Accessories

Image Part Number Description / PDF Quantity Rfq
MIKROE-202

MIKROE-202

MikroElektronika

DISPLAY BOARD 2 SERIAL 7SEGMENT

0

MIKROE-76

MIKROE-76

MikroElektronika

COMPACT FLASH BOARD

0

MIKROE-201

MIKROE-201

MikroElektronika

DISPLAY BOARD SERIAL 7SEGMENT

0

MIKROE-86

MIKROE-86

MikroElektronika

KEYPAD BOARD 4X4 PB

5

MIKROE-194

MIKROE-194

MikroElektronika

BOARD EASYCONNECT2

0

MIKROE-410

MIKROE-410

MikroElektronika

BOOK PIC MCU PROGRAMMING IN C

0

MIKROE-486

MIKROE-486

MikroElektronika

BOARD EASY PS/2

0

MIKROE-1025

MIKROE-1025

MikroElektronika

BOARD EASYINPUT IDC10 PORT

0

MIKROE-316

MIKROE-316

MikroElektronika

BOARD POTENTIOMETER

0

MIKROE-2519

MIKROE-2519

MikroElektronika

FFC FLAT CABLE 20-PIN

0

MIKROE-392

MIKROE-392

MikroElektronika

BOARD DISPL SER 7SEG 8DIGIT

0

MIKROE-55

MIKROE-55

MikroElektronika

BOARD LCD 2X16

66

MIKROE-4319

MIKROE-4319

MikroElektronika

SOCKET MIKROBUS 16 SMD GRAY

5

MIKROE-1765

MIKROE-1765

MikroElektronika

BOARD ADAPTER 50-100MIL

250

MIKROE-478

MIKROE-478

MikroElektronika

BOARD EASYBUZZ PIEZO SPEAKER

0

MIKROE-575

MIKROE-575

MikroElektronika

BOARD EASYPULL W/1K RESISTORS

0

MIKROE-576

MIKROE-576

MikroElektronika

BOARD EASYPULL W/10K RESISTORS

0

MIKROE-193

MIKROE-193

MikroElektronika

BOARD EASYPROTO

0

MIKROE-1303

MIKROE-1303

MikroElektronika

ADAPTER MIKROPROG TO ST-LINK V2

34

MIKROE-571

MIKROE-571

MikroElektronika

BOARD EASYLED W/RED DIODES

2

Accessories

1. Overview

Development board accessories are essential components that extend the functionality of microcontroller/processor development platforms. These accessories include interface cables, power modules, sensor modules, expansion boards, and debugging tools that enable rapid prototyping and system integration. As core enablers for embedded system development, IoT prototyping, and industrial automation, these accessories significantly reduce development time while improving hardware compatibility and measurement accuracy.

2. Main Types and Functional Classification

TypeFunctional FeaturesApplication Examples
Interface CablesHigh-speed data transfer, hot-plugging supportUSB-UART converters, HDMI breakout cables
Power ModulesRegulated voltage output, battery managementLipo battery packs, DC-DC converters
Sensor ModulesDigital/analog signal acquisition, calibration-freeTemperature/humidity sensors, IMUs
Expansion BoardsPeripheral interface extension, protocol conversionMotor drivers, LoRaWAN shields
Debugging ToolsReal-time tracing, voltage measurementJTAG probes, logic analyzers

3. Structure and Composition

Typical accessories feature: - Hardware Shell: Flame-retardant ABS or CNC-machined aluminum for mechanical protection - Interface Circuits: Level shifters and ESD protection components - Communication Modules: SPI/I2C/UART protocol converters - Power Conditioning: Voltage regulators and current limiting circuits - Mechanical Components: Mounting brackets and anti-vibration pads

4. Key Technical Specifications

ParameterDescription
Interface CompatibilitySupports USB 3.0, SPI up to 10MHz, I2C 400kHz
Power Handling1.8V-24V input range, 5A max current
Signal Integrity12-bit ADC resolution (0.01% error), 1ns jitter
Environmental RatingOperating temp: -40 C to +85 C, IP54 dust/water resistance
EMC ComplianceFCC Part 15 Class B, CE EN55032

5. Application Fields

  • IoT Development: Smart home sensor nodes
  • Industrial Automation: PLC expansion modules
  • Consumer Electronics: Prototype gaming controllers
  • Education: Robotics training platforms
  • Medical Devices: Portable diagnostic equipment

6. Leading Manufacturers and Products

ManufacturerRepresentative Products
ArduinoArduino MKR Shield, Nano I/O Breakout
Raspberry PiPico W Expansion Board, HAT+ Prototyping
STMicroelectronicsST-Link/V2 Debugger, X-NUCLEO Expansion
Texas InstrumentsLaunchPad SensorHub, BoosterPack MKII

7. Selection Guide

Key considerations: - Project requirements: Match sensor types and communication protocols - Compatibility: Verify voltage levels and physical dimensions - Expandability: Check available GPIO and bus interfaces - Cost-effectiveness: Balance performance vs. budget - Environmental factors: Temperature range and vibration resistance - Support ecosystem: Availability of libraries and community resources

8. Industry Trends

Emerging trends include: - Wireless integration (Bluetooth/WiFi 6 modules) - AI-enabled sensor fusion algorithms - Modular system-in-package (SiP) designs - Open-source hardware standardization - Energy-harvesting power solutions - Increased adoption of 2.54mm standardization

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