Evaluation Boards - Expansion Boards, Daughter Cards

Part Number	Description / PDF	Quantity
BTF3035EJDEMOBOARDTOBO1 IR (Infineon Technologies)	BTF3035EJ DEMOBOARD	6
SEN0251 DFRobot	GRAVITY BAROMETRIC PRESSURE SENS	24
PIM058 Pimoroni	SKYWRITER HAT (INDIVIDUAL)	4
ULCD-90DT-PI 4D Systems	9.0" MICRO LCD PACK FOR RASPBERR	0
ISOIOZ19112 Made Systems	ISOLATED I/O DUAL RELAY AND OPTO	14
X-NUCLEO-NFC02A1 STMicroelectronics	NUCLEO BOARD M24LR04E-R NFC	14
MIKROE-2396 MikroElektronika	R METER CLICK	0
103020132 Seeed	GROVE 2CHANNEL SPDT RELAY	0
OM-E-ETH Onion Corporation	ETHERNET EXPANSION	23
MIKROE-2973 MikroElektronika	SPECTRAL 2 CLICK	3
114992260 Seeed	IMX219-77 8MP CAMERA WITH 77 FOV	37
ULCD-90DT-AR 4D Systems	9.0" MICRO LCD PACK FOR ARDUINO	1
3589 Adafruit	USB CONS & POWER ADDON	9
5631 Kitronik	:KLEF PIANO FOR THE MICRO:BIT	10
PIS-0552 Pi Supply	FLICK ZERO	20
MIKROE-3048 MikroElektronika	PROXIMITY 6 CLICK	2
MIKROE-3116 MikroElektronika	MULTIMETER CLICK	5
OM13588UL NXP Semiconductors	USB TYPE C SHIELD BOARD	29
SEN0308 DFRobot	GRAVITY: ANALOG WATERPROOF CAPAC	55
103020137 Seeed	GROVE SOLID STATE RELAY V2	1

Evaluation Boards - Expansion Boards, Daughter Cards

1. Overview

Evaluation Boards (EVBs), Expansion Boards, and Daughter Cards are essential hardware tools for embedded system development, prototyping, and testing. These platforms enable engineers to assess processor capabilities, interface peripherals, and validate designs before mass production. Their modular architecture supports rapid innovation in IoT, automotive, industrial automation, and consumer electronics sectors.

2. Main Types and Functional Classification

Type	Functional Features	Application Examples
Microcontroller EVBs	ARM/FPGA SoC integration, onboard sensors, debug interfaces	IoT edge devices, smart sensors
Expansion Boards	Standard interfaces (PCIe, USB-C), protocol converters	Industrial gateways, communication modules
Daughter Cards	Specialized functionality modules (ADC/DAC, RF transceivers)	Medical imaging equipment, test instruments
Programmer Kits	Flash programming, JTAG/SWD debugging, voltage monitoring	Automotive ECUs, aerospace controllers

3. Structure and Components

Typical architecture includes:

Multi-layer PCB with high-speed traces
Processor sockets or soldered-down SoCs
Standardized connectors (2.54mm headers, M.2)
Onboard memory (RAM, Flash storage)
Power management ICs and voltage regulators
Debug interfaces (SWD, JTAG, UART)

4. Key Technical Specifications

Parameter	Description
Clock Speed	Determines processing capability (1MHz-2GHz range)
Bus Width	Memory bandwidth (8/16/32-bit configurations)
Interface Support	USB 3.0, Ethernet, CAN, SPI/I2C compatibility
Power Consumption	Typical range: 0.5W-25W (varies with workload)
Operating Temperature	Industrial (-40 C to +85 C) or commercial grade

5. Application Areas

Major industries include:

Telecommunications (5G base stations, optical transceivers)
Medical equipment (MRI scanners, patient monitors)
Industrial automation (PLC controllers, robotics)
Consumer electronics (smart home devices, wearables)
Automotive (ADAS systems, V2X communication)

6. Leading Manufacturers and Products

Vendor	Product Series
Xilinx	Zynq UltraScale+ MPSoC Evaluation Kit
Intel	Stratix 10 GX FPGA Development Board
STMicroelectronics	STM32 Nucleo Expansion Boards
Texas Instruments	Processor DKx Daughter Cards

7. Selection Guidelines

Key considerations:

Match SoC architecture to target application requirements
Verify interface compatibility with existing systems
Evaluate available ecosystem (IDE support, middleware)
Consider power budget and thermal management needs
Assess long-term availability and RoHS compliance

8. Industry Trends

Future developments include:

Integration of AI accelerators (NPU modules)
Adoption of 5nm/3nm process technologies
Expansion of RISC-V based evaluation platforms
Increased focus on functional safety (ISO 26262 compliance)
Growing adoption of modular "Lego-style" prototyping systems