Evaluation Boards - Expansion Boards, Daughter Cards

Part Number	Description / PDF	Quantity
PIS-1130 Pi Supply	MICRO:BIT LORA NODE 868/915MHZ	23
COM-15290 SparkFun	QWIIC KEYPAD - 12 BUTTON	33
MIKROE-1513 MikroElektronika	PI CLICK SHIELD SOLDERED CONN	4
MIKROE-3455 MikroElektronika	PROXIMITY 10 CLICK	7
PIM266 Pimoroni	FOUR LETTER PHAT	0
MIKROE-1304 MikroElektronika	RF TXRX MODULE ISM>1GHZ CHIP ANT	5
MIKROE-4419 MikroElektronika	I2C EXTEND 2 CLICK	0
MIKROE-4171 MikroElektronika	CLOCK GEN 3 CLICK	9
X-NUCLEO-6180A1 STMicroelectronics	PROXIMITY TOF SENSOR EXPANSION B	32
DPP901Z000 TE Connectivity Measurement Specialties	PMOD MS8607	0
MAX33042ESHLD# Maxim Integrated	SHIELD EVKIT FOR 5V CAN VERSION	313
201882 Watterott electronic	CANDIY-SHIELD FD - CAN-BUS SHIEL	0
BM1383AGLV-EVK-001 ROHM Semiconductor	SENSORSHLD1-EVK-101 EVALUATION B	5
101020652 Seeed	GROVE 2.5A DC CURRENT SENSOR	96
DPP301Z000 TE Connectivity Measurement Specialties	PMOD HTU21	42
MIKROE-3021 MikroElektronika	BARGRAPH 2 CLICK	5
SEN-15335 SparkFun	9DOF IMU BREAKOUT - ICM-20948 (Q	421
DEV-14052 SparkFun	SPECTACLE LIGHT BOARD	0
MIKROE-4482 MikroElektronika	NVSRAM 4 CLICK	5
MIKROE-3444 MikroElektronika	AMBIENT 6 CLICK	5

Evaluation Boards - Expansion Boards, Daughter Cards

1. Overview

Evaluation Boards (EVBs), Expansion Boards, and Daughter Cards are essential hardware tools for embedded system development, prototyping, and testing. These platforms enable engineers to assess processor capabilities, interface peripherals, and validate designs before mass production. Their modular architecture supports rapid innovation in IoT, automotive, industrial automation, and consumer electronics sectors.

2. Main Types and Functional Classification

Type	Functional Features	Application Examples
Microcontroller EVBs	ARM/FPGA SoC integration, onboard sensors, debug interfaces	IoT edge devices, smart sensors
Expansion Boards	Standard interfaces (PCIe, USB-C), protocol converters	Industrial gateways, communication modules
Daughter Cards	Specialized functionality modules (ADC/DAC, RF transceivers)	Medical imaging equipment, test instruments
Programmer Kits	Flash programming, JTAG/SWD debugging, voltage monitoring	Automotive ECUs, aerospace controllers

3. Structure and Components

Typical architecture includes:

Multi-layer PCB with high-speed traces
Processor sockets or soldered-down SoCs
Standardized connectors (2.54mm headers, M.2)
Onboard memory (RAM, Flash storage)
Power management ICs and voltage regulators
Debug interfaces (SWD, JTAG, UART)

4. Key Technical Specifications

Parameter	Description
Clock Speed	Determines processing capability (1MHz-2GHz range)
Bus Width	Memory bandwidth (8/16/32-bit configurations)
Interface Support	USB 3.0, Ethernet, CAN, SPI/I2C compatibility
Power Consumption	Typical range: 0.5W-25W (varies with workload)
Operating Temperature	Industrial (-40 C to +85 C) or commercial grade

5. Application Areas

Major industries include:

Telecommunications (5G base stations, optical transceivers)
Medical equipment (MRI scanners, patient monitors)
Industrial automation (PLC controllers, robotics)
Consumer electronics (smart home devices, wearables)
Automotive (ADAS systems, V2X communication)

6. Leading Manufacturers and Products

Vendor	Product Series
Xilinx	Zynq UltraScale+ MPSoC Evaluation Kit
Intel	Stratix 10 GX FPGA Development Board
STMicroelectronics	STM32 Nucleo Expansion Boards
Texas Instruments	Processor DKx Daughter Cards

7. Selection Guidelines

Key considerations:

Match SoC architecture to target application requirements
Verify interface compatibility with existing systems
Evaluate available ecosystem (IDE support, middleware)
Consider power budget and thermal management needs
Assess long-term availability and RoHS compliance

8. Industry Trends

Future developments include:

Integration of AI accelerators (NPU modules)
Adoption of 5nm/3nm process technologies
Expansion of RISC-V based evaluation platforms
Increased focus on functional safety (ISO 26262 compliance)
Growing adoption of modular "Lego-style" prototyping systems