key considerations:

Match SoC architecture to target application requirements
Verify interface compatibility with existing systems
Evaluate available ecosystem (IDE support, middleware)
Consider power budget and thermal management needs
Assess long-term availability and RoHS compliance

8. Industry Trends

Future developments include:

Integration of AI accelerators (NPU modules)
Adoption of 5nm/3nm process technologies
Expansion of RISC-V based evaluation platforms
Increased focus on functional safety (ISO 26262 compliance)
Growing adoption of modular "Lego-style" prototyping systems