Accessories

Image Part Number Description / PDF Quantity Rfq
MPC5668GNEXUSADP

MPC5668GNEXUSADP

NXP Semiconductors

ADAPTER FOR FULL NEXUS

0

PQ-MDS-PEXPCI

PQ-MDS-PEXPCI

NXP Semiconductors

ADAPTER MPC8XXX FOR PEX

0

SCFLXRAYADPTS12

SCFLXRAYADPTS12

NXP Semiconductors

ADAPTER BOARD FRDC

0

M68PA08MR24B56

M68PA08MR24B56

NXP Semiconductors

ADAPTER PROGRAMMING

0

CWH-ETP-BDM-YE

CWH-ETP-BDM-YE

NXP Semiconductors

KIT ETHERNET TAP PROBE TIP BDM

0

SCMA08MGET

SCMA08MGET

NXP Semiconductors

MCU ADAPTER

0

OM10065

OM10065

NXP Semiconductors

DAUGHTER BOARD FOR PDS51-MK2

0

M68TE08LJLKFU64E

M68TE08LJLKFU64E

NXP Semiconductors

ADAPTER TARGET HEAD

0

FSICECBLBSAE

FSICECBLBSAE

NXP Semiconductors

BUS ANALYZER CABLE

0

CWH-GTP-JTAG-HE

CWH-GTP-JTAG-HE

NXP Semiconductors

KIT GIGABIT TAP JTAG

0

M68TQS064SAF1E

M68TQS064SAF1E

NXP Semiconductors

HARDWARE 64-QFP SOCKET

0

SCPRUS12MN16

SCPRUS12MN16

NXP Semiconductors

S12 PRU IN 208-QFP

0

MXC9ACCSRYK-AB

MXC9ACCSRYK-AB

NXP Semiconductors

ACCY CARDS ZAS ACCESSORY

0

DC9S08AC128

DC9S08AC128

NXP Semiconductors

DAUGHTER CARD FOR DEMOAC

0

M68DIP28SOIC

M68DIP28SOIC

NXP Semiconductors

ADAPTER CBL 28-DIP TO 28-SOIC

0

M68TQP064SA1E

M68TQP064SA1E

NXP Semiconductors

HARDWARE 64-QFP

0

M68TE08LJLKPK80E

M68TE08LJLKPK80E

NXP Semiconductors

ADAPTER TARGET HEAD

0

TH08QYP16E

TH08QYP16E

NXP Semiconductors

TARGET HEAD ADAPTER 16DIP/SOIC

0

EMCBL60E

EMCBL60E

NXP Semiconductors

MCU FLEX CABLE

0

CWH-UTP-PPCC-HE

CWH-UTP-PPCC-HE

NXP Semiconductors

USB TAP PQ II/III FOR POWERPC CO

0

Accessories

1. Overview

Development board accessories are essential components that extend the functionality of microcontroller/processor development platforms. These accessories include interface cables, power modules, sensor modules, expansion boards, and debugging tools that enable rapid prototyping and system integration. As core enablers for embedded system development, IoT prototyping, and industrial automation, these accessories significantly reduce development time while improving hardware compatibility and measurement accuracy.

2. Main Types and Functional Classification

TypeFunctional FeaturesApplication Examples
Interface CablesHigh-speed data transfer, hot-plugging supportUSB-UART converters, HDMI breakout cables
Power ModulesRegulated voltage output, battery managementLipo battery packs, DC-DC converters
Sensor ModulesDigital/analog signal acquisition, calibration-freeTemperature/humidity sensors, IMUs
Expansion BoardsPeripheral interface extension, protocol conversionMotor drivers, LoRaWAN shields
Debugging ToolsReal-time tracing, voltage measurementJTAG probes, logic analyzers

3. Structure and Composition

Typical accessories feature: - Hardware Shell: Flame-retardant ABS or CNC-machined aluminum for mechanical protection - Interface Circuits: Level shifters and ESD protection components - Communication Modules: SPI/I2C/UART protocol converters - Power Conditioning: Voltage regulators and current limiting circuits - Mechanical Components: Mounting brackets and anti-vibration pads

4. Key Technical Specifications

ParameterDescription
Interface CompatibilitySupports USB 3.0, SPI up to 10MHz, I2C 400kHz
Power Handling1.8V-24V input range, 5A max current
Signal Integrity12-bit ADC resolution (0.01% error), 1ns jitter
Environmental RatingOperating temp: -40 C to +85 C, IP54 dust/water resistance
EMC ComplianceFCC Part 15 Class B, CE EN55032

5. Application Fields

  • IoT Development: Smart home sensor nodes
  • Industrial Automation: PLC expansion modules
  • Consumer Electronics: Prototype gaming controllers
  • Education: Robotics training platforms
  • Medical Devices: Portable diagnostic equipment

6. Leading Manufacturers and Products

ManufacturerRepresentative Products
ArduinoArduino MKR Shield, Nano I/O Breakout
Raspberry PiPico W Expansion Board, HAT+ Prototyping
STMicroelectronicsST-Link/V2 Debugger, X-NUCLEO Expansion
Texas InstrumentsLaunchPad SensorHub, BoosterPack MKII

7. Selection Guide

Key considerations: - Project requirements: Match sensor types and communication protocols - Compatibility: Verify voltage levels and physical dimensions - Expandability: Check available GPIO and bus interfaces - Cost-effectiveness: Balance performance vs. budget - Environmental factors: Temperature range and vibration resistance - Support ecosystem: Availability of libraries and community resources

8. Industry Trends

Emerging trends include: - Wireless integration (Bluetooth/WiFi 6 modules) - AI-enabled sensor fusion algorithms - Modular system-in-package (SiP) designs - Open-source hardware standardization - Energy-harvesting power solutions - Increased adoption of 2.54mm standardization

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