| Image | Part Number | Description / PDF | Quantity | Rfq |
|---|---|---|---|---|
 |
NXP Semiconductors |
PMC CARD ATM QUAD OC3 |
0 |
|
|
NXP Semiconductors |
ADAPTER TARGET HEAD |
0 |
|
|
NXP Semiconductors |
HARDWARE CSIC-32-QFP SOCKET |
0 |
|
|
NXP Semiconductors |
TARGET CBL FLEX C MMEVS/MMDS-MCU |
0 |
|
|
NXP Semiconductors |
ADAPTER TARGET HEAD 4-QFN |
0 |
|
|
NXP Semiconductors |
TARGET HEAD ADAPTER 52-PIN |
0 |
|
|
NXP Semiconductors |
ADAPTER CBL 16-DIP TO 16-TSSOP |
0 |
|
|
NXP Semiconductors |
ADAPTER TARGET HEAD |
0 |
|
|
NXP Semiconductors |
HARDWARE CSIC 32-QFP |
0 |
|
|
NXP Semiconductors |
BUS ANALYZER CABLE |
0 |
|
|
NXP Semiconductors |
ADAPTER TARGET HEAD |
0 |
|
|
NXP Semiconductors |
HARDWARE CSIC 44-QFP |
0 |
|
|
NXP Semiconductors |
ADAPTER TARGET HEAD 44-QFP |
0 |
|
|
NXP Semiconductors |
TARGET HEAD ADAPTER JL32 |
0 |
|
|
NXP Semiconductors |
DAUGHTER CARD FOR DEMO9S08QB8 |
0 |
|
|
NXP Semiconductors |
4-PORT ENET SW CARD 100MBPS |
0 |
|
|
NXP Semiconductors |
ADAPTER CBL 16-DIP TO 16-SOIC |
0 |
|
|
NXP Semiconductors |
KIT ETHERNET TAP PROBE TIP DPI |
0 |
|
|
NXP Semiconductors |
BOARD ADAPTER FOR MPC55XX |
0 |
|
|
NXP Semiconductors |
DISPLAY QVGA TFT |
0 |
|
Development board accessories are essential components that extend the functionality of microcontroller/processor development platforms. These accessories include interface cables, power modules, sensor modules, expansion boards, and debugging tools that enable rapid prototyping and system integration. As core enablers for embedded system development, IoT prototyping, and industrial automation, these accessories significantly reduce development time while improving hardware compatibility and measurement accuracy.
| Type | Functional Features | Application Examples |
|---|---|---|
| Interface Cables | High-speed data transfer, hot-plugging support | USB-UART converters, HDMI breakout cables |
| Power Modules | Regulated voltage output, battery management | Lipo battery packs, DC-DC converters |
| Sensor Modules | Digital/analog signal acquisition, calibration-free | Temperature/humidity sensors, IMUs |
| Expansion Boards | Peripheral interface extension, protocol conversion | Motor drivers, LoRaWAN shields |
| Debugging Tools | Real-time tracing, voltage measurement | JTAG probes, logic analyzers |
Typical accessories feature: - Hardware Shell: Flame-retardant ABS or CNC-machined aluminum for mechanical protection - Interface Circuits: Level shifters and ESD protection components - Communication Modules: SPI/I2C/UART protocol converters - Power Conditioning: Voltage regulators and current limiting circuits - Mechanical Components: Mounting brackets and anti-vibration pads
| Parameter | Description |
|---|---|
| Interface Compatibility | Supports USB 3.0, SPI up to 10MHz, I2C 400kHz |
| Power Handling | 1.8V-24V input range, 5A max current |
| Signal Integrity | 12-bit ADC resolution (0.01% error), 1ns jitter |
| Environmental Rating | Operating temp: -40 C to +85 C, IP54 dust/water resistance |
| EMC Compliance | FCC Part 15 Class B, CE EN55032 |
| Manufacturer | Representative Products |
|---|---|
| Arduino | Arduino MKR Shield, Nano I/O Breakout |
| Raspberry Pi | Pico W Expansion Board, HAT+ Prototyping |
| STMicroelectronics | ST-Link/V2 Debugger, X-NUCLEO Expansion |
| Texas Instruments | LaunchPad SensorHub, BoosterPack MKII |
Key considerations: - Project requirements: Match sensor types and communication protocols - Compatibility: Verify voltage levels and physical dimensions - Expandability: Check available GPIO and bus interfaces - Cost-effectiveness: Balance performance vs. budget - Environmental factors: Temperature range and vibration resistance - Support ecosystem: Availability of libraries and community resources
Emerging trends include: - Wireless integration (Bluetooth/WiFi 6 modules) - AI-enabled sensor fusion algorithms - Modular system-in-package (SiP) designs - Open-source hardware standardization - Energy-harvesting power solutions - Increased adoption of 2.54mm standardization