Accessories

Image Part Number Description / PDF Quantity Rfq
MIKROE-573

MIKROE-573

MikroElektronika

BOARD EASYLED W/YELLOW DIODES

0

MIKROE-1766

MIKROE-1766

MikroElektronika

FLAT CBL IDC10 1.27MM CONNECTOR

160

MIKROE-322

MIKROE-322

MikroElektronika

BOARD TOUCHPANEL CONNECTOR

0

MIKROE-2823

MIKROE-2823

MikroElektronika

THERMOCOUPLE TYPE-J GLASS BRAID

14

MIKROE-159

MIKROE-159

MikroElektronika

CHARACTER LCD 4X20 WITH LARGE DI

0

MIKROE-4461

MIKROE-4461

MikroElektronika

DIP SWITCH 10 DTS-10-LE SMD COMP

0

MIKROE-4463

MIKROE-4463

MikroElektronika

DISPLAY TFT 3.5" MI0350C4T-1CP1

0

MIKROE-4462

MIKROE-4462

MikroElektronika

FLAT RIBBON CABLE 1.27MM PITCH C

0

MIKROE-314

MIKROE-314

MikroElektronika

BOARD SIM CARD HOLDER

0

MIKROE-1281

MIKROE-1281

MikroElektronika

MICROSD CARD 2GB WITH ADAPTER

0

MIKROE-320

MIKROE-320

MikroElektronika

BOARD PROTO CONNECT 2

0

MIKROE-1283

MIKROE-1283

MikroElektronika

MICROSD CARD 8GB WITH ADAPTER

0

MIKROE-269

MIKROE-269

MikroElektronika

BOARD USB CONNECTOR

0

MIKROE-1282

MIKROE-1282

MikroElektronika

MICROSD CARD 4GB WITH ADAPTER

0

MIKROE-130

MIKROE-130

MikroElektronika

ADAPTER BOARD GLCD PAR 128X64

0

MIKROE-429

MIKROE-429

MikroElektronika

BOARD PROTO MICROSD CARD

0

MIKROE-268

MIKROE-268

MikroElektronika

BOARD PS/2 CONNECTOR

0

Accessories

1. Overview

Development board accessories are essential components that extend the functionality of microcontroller/processor development platforms. These accessories include interface cables, power modules, sensor modules, expansion boards, and debugging tools that enable rapid prototyping and system integration. As core enablers for embedded system development, IoT prototyping, and industrial automation, these accessories significantly reduce development time while improving hardware compatibility and measurement accuracy.

2. Main Types and Functional Classification

TypeFunctional FeaturesApplication Examples
Interface CablesHigh-speed data transfer, hot-plugging supportUSB-UART converters, HDMI breakout cables
Power ModulesRegulated voltage output, battery managementLipo battery packs, DC-DC converters
Sensor ModulesDigital/analog signal acquisition, calibration-freeTemperature/humidity sensors, IMUs
Expansion BoardsPeripheral interface extension, protocol conversionMotor drivers, LoRaWAN shields
Debugging ToolsReal-time tracing, voltage measurementJTAG probes, logic analyzers

3. Structure and Composition

Typical accessories feature: - Hardware Shell: Flame-retardant ABS or CNC-machined aluminum for mechanical protection - Interface Circuits: Level shifters and ESD protection components - Communication Modules: SPI/I2C/UART protocol converters - Power Conditioning: Voltage regulators and current limiting circuits - Mechanical Components: Mounting brackets and anti-vibration pads

4. Key Technical Specifications

ParameterDescription
Interface CompatibilitySupports USB 3.0, SPI up to 10MHz, I2C 400kHz
Power Handling1.8V-24V input range, 5A max current
Signal Integrity12-bit ADC resolution (0.01% error), 1ns jitter
Environmental RatingOperating temp: -40 C to +85 C, IP54 dust/water resistance
EMC ComplianceFCC Part 15 Class B, CE EN55032

5. Application Fields

  • IoT Development: Smart home sensor nodes
  • Industrial Automation: PLC expansion modules
  • Consumer Electronics: Prototype gaming controllers
  • Education: Robotics training platforms
  • Medical Devices: Portable diagnostic equipment

6. Leading Manufacturers and Products

ManufacturerRepresentative Products
ArduinoArduino MKR Shield, Nano I/O Breakout
Raspberry PiPico W Expansion Board, HAT+ Prototyping
STMicroelectronicsST-Link/V2 Debugger, X-NUCLEO Expansion
Texas InstrumentsLaunchPad SensorHub, BoosterPack MKII

7. Selection Guide

Key considerations: - Project requirements: Match sensor types and communication protocols - Compatibility: Verify voltage levels and physical dimensions - Expandability: Check available GPIO and bus interfaces - Cost-effectiveness: Balance performance vs. budget - Environmental factors: Temperature range and vibration resistance - Support ecosystem: Availability of libraries and community resources

8. Industry Trends

Emerging trends include: - Wireless integration (Bluetooth/WiFi 6 modules) - AI-enabled sensor fusion algorithms - Modular system-in-package (SiP) designs - Open-source hardware standardization - Energy-harvesting power solutions - Increased adoption of 2.54mm standardization

RFQ BOM Call Skype Email
Top