Accessories

Image Part Number Description / PDF Quantity Rfq
MIKROE-2457

MIKROE-2457

MikroElektronika

ECG CABLE

139

MIKROE-1401

MIKROE-1401

MikroElektronika

DISPLAY TOUCH 4.3" TFT 480X272

0

MIKROE-205

MIKROE-205

MikroElektronika

SMARTADAPT2 BOARD

0

MIKROE-448

MIKROE-448

MikroElektronika

BOARD MICROSD CARD SPI

0

MIKROE-572

MIKROE-572

MikroElektronika

BOARD EASYLED W/GREEN DIODES

0

MIKROE-128

MIKROE-128

MikroElektronika

BOARD EASYCONNECT

0

MIKROE-207

MIKROE-207

MikroElektronika

SMARTADAPT2 WITH GLCD CONNECTOR

0

MIKROE-2456

MIKROE-2456

MikroElektronika

ECG SENSOR ELECTRODES 30PACK

130

MIKROE-4283

MIKROE-4283

MikroElektronika

PIC ICSP ADAPTER

4

MIKROE-1973

MIKROE-1973

MikroElektronika

GESTURE BOARD USB ADAPTER

1

MIKROE-1134

MIKROE-1134

MikroElektronika

ETHERNET ROLL CABLE TRANSPARENT

0

MIKROE-315

MIKROE-315

MikroElektronika

BOARD ICD2 CONNECTOR

49

MIKROE-206

MIKROE-206

MikroElektronika

SMARTADAPT MINI BOARD

0

MIKROE-485

MIKROE-485

MikroElektronika

ACCY TOUCHPANEL PLASTIC PEN

478

MIKROE-204

MIKROE-204

MikroElektronika

SMARTADAPT

0

MIKROE-1142

MIKROE-1142

MikroElektronika

DISPLAY BOARD EASYTFT

0

MIKROE-1302

MIKROE-1302

MikroElektronika

CBL THERM TYPE-K GLASS PCC-SMP

4

MIKROE-224

MIKROE-224

MikroElektronika

BOARD ETHERNET CONNECTOR

1

MIKROE-131

MIKROE-131

MikroElektronika

BOARD LCD ADAPTER PAR 2X16-4X20

0

MIKROE-499

MIKROE-499

MikroElektronika

BOOK PIC MCU ROGRAMMING BASIC

0

Accessories

1. Overview

Development board accessories are essential components that extend the functionality of microcontroller/processor development platforms. These accessories include interface cables, power modules, sensor modules, expansion boards, and debugging tools that enable rapid prototyping and system integration. As core enablers for embedded system development, IoT prototyping, and industrial automation, these accessories significantly reduce development time while improving hardware compatibility and measurement accuracy.

2. Main Types and Functional Classification

TypeFunctional FeaturesApplication Examples
Interface CablesHigh-speed data transfer, hot-plugging supportUSB-UART converters, HDMI breakout cables
Power ModulesRegulated voltage output, battery managementLipo battery packs, DC-DC converters
Sensor ModulesDigital/analog signal acquisition, calibration-freeTemperature/humidity sensors, IMUs
Expansion BoardsPeripheral interface extension, protocol conversionMotor drivers, LoRaWAN shields
Debugging ToolsReal-time tracing, voltage measurementJTAG probes, logic analyzers

3. Structure and Composition

Typical accessories feature: - Hardware Shell: Flame-retardant ABS or CNC-machined aluminum for mechanical protection - Interface Circuits: Level shifters and ESD protection components - Communication Modules: SPI/I2C/UART protocol converters - Power Conditioning: Voltage regulators and current limiting circuits - Mechanical Components: Mounting brackets and anti-vibration pads

4. Key Technical Specifications

ParameterDescription
Interface CompatibilitySupports USB 3.0, SPI up to 10MHz, I2C 400kHz
Power Handling1.8V-24V input range, 5A max current
Signal Integrity12-bit ADC resolution (0.01% error), 1ns jitter
Environmental RatingOperating temp: -40 C to +85 C, IP54 dust/water resistance
EMC ComplianceFCC Part 15 Class B, CE EN55032

5. Application Fields

  • IoT Development: Smart home sensor nodes
  • Industrial Automation: PLC expansion modules
  • Consumer Electronics: Prototype gaming controllers
  • Education: Robotics training platforms
  • Medical Devices: Portable diagnostic equipment

6. Leading Manufacturers and Products

ManufacturerRepresentative Products
ArduinoArduino MKR Shield, Nano I/O Breakout
Raspberry PiPico W Expansion Board, HAT+ Prototyping
STMicroelectronicsST-Link/V2 Debugger, X-NUCLEO Expansion
Texas InstrumentsLaunchPad SensorHub, BoosterPack MKII

7. Selection Guide

Key considerations: - Project requirements: Match sensor types and communication protocols - Compatibility: Verify voltage levels and physical dimensions - Expandability: Check available GPIO and bus interfaces - Cost-effectiveness: Balance performance vs. budget - Environmental factors: Temperature range and vibration resistance - Support ecosystem: Availability of libraries and community resources

8. Industry Trends

Emerging trends include: - Wireless integration (Bluetooth/WiFi 6 modules) - AI-enabled sensor fusion algorithms - Modular system-in-package (SiP) designs - Open-source hardware standardization - Energy-harvesting power solutions - Increased adoption of 2.54mm standardization

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